Patents by Inventor Hao CHUNG

Hao CHUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AUTOMATIC GUIDING SYSTEM FOR ANALYZING GROUND TEXTURE AND METHOD FOR THE SAME
    Publication number: 20170213352
    Abstract: An automatic guiding system for analyzing ground texture in or on an autonomous mobile device comprises an image acquisition module, a ground texture analysis module, a posture sensing module, and a ground texture database. The image acquisition module collects ground images as the autonomous mobile device moves. The ground texture analysis module processes the ground images, and extracts texture information of the ground images. The posture sensing module continuously senses the posture of the autonomous mobile device. The ground texture database is configured to stores the texture information and the posture.
    Type: Application
    Filed: June 24, 2016
    Publication date: July 27, 2017
    Inventors: TIEN-PING LIU, HORNG-JUING LEE, I-HAO CHUNG
  • AUTOMATIC GUIDING SYSTEM FOR ANALYZING PAVEMENT CURVATURE AND METHOD FOR THE SAME
    Publication number: 20170212522
    Abstract: An automatic guiding system for analyzing pavement curvature in or on an autonomous mobile device comprises an image acquisition module, a pavement curvature analysis module, a posture sensing module, and a pavement curvature database. The image acquisition module collects pavement curvature images as the autonomous mobile device moves. The pavement curvature analysis module processes the pavement curvature images, and extracts contour information of the pavement curvature images. The posture sensing module continuously senses the posture of the autonomous mobile device. The pavement curvature database is configured to stores the contour information and the posture.
    Type: Application
    Filed: June 24, 2016
    Publication date: July 27, 2017
    Inventors: I-HAO CHUNG, TIEN-PING LIU, SHU-FEN CHEN, YU-CHIEN HSIAO, YU-TAI HUNG, FU-HSIUNG YANG
  • COMPUTER VISION POSITIONING SYSTEM AND METHOD FOR THE SAME
    Publication number: 20170212520
    Abstract: A computer vision positioning system for a computer-controlled autonomous mobile transportation device in a warehouse for example comprises an image collection module, an artificial marker identification module, a two-dimensional code identification module, a data storage module, and a control module. The image collection module collects images, and transmits the images to the artificial marker identification module and the two-dimensional code identification module. The artificial marker identification module reads an ID of the artificial marker. The two-dimensional code identification module reads a URL of the artificial marker. The data storage module stores a map, a map description file, and location and object-disposal information. The control module controls a autonomous mobile device to move and make a disposal.
    Type: Application
    Filed: June 24, 2016
    Publication date: July 27, 2017
    Inventors: TIEN-PING LIU, HORNG-JUING LEE, I-HAO CHUNG
  • ELEVATOR AUTOMATIC GUIDE ASSISTANT SYSTEM AND GUIDE METHOD
    Publication number: 20170183198
    Abstract: An elevator automatic guide assistant system comprises a user assistant system, an elevator outside assistant system, and an elevator inside assistant system. The user assistant system is configured to send a taking elevator instruction and target floor information to the elevator outside assistant system, receive and send the feedback information to a user. The elevator outside assistant system is configured to guide the user to arrive at an elevator doorway. The elevator inside assistant system is configured to send floor information to the elevator outside assistant system and the user assistant system, receive instructions from the user assistant system, and guide the user to arrive at the target floor. The present disclosure relates also to a guide method of the elevator automatic guide assistant system.
    Type: Application
    Filed: October 16, 2016
    Publication date: June 29, 2017
    Inventors: HORNG-JUING LEE, TIEN-PING LIU, I-HAO CHUNG
  • Method of growing a high quality III-V compound layer on a silicon substrate
    Patent number: 9691855
    Abstract: The present disclosure involves a method of fabricating a semiconductor device. A surface of a silicon wafer is cleaned. A first buffer layer is then epitaxially grown on the silicon wafer. The first buffer layer contains an aluminum nitride (AlN) material. A second buffer layer is then epitaxially grown on the first buffer layer. The second buffer layer includes a plurality of aluminum gallium nitride (AlxGa1-xN) sub-layers. Each of the sub-layers has a respective value for x that is between 0 and 1. A value of x for each sub-layer is a function of its position within the second buffer layer. A first gallium nitride (GaN) layer is epitaxially grown over the second buffer layer. A third buffer layer is then epitaxially grown over the first GaN layer. A second GaN layer is then epitaxially grown over the third buffer layer.
    Type: Grant
    Filed: February 17, 2012
    Date of Patent: June 27, 2017
    Assignee: Epistar Corporation
    Inventors: Zhen-Yu Li, Hsing-Kuo Hsia, Hao-Chung Kuo
  • Package method and package
    Patent number: 9685596
    Abstract: A package method includes steps of providing a light emitting module, a mold and a molding compound, wherein the light emitting module includes a substrate and at least one light emitting unit disposed on the substrate, the mold has at least one recess, and a side wall of the recess is parallel to a side surface of the light emitting unit; filling the recess with the molding compound; placing the substrate on the mold reversely, so that the light emitting unit is immersed into the recess and the molding compound directly encapsulates the light emitting unit; and heating and pressing the substrate and the mold, so as to solidify the molding compound.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: June 20, 2017
    Assignee: GENESIS PHOTONICS INC.
