Patents by Inventor Hisashi Kato

Hisashi Kato has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200076263
    Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Publication number: 20200075224
    Abstract: A planar transfoinier includes a flexible insulating substrate having a pair of short sides, a pair of long sides, a first surface, and a second surface on an opposite side with respect to the first surface, multiple coils formed side by side on the first surface and second surface of the flexible insulating substrate such that each of the coils has a spiral-shaped wiring, and multiple terminals formed on the flexible insulating substrate and connected to the coils respectively such that the terminals are positioned in a center portion of the flexible insulating substrate formed close to a center of the long sides of the flexible insulating substrate. The flexible insulating substrate has multiple bending portions formed such that the flexible insulating substrate is folded at the bending portions and stacks the coils one another.
    Type: Application
    Filed: August 29, 2019
    Publication date: March 5, 2020
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko MORITA, Hitoshi MIWA, Shinobu KATO, Toshihiko YOKOMAKU, Hisashi KATO, Takahisa HIRASAWA, Tetsuya MURAKI, Takayuki FURUNO
  • Patent number: 10553600
    Abstract: According to one embodiment, a semiconductor memory device includes a first conductive layer, a first semiconductor body, a second semiconductor body, a first memory layer, and a second memory layer. The first conductive layer includes first to fourth extension regions, and a first connection region. The first extension region extends in a first direction. The second extension region extends in the first direction and is arranged with the first extension region in the first direction. The third extension region extends in the first direction and is arranged with the first extension region in a second direction crossing the first direction. The fourth extension region extends in the first direction, is arranged with the third extension region in the first direction, and is arranged with the second extension region in the second direction.
    Type: Grant
    Filed: February 23, 2018
    Date of Patent: February 4, 2020
    Assignee: Toshiba Memory Corporation
    Inventors: Takuya Inatsuka, Tadashi Iguchi, Murato Kawai, Hisashi Kato, Megumi Ishiduki
  • Publication number: 20200025819
    Abstract: An inspection device is provided, which is capable of detecting a short circuit failure even when a connector is provided on a wiring board. The inspection device is configured to inspect a short circuit failure generated at any connected part of a plurality of pins 153 to a wiring board via solder. The plurality of pins 153 is included in a connector provided on the wiring board. The inspection device includes: a wiring 11 connected to certain pins 153 of the plurality of pins 153; a second wiring 12 connected to remaining pins 153 of the plurality of pins 153; and a tester unit connected to the first wiring 11 and to the second wiring 12 so as to inspect insulation between the certain pins 153 and the remaining pins 153.
    Type: Application
    Filed: July 15, 2019
    Publication date: January 23, 2020
    Applicant: TOYOTA JIDOSHA KABUSHIKI KAISHA
    Inventor: Hisashi KATO
  • Patent number: 10520456
    Abstract: Provided is a combustion experiment device, which includes a reaction tube into which a sample fluid flows and to which a temperature gradient in which a temperature rises toward a downstream side is imparted, and a burner part that is configured to flow a combustible gas along and around the reaction tube from the downstream side to an upstream side of the reaction tube and to maintain a flame surrounding the reaction tube from the outside in a radial direction of the reaction tube.
    Type: Grant
    Filed: November 9, 2016
    Date of Patent: December 31, 2019
    Assignees: TOHOKU UNIVERSITY, IHI CORPORATION
    Inventors: Takuya Tezuka, Hisashi Nakamura, Kaoru Maruta, Soichiro Kato, Shintaro Ito
  • Patent number: 10490729
    Abstract: The ultrasound probe includes a piezoelectric element including a piezoelectric composition and an electrode that applies a voltage to the piezoelectric composition. The piezoelectric composition has piezoelectric characteristics expressed by any coordinates included in a region formed by a polyhedron having a plurality of predetermined points as vertexes in Cartesian coordinates (keff, ?33S, Ec) including variables keff, ?33S and Ec.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: November 26, 2019
    Assignee: KONICA MINOLTA, INC.
