Abstract: A sensor system can comprise a light source generating a light pulse that is collimated, and a plurality of optical elements. Each of the plurality of optical elements is configured to rotate independently about an axis that is substantially common, and the plurality of optical elements operate to collectively direct the light pulse to one or more objects in an angle of view of the sensor system. Furthermore, the sensor system can comprise a detector configured to receive, via the plurality of optical elements, at least a portion of photon energy of the light pulse that is reflected back from the one or more objects in the angle of view of the sensor system, and convert the received photon energy into at least one electrical signal.

Abstract: Hollow motor apparatuses and associated systems and methods for manufacturing hollow motor apparatuses may be provided. In one implementation, a hollow motor apparatus may include a rotor assembly rotatable about a rotation axis, a stator assembly positioned adjacent to, and coaxially with, the rotor assembly, and a bearing assembly configured to maintain a position of the rotor assembly relative to the stator assembly. The rotor assembly may include an inner portion disposed around an opening configured to receive and to rotate at least a portion of a payload. The bearing assembly may be disposed outside of the inner portion of the rotor assembly.

Abstract: Techniques for measuring defectivity using model-less scatterometry with cognitive machine learning are provided. In one aspect, a method for defectivity detection includes: capturing SEM images of defects from a plurality of training wafers; classifying type and density of the defects from the SEM images; making training scatterometry scans of a same location on the training wafers as the SEM images; training a machine learning model to correlate the training scatterometry scans with the type and density of the defects from the same location in the SEM images; making scatterometry scans of production wafers; and detecting defectivity in the production wafers by measuring the type and density of the defects in the production wafers using the machine learning model, as trained, and the scatterometry scans of the production wafers. A system for defectivity detection is also provided.

Abstract: A semiconductor interconnect structure and a method of fabricating the same are provided. The semiconductor interconnect structure includes a sea of interconnect lines including metal lines and neighboring dummy lines. The semiconductor interconnect structure further includes a dielectric layer arranged between the sea of lines.

Abstract: An electronic device with a fingerprint sensing function and a fingerprint image processing method are provided. The electronic device includes a processor, a fingerprint sensor, and a temperature sensor. The fingerprint sensor is coupled to the processor. The fingerprint sensor is configured to obtain a current fingerprint image. The temperature sensor is coupled to the processor. The temperature sensor is configured to obtain current temperature information. The processor obtains current background noise according to the current temperature information, and removes the background noise from the current fingerprint image to generate a corrected fingerprint image.

Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.

Abstract: A method of forming a semiconductor device includes forming a dielectric spacer along sidewalls of a plurality of interconnect openings extending through a sacrificial dielectric layer and a first dielectric layer until a top portion of a first conductive material, the dielectric spacer includes a dielectric material having a dielectric constant higher than a dielectric constant of the sacrificial dielectric layer and higher than a dielectric constant of the first dielectric layer, conformally depositing a barrier liner within the plurality of interconnect openings above and in direct contact with the dielectric spacer, filling the interconnect openings with a second conductive material, removing the sacrificial dielectric layer to expose portions of the dielectric spacer above the first dielectric layer, and reducing a thickness of exposed portions of the dielectric spacer.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A method for machine learning enhanced optical-based screening for in-line wafer testing includes receiving optical spectra data for a wafer-under-test by performing scatterometry on the wafer-under-test, performing predictive model screening by applying a predictive model based on the optical spectra data, determining whether a device associated with the wafer-under-test is defective based on the predictive model screening, and if the device is determined to be defective, dynamically modifying a yield map associated with the wafer-under-test, including reassigning at least one die.

Abstract: A driving device includes two rotor assemblies, a stator assembly, and a positioning assembly. Each rotor assembly includes a rotation axis and a rotor. The rotor includes a hollow chamber. The two rotor assemblies include a first rotor assembly and a second rotor assembly, a rotation axis of the first rotor assembly is parallel with a rotation axis of the second rotor assembly, a rotor of the first rotor assembly is at least partially embedded in a chamber of a rotor of the second rotor assembly. The stator assembly is surroundingly disposed at an outer side of the two rotor assemblies and drives a rotor. The rotor driven by the stator assembly causes another rotor of one of the first rotor assembly and the second rotor assembly to rotate. The positioning assembly is located outside of the rotors, and limits the rotors to rotate around corresponding fixed rotation axes.

Abstract: A method for manufacturing a semiconductor device includes forming a plurality of trenches in a dielectric layer, wherein the plurality of trenches each comprise a rounded surface, depositing a liner layer on the rounded surface of each of plurality of trenches, and depositing a conductive layer on the liner layer in each of the plurality of trenches, wherein the conductive layer and the liner layer form a plurality of interconnects, and each of the plurality of interconnects has a cylindrical shape.