    Inventors: Chin-Hua Hung, Hao-Chung Lee, Yu-Feng Lin
  • Semiconductor light emitting device
    Patent number: 9673352
    Abstract: A light emitting device is provided. The light emitting device includes a substrate, an N type semiconductor layer formed on the substrate, an active layer, an electron-blocking layer, and a P type semiconductor layer formed on the electron-blocking layer. An N side electrode is formed on a first portion of the N type semiconductor layer, and the active layer is formed on a second portion of the N type semiconductor layer. The electron-blocking layer is a super lattice multi-layer structure formed on the active layer, the P type semiconductor layer is formed on the electron-blocking layer, and a P side electrode is formed on a portion of the P type semiconductor layer.
    Type: Grant
    Filed: April 30, 2015
    Date of Patent: June 6, 2017
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Chun-Yen Chang, Zhen-Yu Li, Hao-Chung Kuo
  • High electron mobility transistor
    Patent number: 9660066
    Abstract: A high electron mobility transistor is provided, which includes a substrate, a superlattice structure formed on the substrate, and a transistor epitaxial structure formed on the superlattice structure such that the superlattice structure is interposed between the substrate and the transistor epitaxial layer. As the high electron mobility transistor has the carbon-doped AlN/GaN superlattice structure between the substrate and the transistor epitaxial layer. Thus, the present invention can effectively reduce vertical leakage current, so as to improve the epitaxial quality and the breakdown voltage of the high electron mobility transistor.
    Type: Grant
    Filed: October 1, 2015
    Date of Patent: May 23, 2017
    Inventors: Zhen-Yu Li, An-Jye Tzou, Hao-Chung Kuo, Chunyen Chang
  • Clamper and device using the same
    Patent number: 9581180
    Abstract: A clamper includes a base, a movable element, a sliding element, a connecting bar, a clamping element and a first elastic element. The movable element is movable in a first direction relative to the base. The sliding element is movable in a second direction relative to the base. The connecting bar connects the movable element and the sliding element. The clamping element sets on the sliding element. The first elastic element includes a terminal setting on the sliding element.
    Type: Grant
    Filed: April 21, 2015
    Date of Patent: February 28, 2017
    Assignee: ABILITY ENTERPRISE CO., LTD.
    Inventors: Hao-Chung Lien, Hsien-Ming Lee, Yu-Fang Lin
  • PACKAGE STRUCTURE OF A LIGHT-EMITTING DEVICE
    Publication number: 20170040262
    Abstract: A light-emitting device packaging structure is provided. The light-emitting device packaging structure includes a substrate, an array of light-emitting devices, an encapsulating layer, scattering particles, and a fluorescent material layer. The array of light-emitting devices is on the substrate. The encapsulating layer covers the array of light-emitting devices. The scattering particles are dispersed in the encapsulating layer. The fluorescent material layer is on the encapsulating layer.
    Type: Application
    Filed: January 19, 2016
    Publication date: February 9, 2017
    Inventors: Chien-Chung Lin, Hao-Chung Kuo, Chin-Wei Sher, Hau-Vei Han, Kuo-Ju Chen, Zong-Yi Tu, Hsien-Hao Tu
  • LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    Publication number: 20170005238
    Abstract: A light emitting device includes a wavelength conversion layer, at least one light emitting unit and a reflective protecting element. The wavelength conversion layer has an upper surface and a lower surface opposite to each other. The light emitting unit has two electrode pads located on the same side of the light emitting unit. The light emitting unit is disposed on the upper surface of the wavelength conversion layer and exposes the two electrode pads. The reflective protecting element encapsulates at least a portion of the light emitting unit and a portion of the wavelength conversion layer, and exposes the two electrode pads of the light emitting unit.
    Type: Application
    Filed: September 19, 2016
    Publication date: January 5, 2017
    Applicant: Genesis Photonics Inc.
    Inventors: Cheng-Wei Hung, Chin-Hua Hung, Long-Chi Du, Jui-Fu Chang, Po-Tsun Kuo, Hao-Chung Lee, Yu-Feng Lin
  • OPTICAL SHEET, METHOD FOR MANUFACTURING THE SAME, LIGHT EMITTING DIODES MODULE AND DISPLAY USING THE SAME
    Publication number: 20160369953
    Abstract: An optical sheet is disclosed in the present invention and comprises a substrate, a reflective layer and a plurality of pixels. The reflective layer is disposed on the substrate. The pixels are composed of several quantum dot fluorescent powders respectively and arrayed on the reflective layer. In addition, a method for manufacturing the above optical sheet, a light emitting diodes module and a display using the above optical sheet are also disclosed in the present invention.