    Inventors: Masashi Ozawa, Hisashi Minemoto, Junichi Kato, Koetsu Saito
  • Patent number: 10483124
    Abstract: According to one embodiment, a semiconductor device includes: a first stack above a substrate and including insulation layers and conductive layers alternately stacked in a first direction, the first stack including a staircase-shaped portion in an end portion of the first stack in a second direction parallel to a main face of the substrate, the staircase-shaped portion including steps and terraces corresponding to the conductive layers, at least a part of the steps having arc shape curved along a third direction crossing the second direction; and a second stack above the substrate and including first and second layers stacked in the first direction. In the second and/or third direction, a dimension of the first stack is larger than a dimension of the second stack.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: November 19, 2019
    Assignee: Toshiba Memory Corporation
    Inventors: Masakazu Sawano, Takahiro Tomimatsu, Junichi Shibata, Hideki Inokuma, Hisashi Kato, Kenta Yoshinaga
  • Patent number: 10480676
    Abstract: A valve includes a valve mechanism capable of switching a communication state between a first port and a second port of a body. A diaphragm is held between a valve plug and a holder member, at a central portion of the valve mechanism. An outer marginal portion of the diaphragm is held between the body and the bonnet. A pilot channel through which a communication chamber in the body and a pilot chamber in the bonnet communicate with each other is formed in the valve plug. A first hole communicating with the pilot channel is formed at a central portion of the diaphragm. Pressurized fluid in the communication chamber flows into the pilot chamber through the pilot channel and the first hole to thereby bias the valve plug toward a valve seat, by the pressure of the pressurized fluid in combination with an elastic force of a spring.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: November 19, 2019
    Assignee: SMC CORPORATION
    Inventors: Hisashi Komatsuzaki, Hisataka Kato, Motohiro Soutome
  • Publication number: 20190303076
    Abstract: A print processing system includes an image processing apparatus configured to execute print processing, and a client apparatus that includes a class driver configured to convert data as a target of the print processing into print data and to transmit a printing command for causing the image processing apparatus to execute the print processing by using a standard function to the image processing apparatus together with the print data, wherein the client apparatus includes an acquisition unit configured to acquire print setting information that specifies a print setting included in the image processing apparatus from the image processing apparatus via the class driver, a display unit configured to display a print setting screen based on the print setting information acquired by the acquisition unit, and a transmission unit configured to transmit the print setting information about a print setting selected by a user on the print setting screen.
    Type: Application
    Filed: March 19, 2019
    Publication date: October 3, 2019
    Inventor: Hisashi Kato
  • Publication number: 20190287903
    Abstract: A semiconductor memory device according to an embodiment includes a substrate; a plate-like first conductivity layer provided above the substrate and extending parallel to a substrate plane to bestride first and second regions; a plate-like second conductivity layer provided above the first conductivity layer to be separated from the first conductivity layer, an end portion of the first conductivity layer has a protruding staircase shape in the first region, the second conductivity layer extending parallel to the first conductivity layer to bestride the first and second regions; a first contact connected to the first conductivity layer at a side surface or a bottom surface of the first conductivity layer and extending from the first conductivity layer toward the substrate, the first contact being connected at a position where the end portion of the first conductivity layer in the first region protrudes, and a diameter size of a portion of the first contact connected at a side surface or a bottom surface of th
    Type: Application
    Filed: August 29, 2018
    Publication date: September 19, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Kenta Yoshinaga, Hideki Inokuma, Hisashi Kato, Masakazu Sawano
  • Patent number: 10388451
    Abstract: An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 ?m to 200 ?m and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: August 20, 2019
    Assignee: IBIDEN CO., LTD.
    Inventors: Yasuhiko Mano, Hiroaki Kodama, Hisashi Kato
  • Publication number: 20190249784
    Abstract: A valve is equipped with a displacement amount regulating mechanism (for example, flow rate control device). An abutment member of the displacement amount regulating mechanism protrudes inside a pilot chamber and faces an upper end surface of a valve main body portion of a valve element. When the valve element (the valve main body portion) is separated from a valve seat to bring the valve into an open state, the abutment member is brought into abutment on the upper end surface of the valve main body portion. This abutment regulates the displacement of the valve element.
    Type: Application
    Filed: February 12, 2019
    Publication date: August 15, 2019
    Applicant: SMC CORPORATION
    Inventors: Hisashi KOMATSUZAKI, Hisataka KATO, Motohiro SOUTOME
  • Publication number: 20190245401
    Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
    Type: Application
    Filed: February 8, 2019
    Publication date: August 8, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Publication number: 20190232235
    Abstract: A mixed gas supply device includes: a hydrogen gas generation unit that includes a hydrogen generator, the hydrogen generator generating hydrogen gas by decomposition of water and supplying the hydrogen gas; a nitrogen gas generation unit that includes a filter, the filter separating nitrogen gas from air and supplying the nitrogen gas; a gas mixing unit that mixes the supplied hydrogen gas and the supplied nitrogen gas and generates mix gas including the hydrogen gas and the nitrogen gas; and a single base on which the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit are mounted, the hydrogen gas generation unit, the nitrogen gas generation unit, and the gas mixing unit being integrated. The gas mixing unit supplies the generated mixed gas to outside.
