Abstract: A method for manufacturing a micromechanical component and a micromechanical component manufactured using this method are described, the micromechanical component having a first substrate, which in turn has at least one cavity and one printed conductor. At least a part of the printed conductor is applied to at least a part of the walls of the cavity. In particular, the floor of the cavity is considered part of the cavity walls.

Abstract: A micromechanical component includes a substrate and a cover layer deposited on the substrate, underneath the cover layer, a region of porous material being provided which mechanically supports and thermally insulates the cover layer. On the cover layer, a heating device is provided to heat the cover layer above the region; and above the region, a detector is provided to measure an electric property of a heated medium provided above the region on the cover layer.

Abstract: A micromechanical sensor, and a method for manufacturing a micromechanical sensor, featuring, in addition to a sensor element, at least a part of an evaluation circuit. In this context, the micromechanical sensor contains at least a first structural element made of a first material. The first structural element houses at least one sensor region and a part of an evaluation circuit, at least one sensor element being located in the sensor region. Moreover, at least one first and one second side are to be distinguished from one another in the first structural element. The first side of the first structural element features at least the sensor element, while the second side of the first structural element features at least a part of the evaluation circuit. At least parts of the sensor region and/or of the evaluation circuit are formed from the first material by micromechanical processing.

Abstract: A method for dicing semiconductor chips and a corresponding semiconductor chip system are described. The met-hod includes the steps: provision of a substrate having an upper substrate level, a middle substrate level and a lower substrate level; a plurality of empty spaces or porous areas being provided in the middle substrate level, the empty spaces or porous areas being enclosed by a substrate frame area; the empty spaces or porous areas being situated under a particular semiconductor chip area which is delimited by a semiconductor chip peripheral area in such a way that a particular substrate frame area is distanced from a vertical extension of the particular corresponding semiconductor peripheral area by a lateral intermediate space. In the case of the empty spaces, at least one substrate support element is provided to bond the lower substrate level to a particular semiconductor chip area in the upper substrate level.

Abstract: A device for supplying power to a tire-pressure sensor, containing a generator that is corotational with the tire and in which an electric voltage is generated by electromagnetic induction.

Abstract: A micromechanical apparatus, a pressure sensor, and a method, a closed cavity being provided beneath a membrane, the membrane having a greater thickness in a first membrane region than in a second membrane region.

Abstract: A method is proposed which will enable cavities having optically transparent walls to be produced simply and cost-effectively in a component by using standard methods of microsystems technology. For this purpose, a silicon region is first produced, which is surrounded on all sides by at least one optically transparent cladding layer. At least one opening is then produced in the cladding layer. Over this opening, the silicon surrounded by the cladding layer is dissolved out, forming a cavity within the cladding layer. In this context, the cladding layer acts as an etch barrier layer.

Abstract: A micromechanical component in which lateral deformations, i.e., deformations of the component parallel to its two main surfaces, are concentrated in a defined area of the component structure, making it possible to decouple lateral and vertical stresses in the component. The component structure includes at least one bellows-like structure in which lateral deformations of the component are concentrated. A pressure sensor having a micromechanical component of this type may be used, for example, for measured-value detection.

Abstract: A micromechanical pressure sensor which is made up of at least one first component element and a second component element bordering on the first component element. In this context, the first component element includes at least one diaphragm and one cavity. The cavity is arranged or structured so that the medium to be measured gains access to the diaphragm through the cavity. In addition, in the second component element an opening is provided which guides the medium to be measured to the cavity. At least a part of the cavity represents an extension, without a transition, of the opening in the second component.

Abstract: In a method for manufacturing a semiconductor component having a semiconductor substrate, a flat, porous diaphragm layer and a cavity underneath the porous diaphragm layer are produced to form unsupported structures for a component. In a first approach, the semiconductor substrate may receive a doping in the diaphragm region that is different from that of the cavity. This permits different pore sizes and/or porosities to be produced, which is used in producing the cavity for improved etching gas transport. Also, mesopores may be produced in the diaphragm region and nanopores may be produced as an auxiliary structure in what is to become the cavity region.

Abstract: A micromechanical component having a substrate and a diaphragm positioned on the substrate. Underneath the diaphragm a region made of porous material is provided, which mechanically supports the diaphragm and thermally insulates it.

Abstract: A micromechanical component having a substrate made from a substrate material having a first doping type, a micromechanical functional structure provided in the substrate and a cover layer to at least partially cover the micromechanical functional structure. The micromechanical functional structure has zones made from the substrate material having a second doping type, the zones being at least partially surrounded by a cavity, and the cover layer has a porous layer made from the substrate material.

Abstract: A receptacle is described for accommodating an analysis chip (40), which has openings (12a, 12b; 12c, 25) in housing (10) having access to analysis chip (40), which are protected from external influences by a movable protector (30), and which, for carrying out an analysis, is applied in a device which has a mechanism for opening the protector (30).

Abstract: A simple and cost-effective possibility is proposed for producing optically transparent regions (5, 6) in a silicon substrate (1), by the use of which both optically transparent regions of any thickness and optically transparent regions over a cavity in a silicon substrate are able to be implemented.

Abstract: The present invention relates in particular to a semiconductor component, such as especially a humidity sensor (200, 300, 400, 500, 600, 700, 800), which has a semiconductor substrate (101), like in particular of silicon, a first electrode (102) and a second electrode (202) and at least one first layer (101) that is accessible for a medium acting from the outside on the semiconductor component, the first layer being arranged at least partially between the first and the second electrode.

Abstract: Proposed is a method for manufacturing micromechanical sensors and sensors manufactured by this method, where openings (2) are introduced into a semiconductor substrate (1). After the openings (2) are introduced into the semiconductor substrate (1), a subsequent temperature treatment is carried out, in which the openings (2) are converted into voids in the depth of the substrate (1).

Abstract: A method for manufacturing a semiconductor component (100; . . . ; 700), a multilayer semiconductor component in particular, preferably a micromechanical component, such as a heat transfer sensor in particular having a semiconductor substrate (101), in particular made of silicon, and a sensor region (404).

Abstract: A sensor for measuring a force is provided, which sensor includes a first sealed volume, a second sealed volume, a pressure diaphragm and a force diaphragm. The pressure diaphragm has a first side and a second side, with a pressure of the first sealed volume acting on the first side, and a pressure of the second sealed volume acting on the second side. The force diaphragm is exposed to a force, and the pressure of the first volume is dependent on the force acting on the force diaphragm.

Abstract: A micromechanical component (10) in which lateral deformations, i.e., deformations of the component (10) parallel to its two main surfaces, are concentrated in a defined area of the component structure, making it possible to decouple lateral and vertical stresses in the component (10). The component structure includes at least one bellows-like structure (11) in which lateral deformations of the component (10) are concentrated.

Abstract: A micromechanical component is described which includes a substrate (1); a monocrystalline layer (10), which is provided above the substrate (1) and which has a membrane area (10a); a cavity (50) that is provided underneath the membrane area (10a); and one or more porous areas (150; 150′), which are provided inside the monocrystalline layer (10) and which have a doping (n+; p+) that is higher than that of the surrounding layer (10).