Abstract: A method for manufacturing a semiconductor device includes forming a plurality of trenches in a dielectric layer, wherein the plurality of trenches each comprise a rounded surface, depositing a liner layer on the rounded surface of each of plurality of trenches, and depositing a conductive layer on the liner layer in each of the plurality of trenches, wherein the conductive layer and the liner layer form a plurality of interconnects, and each of the plurality of interconnects has a cylindrical shape.

Abstract: Hollow motor apparatuses and associated systems and methods for manufacturing the same are disclosed herein. In representative embodiment, a hollow motor apparatus includes a rotor assembly rotatable about a rotation axis, a stator assembly positioned adjacent to the rotor assembly and coaxially with the rotor assembly relative to the rotation axis, and a bearing assembly operably coupled to the rotor assembly. The rotor assembly has an inner portion around an opening configured to receive at least a portion of a payload. The bearing assembly is disposed outside the inner portion of the rotor assembly and is configured to maintain a position of the rotor assembly relative to the stator assembly.

Abstract: A laser-based measurement device includes a motor comprising a hollow shaft. The laser-based measurement device also includes a laser transmitter disposed in the hollow shaft. The laser-based measurement device also includes an optical device disposed at the motor. The motor is configured to drive the optical device to rotate. The optical device is configured to guide a laser beam transmitted by the laser transmitter out of the hollow shaft, or to guide the laser beam reflected by an external environment into the hollow shaft.

Abstract: A sensor system includes a light source, a plurality of optical elements, a controller, and a detector. The light source is configured to generate a series of light pulses at different time points. The optical elements rotate independently about rotation axes that are substantially aligned with each other. The controller is configured to control respective rotation of each of the plurality of optical elements, enabling the plurality of optical elements to collectively direct the series of light pulses toward different directions in an angle of view of the sensor system. The detector is configured to detect a plurality of target points in the angle of view. Each target point is detected based on receiving at least a portion of photon energy of a light pulse, from the series of light pulses, that is reflected back from one or more objects in the angle of view.

Abstract: A novel imaging system is provided for capturing imaging data. According to the disclosed embodiments, the imaging system comprises one or more cameras configured to capture the same scene within each camera's field of view. The imaging system also includes a plurality of bandpass filters that may be positioned in front of one or more cameras. Each bandpass filter may allow the transmission of incident electromagnetic signals between different pairs of first and second wavelengths. Accordingly, when the bandpass filters are positioned in front of the one or more cameras, each camera captures a different spectral image, i.e., containing only certain frequency components of the same scene being imaged in the cameras. The bandpass filters may be selectively aligned with one or more cameras by rotating and/or translating the filters relative to the cameras' positions in the imaging system.

Abstract: A method for manufacturing a semiconductor device includes forming a plurality of trenches in a dielectric layer, wherein the plurality of trenches each comprise a rounded surface, depositing a liner layer on the rounded surface of each of plurality of trenches, and depositing a conductive layer on the liner layer in each of the plurality of trenches, wherein the conductive layer and the liner layer form a plurality of interconnects, and each of the plurality of interconnects has a cylindrical shape.

Abstract: The present invention is a variable-ratio line gear mechanism. The mechanism forms a transmission pair consisting of a driving line gear and a driven line gear, of which axes intersect at an arbitrary angle. Transmission is generated by point contact meshing movement of line teeth between the driving line gear and the driven line gear. A contact curve of the line tooth is designed in accordance with space conjugate curve meshing theory, and the designing equation is divided into an equal transmission ratio part and a variable transmission ratio part. The equal transmission ratio part provides a uniform transmission, and the variable transmission ratio part makes the transmission ratio smoothly transit. The line gear mechanism is able to provide periodically transmission with variable transmission ratio, to provide a plurality of transmission ratios during a movement period of the driven line gear, and to enable smooth transitions between respective transmission ratios in accordance with movement rules.

Abstract: A semiconductor device includes a porous dielectric layer including a recessed portion, a conductive layer formed in the recessed portion, and a cap layer formed on the porous dielectric layer and on the conductive layer in the recessed portion, an upper surface of the porous dielectric layer being exposed through a gap in the cap layer.

Abstract: A method is presented forming a fully-aligned via (FAV) and airgaps within a semiconductor device. The method includes forming a plurality of copper (Cu) trenches within an insulating layer, forming a plurality of ILD regions over exposed portions of the insulating layer, selectively removing a first section of the ILD regions in an airgap region, and maintaining a second section of the ILD regions in a non-airgap region. The method further includes forming airgaps in the airgap region and forming a via in the non-airgap region contacting a Cu trench of the plurality of Cu trenches.