    Type: Application
    Filed: November 17, 2015
    Publication date: December 22, 2016
    Inventors: Chien-Chung LIN, Hao-Chung KUO, Kuo-Ju CHEN, Hau-Vei HAN
  • METHOD OF MAKING A SEMICONDUCTOR DEVICE
    Publication number: 20160365477
    Abstract: A method of making a semiconductor device includes: (a) providing a semiconductor substrate that is made from a material containing an element of boron group; (b) forming on the semiconductor substrate a buffer structure that includes an aluminum nitride buffer film formed using a physical vapor deposition technique; and (c) forming on the buffer structure a semiconductor unit that includes a GaN-based epitaxial layer, the GaN-based epitaxial layer having a hexagonal crystal structure and being formed using a chemical vapor deposition technique.
    Type: Application
    Filed: May 24, 2016
    Publication date: December 15, 2016
    Inventors: Chun-Yen CHANG, Chen-Yu LI, Hao-Chung KUO
  • LIGHTING DEVICE
    Publication number: 20160365337
    Abstract: A lighting device includes a plurality of light-emitting diodes including a first light-emitting diode with a non-rectangular shape in a top view, a submount to which each of the plurality of light-emitting diodes is coupled, and a plurality of conductive elements formed between the submount and the plurality of light-emitting diodes to electrically connecting at least a portion of the plurality of light-emitting diodes with each other in series.
    Type: Application
    Filed: August 29, 2016
    Publication date: December 15, 2016
    Inventors: Kuan-Chun CHEN, Hao-Chung KUO, You-Da LIN, Zhen-Yu LI
  • SEMICONDUCTOR LIGHT EMITTING DEVICE
    Publication number: 20160322533
    Abstract: A light emitting device is provided. The light emitting device includes a substrate, an N type semiconductor layer formed on the substrate, an active layer, an electron-blocking layer, and a P type semiconductor layer formed on the electron-blocking layer. An N side electrode is formed on a first portion of the N type semiconductor layer, and the active layer is formed on a second portion of the N type semiconductor layer. The electron-blocking layer is a super lattice multi-layer structure formed on the active layer, the P type semiconductor layer is formed on the electron-blocking layer, and a P side electrode is formed on a portion of the P type semiconductor layer.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 3, 2016
    Inventors: Chun-Yen Chang, Zhen-Yu Li, Hao-Chung Kuo
  • LIGHT-EMITTING DIODE (LED) PACKAGE
    Publication number: 20160293806
    Abstract: A light-emitting diode (LED) package including a rectangular carrier, an LED chip, and an encapsulant is provided. The rectangular carrier has an upper surface. The LED chip is mounted on the upper surface and is electrically connected to the rectangular carrier. The encapsulant has a curved convex surface and covers the entire upper surface and the LED chip. The encapsulant is doped with a phosphor material for converting at least parts of light emitted from the LED chip. The encapsulant doped with the phosphor material is visually neon orange when the LED chip does not emit the light.
    Type: Application
    Filed: April 1, 2016
    Publication date: October 6, 2016
    Inventors: Hao-Chung Lee, Yu-Feng Lin
  • PACKAGE SUBSTRATE AND PACKAGE STRUCTURE USING THE SAME
    Publication number: 20160284666
    Abstract: A package substrate is provided. The package substrate includes a base layer having a first surface and a second surface opposite to the first surface, a plurality of through holes penetrating the base layer, a first metal layer disposed on the first surface, and a second metal layer disposed on the second surface. The first metal layer includes a closed-loop trench. A part of the second metal layer is electrically connected to the first metal layer via the through holes. The through holes are positioned at an inner part the closed-loop trench.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 29, 2016
    Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
  • SEMICONDUCTOR LIGHT-EMITTING DEVICE AND THE MANUFACTURING METHOD THEREOF
    Publication number: 20160276320
    Abstract: A semiconductor light-emitting device that includes a substrate, at least one light-emitting unit arranged on the substrate, a phosphor layer at least covering an upper surface of the at least one light-emitting unit, and a reflective layer arranged on the substrate is provided. The reflective layer surrounds the at least one light-emitting unit. A manufacturing method of a semiconductor light-emitting device is also provided.
    Type: Application
    Filed: March 18, 2016
    Publication date: September 22, 2016
    Inventors: Chin-Hua Hung, Yu-Feng Lin, Cheng-Wei Hung, Hao-Chung Lee, Xun-Xain Zhan
  • Light emitting diode package substrate
    Patent number: D772181
    Type: Grant
    Filed: April 2, 2015
    Date of Patent: November 22, 2016
    Assignee: Genesis Photonics Inc.
    Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan
  • Light emitting diode package substrate
    Patent number: D790487
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: June 27, 2017
    Assignee: Genesis Photonics Inc.
    Inventors: Hao-Chung Lee, Yu-Feng Lin, Xun-Xain Zhan