Abstract: One or more embodiments of techniques or systems for variation factor assignment for a device are provided herein. In some embodiments, a peripheral environment is determined for a device. A peripheral environment is a layout structure or an instance. When the peripheral environment is the layout structure, a variation factor is assigned to the device based on an architecture associated with the layout structure. When the peripheral environment is the instance, the variation factor is assigned to the device based on a bounding window created for the instance. In this manner, variation factor assignment is provided, such that a first device within a first block of a die has a different variation factor than a second device within a second block of the die, thus giving finer granularity to variation factor assignments.

Abstract: A semiconductor structure includes a first conductive path and a second conductive path configured to carry a first pair of differential signals representative of an in-phase signal. The semiconductor device further includes a third conductive path and a fourth conductive path configured to carry a second pair of differential signals representative of a quadrature signal corresponding to the in-phase signal. The first and second conductive paths are in a conductive layer of the semiconductor structure, and the third and fourth conductive paths are in another conductive layer of the semiconductor structure.

Abstract: An apparatus includes a first tier and a second tier. The second tier is above the first tier. The first tier includes a first cell. The second tier includes a second cell and a third cell. The third cell includes a first ILV to couple the first cell in the first tier to the second cell in the second tier. The third cell further includes a second ILV, the first ILV and the second ILV are extended along a first direction. The first tier further includes a fourth cell. The second tier further includes a fifth cell. The second ILV of the third cell is arranged to connect the fourth cell of the first tier with the fifth cell of the second tier. In some embodiments, the second tier further includes a spare cell including a spare ILV for ECO purpose.

Abstract: A method of generating masks for making an integrated circuit includes determining if a coupling capacitance value of a conductive path of a first and second groups of conductive paths of the integrated circuit is greater than a predetermined threshold value. The determination is performed based on at least a resistance-capacitance extraction result of the conductive path and a predetermined level of mask misalignment. The layout patterns are modified to increase an overall vertical distance between the first group of conductive paths and the second group of conductive paths if the coupling capacitance value is greater than the predetermined threshold value.

Abstract: A method comprises: receiving a circuit design comprising networks of first devices fabricated by a first fabrication process; selecting second devices to be fabricated by a second process; substituting the second devices for the first devices in the networks of the circuit design; sorting the second devices within a selected one of the networks by device area from largest device area to smallest device area; and assigning each second device in the selected network to be fabricated in a respective one of a plurality of tiers of a 3D IC for which a total area of second devices previously assigned to that tier is smallest, the second devices being assigned sequentially according to the sorting.

Abstract: A method of designing a semiconductor device is performed by at least one processor. In the method, a first environment temperature for a first substrate is determined based on an operational temperature of a second substrate, the first and second substrates stacked one upon another in the semiconductor device. An operation of at least one first circuit element in the first substrate is simulated based on the first environment temperature.

Abstract: A non-transitory, computer readable storage medium is encoded with computer program instructions, such that, when the computer program instructions are executed by a computer, the computer performs a method. The method generates mask assignment information for forming a plurality of patterns on a layer of an integrated circuit (IC) by multipatterning. The mask assignment information includes, for each of the plurality of patterns, a mask assignment identifying which of a plurality of masks is to be used to form that pattern, and a mask assignment lock state for that pattern. User inputs setting the mask assignment of at least one of the plurality of patterns, and its mask assignment lock state are received. A new mask assignment is generated for each of the plurality of patterns having an “unlocked” mask assignment lock state.

Abstract: A structure and method for cooling a three-dimensional integrated circuit (3DIC) are provided. A cooling element is configured for thermal connection to the 3DIC. The cooling element includes a plurality of individually controllable cooling modules disposed at a first plurality of locations relative to the 3DIC. Each of the cooling modules includes a cold pole and a heat sink. The cold pole is configured to absorb heat from the 3DIC. The heat sink is configured to dissipate the heat absorbed by the cold pole and is coupled to the cold pole via an N-type semiconductor element and via a P-type semiconductor element. A temperature sensing element includes a plurality of thermal monitoring elements disposed at a second plurality of locations relative to the 3DIC for measuring temperatures at the second plurality of locations. The measured temperatures control the plurality of cooling modules.

Abstract: A method comprises: receiving a circuit design comprising networks of first devices fabricated by a first fabrication process; selecting second devices to be fabricated by a second process; substituting the second devices for the first devices in the networks of the circuit design; sorting the second devices within a selected one of the networks by device area from largest device area to smallest device area; and assigning each second device in the selected network to be fabricated in a respective one of a plurality of tiers of a 3D IC for which a total area of second devices previously assigned to that tier is smallest, the second devices being assigned sequentially according to the sorting.

