Abstract: A clamping fixture includes a body, a connector, a first clasp, at least one first elastic member and a lock. The connector is movable relative to the body along a first direction. The first clasp includes a first fastener and is disposed at one end of the connector. The at least one first elastic member is configured to apply force to the body and the connector along the first direction. The lock includes a second fastener. The first clasp and the lock are coupled through the first fastener and the second fastener.

Abstract: A light-emitting diode (LED) device and a manufacturing method thereof are provided. The LED device includes a frame body, a first conductive extension structure, a second conductive extension structure, and a LED chip. The frame body includes an upper surface, a bottom, a recess on the opposite side of the bottom, and a first side surface and a second side surface opposite to each other. The first and second conductive extension structures are located in the frame body. The first and second conductive extension structures extend from the first side surface to the second side surface of the frame body. The frame body encapsulates a left side surface, a right side surface, a top surface, and a bottom surface of each of the first and second conductive extension structures. The LED chip is disposed in the recess and includes a first conductive pad and a second conductive pad.

Abstract: A method of creating and sharing a streaming video to other devices by an electronic device, which comprises a first camera and a second camera, is disclosed. A voice signal collected by the electronic device is encoded into digital audio data. The first camera captures first still images and the second camera captures second still images simultaneously. The first still images and/or the second still images are cropped and combined to generate combined images. The combined images are encoded into encoded images with a predetermined format. A streaming video is obtained by mixing the encoded images with the digital audio data and transmitted to other remote devices.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: A sliding variable resistor includes a sliding base, a first supporting pole, two buffering members, a substrate, a casing assembly, an anchoring plate, a driving member, a driven member, a belt, and a belt guard. The sliding base includes two first through hole and at least one variable resistor sheet. The first supporting pole is inserted into the two first through hole. The first supporting pole has its two ends abut against the first buffering seats, respectively. The substrate is engaged with the two buffering members. The two buffering members are arranged in the casing assembly. The anchoring plate is fixedly arranged on the casing assembly. The belt is engaged with the driving member and the driven member, respectively. The belt guard is fastened to the sliding base, and is engaged with the belt. As such, the sliding base, while sliding, can have an improved smoothness.

Abstract: A light emitting module including a light emitting device package structure and a heat dissipation structure is provided. The light emitting device package structure includes light emitting devices, a patterned reflective element and a patterned conductive layer. The patterned reflective element is disposed around side surfaces of the light emitting devices and exposes a first bottom surface of a first pad and a second bottom surface of a second pad. The patterned conductive layer is disposed on the first bottom surface of the first pad and the second bottom surface of the second pad. The light emitting devices are electrically connected to each other in a series connection, a parallel connection or a series-parallel connection through the patterned conductive layer. The heat dissipation structure is disposed below the light emitting device package structure and includes a heat dissipation unit and a patterned circuit layer disposed on the heat dissipation unit.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.

Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.

Abstract: An elevator automatic guide assistant system comprises a user assistant system, an elevator outside assistant system, and an elevator inside assistant system. The user assistant system is configured to send a taking elevator instruction and target floor information to the elevator outside assistant system, receive and send the feedback information to a user. The elevator outside assistant system is configured to guide the user to arrive at an elevator doorway. The elevator inside assistant system is configured to send floor information to the elevator outside assistant system and the user assistant system, receive instructions from the user assistant system, and guide the user to arrive at the target floor. The present disclosure relates also to a guide method of the elevator automatic guide assistant system.

Abstract: A manufacturing method of a semiconductor light-emitting device is provided. Steps of the manufacturing method includes: providing a substrate; placing at least one light-emitting unit on the substrate; encapsulating the at least one light-emitting unit onto the substrate by a phosphor layer and a reflective layer. The phosphor layer at least covers an upper surface of the at least one light-emitting unit, and the reflective layer surrounds the at least one light-emitting unit.

Abstract: A light emitting device includes a light source, a light source carrier and a circuit board. The circuit board is configured to provide power to the light source via the light source carrier. The circuit board includes a metal substrate having an upper surface, the upper surface including a first electrode area, a second electrode area and a heat conduction area; a first metal electrode formed on the first electrode area; a first insulation layer formed between the first metal electrode and the metal substrate; a second metal electrode formed on the second electrode area; a second insulation layer formed between the second metal electrode and the metal substrate; and a solder resist layer covering the upper surface of the metal substrate; wherein the heat conduction area is exposed from the solder resist layer, and the heat conduction area is connected to the light source carrier.

Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and comprising an encircling portion and a plurality of upper pads arranged separately, wherein the encircling portion surrounds the upper pads to form a trench between the encircling portion and the upper pads, and a second metal layer disposed on the second surface and comprising a plurality of bottom pads arranged separately, wherein the bottom pads are electrically connected to the upper pads via the through holes respectively. The through holes are positioned under the upper pads and the encircling portion of the first metal layer is electrically floating.

Abstract: An automatic guiding system for analyzing pavement curvature in or on an autonomous mobile device comprises an image acquisition module, a pavement curvature analysis module, a posture sensing module, and a pavement curvature database. The image acquisition module collects pavement curvature images as the autonomous mobile device moves. The pavement curvature analysis module processes the pavement curvature images, and extracts contour information of the pavement curvature images. The posture sensing module continuously senses the posture of the autonomous mobile device. The pavement curvature database is configured to stores the contour information and the posture.

Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.

Abstract: A method includes forming a first dielectric layer over a wafer, etching the first dielectric layer to form an opening, filling a tungsten-containing material into the opening, and performing a Chemical Mechanical Polish (CMP) on the wafer. After the CMP, a cleaning is performed on the wafer using a weak base solution.

Abstract: A light emitting device package structure and a manufacturing method thereof are provided. The light emitting device package structure includes a light emitting device and a protecting element. The light emitting device has an upper surface and a lower surface opposite to each other, a side surface connecting the upper surface and the lower surface and a first electrode pad and a second electrode pad located on the lower surface and separated from each other. The protecting element encapsulates the side surface of the light emitting device and exposes at least portion of the upper surface, at least portion of a first bottom surface of the first electrode pad and at least portion of a second bottom surface of the second electrode pad.

Abstract: An automatic guiding system for analyzing ground texture in or on an autonomous mobile device comprises an image acquisition module, a ground texture analysis module, a posture sensing module, and a ground texture database. The image acquisition module collects ground images as the autonomous mobile device moves. The ground texture analysis module processes the ground images, and extracts texture information of the ground images. The posture sensing module continuously senses the posture of the autonomous mobile device. The ground texture database is configured to stores the texture information and the posture.

Abstract: A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series.

Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.