    Type: Application
    Filed: April 12, 2019
    Publication date: August 1, 2019
    Inventors: Hidemi TAKAHASHI, Takeshi KATO, Yuichi DOKI, Hisashi ICHINOKIYAMA
  • Patent number: 10352893
    Abstract: A gas sensor control apparatus including a gas sensor element, a heater for heating the gas sensor element, and heater energization control means for feedback controlling the supply of electric current to the heater such that the internal resistance of the gas sensor element coincides with a target resistance. The gas sensor element has a solid electrolyte member and an electrode portion including an outside electrode and an inside electrode. At least a portion of the electrode portion is formed of an electrically conductive oxide whose main component is (i) a first perovskite phase which is represented by a composition formula of LaCo1?xNixO3±d (0.300?x?0.600, 0?d?0.4) and has a perovskite-type crystal structure, or (ii) a second perovskite phase which is represented by a composition formula of LaFe1?yNiyO3±d (0.450?y?0.700, 0?d?0.4) and has a perovskite-type crystal structure.
    Type: Grant
    Filed: August 29, 2016
    Date of Patent: July 16, 2019
    Assignee: NGK SPARK PLUG CO., LTD.
    Inventors: Keisuke Nakagawa, Shigehiro Ohtsuka, Hisashi Kozuka, Kazuma Ito, Ippei Kato
  • Publication number: 20190214268
    Abstract: According to one embodiment, a semiconductor device includes: a first stack above a substrate and including insulation layers and conductive layers alternately stacked in a first direction, the first stack including a staircase-shaped portion in an end portion of the first stack in a second direction parallel to a main face of the substrate, the staircase-shaped portion including steps and terraces corresponding to the conductive layers, at least a part of the steps having arc shape curved along a third direction crossing the second direction; and a second stack above the substrate and including first and second layers stacked in the first direction. In the second and/or third direction, a dimension of the first stack is larger than a dimension of the second stack.
    Type: Application
    Filed: September 10, 2018
    Publication date: July 11, 2019
    Applicant: Toshiba Memory Corporation
    Inventors: Masakazu SAWANO, Takahiro TOMIMATSU, Junichi SHIBATA, Hideki INOKUMA, Hisashi KATO, Kenta YOSHINAGA
  • Publication number: 20190182354
    Abstract: An information processing apparatus instructs a plurality of print plug-ins having at least a printer search function to search for a printer and displays, if the plurality of print plug-ins are instructed to perform the search, a first screen which includes (1) a printer detected by search processing performed by the plurality of print plug-ins instructed to perform the search and includes (2) an object for shifting to a second screen but does not include (3) a link to a download page of a print plug-in that is not installed, and displays, in response to an instruction given to the object in the first screen, the second screen which includes (3) the link to the download page of the print plug-in that is not installed.
    Type: Application
    Filed: February 19, 2019
    Publication date: June 13, 2019
    Inventor: Hisashi Kato
  • Patent number: 10297562
    Abstract: Provided is a semiconductor device that is resistant to the corrosion of titanium nitride forming an anti-reflection film. The semiconductor device includes: a wiring layer which includes a wiring film made of aluminum or an aluminum alloy and formed on a substrate and a titanium nitride film formed on the wiring film; a protection layer which covers a top surface and a side surface of the wiring layer; and a pad portion which penetrates the protection layer and the titanium nitride film, and which exposes the wiring film, the protection layer including a first silicon nitride film, an oxide film, and a second silicon nitride film which are layered in the stated order from the side of the wiring layer.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: May 21, 2019
    Assignee: ABLIC INC.
    Inventors: Kaku Igarashi, Shinjiro Kato, Hisashi Hasegawa, Masaru Akino, Yukihiro Imura
  • Publication number: 20190115130
    Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
    Type: Application
    Filed: October 16, 2018
    Publication date: April 18, 2019
    Applicant: IBIDEN CO., LTD.
    Inventors: Haruhiko Morita, Shinobu Kato, Hitoshi Miwa, Hisashi Kato, Toshihiko Yokomaku
  • Patent number: 10250719
    Abstract: An information processing apparatus instructs a plurality of print plug-ins having at least a printer search function to search for a printer and displays, if the plurality of print plug-ins are instructed to perform the search, a first screen which includes (1) a printer detected by search processing performed by the plurality of print plug-ins instructed to perform the search and includes (2) an object for shifting to a second screen but does not include (3) a link to a download page of a print plug-in that is not installed, and displays, in response to an instruction given to the object in the first screen, the second screen which includes (3) the link to the download page of the print plug-in that is not installed.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 2, 2019
    Assignee: CANON KABUSHIKI KAISHA
    Inventor: Hisashi Kato