Abstract: The present disclosure relates to an apparatus and method to generate a device library, along with layout versus schematic (LVS) and parasitic extraction set-up files for connecting with official tools of a design window supported by a process design kit (PDK). The device library comprises passive devices which can be utilized at any point in an end-to-end design flow from pre-layout verification to post-layout verification of an integrated circuit design. The device library allows for a single schematic view for pre-layout verification but also post-layout verification, thus allowing for pole or pin comparison, and prevents double-counting of parasitic effects from passive design elements by directly instantiating a device from the device library for a verification step. An LVS and parasitic extraction graphical user interface (GUI) allows for incorporation of the generated device library into a pre-existing PDK without any modification to the PDK. Other devices and methods are also disclosed.

Abstract: A method of reducing parasitic mismatches comprises generating a first net list file from a first layout through a resistance-inductance-capacitance (RLC) extraction mechanism using a first simulation tool, performing a V/I test on a network through a second simulation tool, determining whether a mismatch exists based upon a result of the V/I test and modifying a connection trace of the network to generate a second layout.

Abstract: The present disclosure relates to an apparatus and method to generate a device library, along with layout versus schematic (LVS) and parasitic extraction set-up files for connecting with official tools of a design window supported by a process design kit (PDK). The device library comprises passive devices which can be utilized at any point in an end-to-end design flow from pre-layout verification to post-layout verification of an integrated circuit design. The device library allows for a single schematic view for pre-layout verification but also post-layout verification, thus allowing for pole or pin comparison, and prevents double-counting of parasitic effects from passive design elements by directly instantiating a device from the device library for a verification step. An LVS and parasitic extraction graphical user interface (GUI) allows for incorporation of the generated device library into a pre-existing PDK without any modification to the PDK. Other devices and methods are also disclosed.

Abstract: A method of generating, based on a first netlist of an integrated circuit, a second netlist includes generating layout geometry parameters for at least a portion of the first netlist of the integrated circuit, the portion including a first device. A third netlist is generated based on the first netlist and the layout geometry parameters. A description in the third netlist for modeling the first device is decomposed into a description in a fourth netlist for modeling a plurality of secondary devices. The second netlist is generated based on the fourth netlist.

Abstract: A method of generating a circuit layout of an integrated circuit includes generating layout geometry parameters for at least a predetermined portion of an original netlist of the integrated circuit. A consolidated netlist including information from the original netlist and the layout geometry parameters is generated. Then, the circuit layout is generated based on the consolidated netlist.

Abstract: A method of reducing parasitic mismatches comprises generating a first net list file from a first layout through a resistance-inductance-capacitance (RLC) extraction mechanism using a first simulation tool, performing a V/I test on a network through a second simulation tool, determining whether a mismatch exists based upon a result of the V/I test and modifying a connection trace of the network to generate a second layout.

Abstract: A method of generating masks for making an integrated circuit includes determining if a coupling capacitance value of a conductive path of a first and second groups of conductive paths of the integrated circuit is greater than a predetermined threshold value. The determination is performed based on at least a resistance-capacitance extraction result of the conductive path and a predetermined level of mask misalignment. The layout patterns are modified to increase an overall vertical distance between the first group of conductive paths and the second group of conductive paths if the coupling capacitance value is greater than the predetermined threshold value.

Abstract: The present disclosure provides a system and method of designing an integrated circuit. A plurality of devices are selected and properties assigned to each of the plurality of devices. These plural devices having assigned properties are then combined into a macro cell whereby a density gradient pattern is generated for the macro cell. Layout dependent effect (LDE) parameters are determined for the macro cell as a function of the combination of plural devices, and electrical performance characteristics for the macro cell are simulated. A layout distribution of the plurality of devices within the macro cell can then be determined as a function of one or more of the simulated electrical performance characteristics, determined LDE parameters, and generated density gradient pattern. A design layout of an integrated circuit can be generated corresponding to the layout distribution for the macro cell.

Abstract: Interposer and semiconductor package embodiments provide for the isolation and suppression of electronic noise such as EM emissions in the semiconductor package. The interposer includes shield structures in various embodiments, the shield structures blocking the electrical noise from the noise source, from other electrical signals or devices. The shields include solid structures and some embodiments and decoupling capacitors in other embodiments. The coupling structures includes multiple rows of solder balls included in strips that couple the components and surround and contain the source of electrical noise.

Abstract: A method includes extracting a first netlist from a first layout of a semiconductor circuit and estimating layout-dependent effect data based on the first netlist. A first simulation of the semiconductor circuit is performed based on the first netlist using an electronic design automation tool, and a second simulation of the semiconductor circuit is performed based on a circuit schematic using the electronic design automation tool. A weight and a sensitivity of the at least one layout-dependent effect are calculated, and the first layout of the semiconductor circuit is adjusted based on the weight and the sensitivity to provide a second layout of the semiconductor circuit. The second layout is stored in a non-transient storage medium.

Abstract: A method of generating a circuit layout of an integrated circuit includes generating layout geometry parameters for at least a predetermined portion of an original netlist of the integrated circuit. A consolidated netlist including information from the original netlist and the layout geometry parameters is generated. Then, the circuit layout is generated based on the consolidated netlist.