Abstract: A semiconductor device having an LDMOS transistor can include: a first deep well region having a first doping type; a drift region located in the first deep well region and having a second doping type; and a drain region located in the drift region and having the second doping type, where the second doping type is opposite to the first doping type, and where a doping concentration peak of the first deep well region is located below the drift region to optimize the breakdown voltage and the on-resistance of the LDMOS transistor.

Abstract: An isolated and purified lactic acid bacteria is provided, which is Lactobacillus paracasei PS23 (PS23) and its applications in delaying aging process, improving immunomodulatory activity, reducing, preventing or treating allergic and inflammation, preventing or treating a chronic disorder and/or (vi) preventing and/or treating a mood disorder or a neurological condition.

Abstract: Disclosed embodiments may include a power converter system with fault handling. Embodiments may include first and second power converters each including an output terminal and a control terminal, the first and second power converters to regulate voltage or current at their respective output terminals based on a voltage at their respective control terminals, the output terminals coupled to each other, and the control terminals coupled to each other; wherein the first power converter comprises: a circuit to detect a fault condition associated with the first power converter and to generate a first fault signal at the control terminal of the first power converter after the detecting the fault condition associated with the first power converter; wherein the second power converter comprises: a circuit to change an operating mode of the second power converter after generating the first fault signal at the control terminal of the first power converter.

Abstract: A semiconductor package includes a chip, a redistribution structure, and first under- ball metallurgies patterns. The chip includes conductive posts exposed at an active surface. The redistribution structure is disposed on the active surface. The redistribution structure includes a first dielectric layer, a topmost metallization layer, and a second dielectric layer. The first dielectric layer includes first openings exposing the conductive posts of the chip. The topmost metallization layer is disposed over the first dielectric layer and is electrically connected to the conductive posts. The topmost metallization layer comprises first contact pads and routing traces connected to the first contact pads. The second dielectric layer is disposed on the topmost metallization layer and includes second openings exposing the first contact pads. The first under-ball metallurgies patterns are disposed on the first contact pads, extending on and contacting sidewalls and top surfaces of the first contact pads.

Abstract: A semiconductor device including a substrate, a semiconductor package, a thermal conductive bonding layer, and a lid is provided. The semiconductor package is disposed on the substrate. The thermal conductive bonding layer is disposed on the semiconductor package. The lid is attached to the thermal conductive bonding layer and covers the semiconductor package to prevent coolant from contacting the semiconductor package.

Abstract: In an embodiment, a device includes: a first device including: an integrated circuit device having a first connector; a first photosensitive adhesive layer on the integrated circuit device; and a first conductive layer on the first connector, the first photosensitive adhesive layer surrounding the first conductive layer; a second device including: an interposer having a second connector; a second photosensitive adhesive layer on the interposer, the second photosensitive adhesive layer physically connected to the first photosensitive adhesive layer; and a second conductive layer on the second connector, the second photosensitive adhesive layer surrounding the second conductive layer; and a conductive connector bonding the first and second conductive layers, the conductive connector surrounded by an air gap.

Abstract: A heat exchanger includes a fin set formed by a plurality of fins stacked together and a refrigerant pipe set passing through the fin set. The fin set includes a connection member, and a first fin member and a second fin member connected to each other via the connection member. An included angle between the first fin member and the second fin member is larger than zero. The first fin member and the second fin member are arranged at two sides, respectively, of a notch of the fin set. The notch is located at an air input side and/or an air output side of the connection member.

Abstract: A package structure and a method of forming the same are provided. The package structure includes a die, an encapsulant and a RDL structure, the encapsulant encapsulate sidewalls of the die. The RDL structure is disposed on the die and the encapsulant. The RDL structure includes a first dielectric structure and a first redistribution layer. The first dielectric structure includes a first dielectric material layer and a second dielectric material layer on the first dielectric material layer. The first redistribution layer is embedded in the first dielectric structure and electrically connected to the die, the redistribution layer comprises a first seed layer and a first conductive layer disposed on the first seed layer. A topmost surface of the first seed layer and a topmost surface of the first conductive layer are substantially level with a top surface of the second dielectric material layer.

Abstract: A method for deep learning video microscopy-based antimicrobial susceptibility testing of a bacterial strain in a sample by acquiring image sequences of individual bacterial cells of the bacterial strain in a subject sample before, during, and after exposure to each antibiotic at different concentrations. The image sequences are compressed into static images while preserving essential phenotypic features. Data representing the static images are input into a pre-trained deep learning (DL) model which generates output data; and antimicrobial susceptibility for the bacterial strain is determined from the output data.

Abstract: A method for making a IC is provided, including: identifying, in a schematic, first and second edge elements, which edge elements including devices whose layout patterns are configured to conform to a first layout grid; identifying all the elements between the first and second edge elements, at least one of the identified elements including a device whose layout pattern is configured to conform to a second layout grid that is finer than the first layout grid; and calculating a spatial quantity of a combined layout pattern of the identified elements between the first and second edge elements to determine whether the combined layout pattern conforms to the first layout grid.

Abstract: A structure including a first semiconductor die and a second semiconductor die is provided. The first semiconductor die includes a first bonding structure. The first bonding structure includes a first dielectric layer and first conductors embedded in the first dielectric layer. The second semiconductor die includes a second bonding structure. The second bonding structure includes a second dielectric layer and second conductors embedded in the second dielectric layer. The first dielectric layer is in contact with the second dielectric layer, and the first conductors are in contact with the second conductors. Thermal conductivity of the first dielectric layer and the second dielectric layer is greater than thermal conductivity of silicon dioxide.

Abstract: A dimming assembly includes a first prism having a first surface and a second surface opposite to each other, and a second prism disposed on a side where the second surface of the first prism is located. The first surface includes first dimming portions, each of which includes two first side surfaces. Edges of the two first side surfaces away from the second surface intersect at a first intersection line. A surface of the second prism proximate to the second surface includes second dimming portions, each of which includes two second side surfaces. Edges of the two second side surfaces proximate to the second surface intersect at a second intersection line. A distance between orthographic projections of two adjacent first intersection lines on the second surface is less than a distance between orthographic projections of two adjacent second intersection lines on the second surface.

Abstract: A low numerical aperture fiber output diode laser module, which having several independent diode lasers, and collimated and converged the light beam, for the coupling the light to the core optical fiber with a core diameter of 105 um and a numerical aperture of 0.12. Compared with general products with a numerical aperture of 0.22, the light output angle is reduced to 55%, and use a general blue laser diode for verification. Use an optical software for facilitating the design and optimization of the parameters of the optical lens module.

Abstract: Among other things, the present disclosure provides oligonucleotides and compositions thereof. In some embodiments, provided oligonucleotides and compositions are useful for adenosine modification. In some embodiments, the present disclosure provides methods for treating various conditions, disorders or diseases that can benefit from adenosine modification.

Abstract: A display module is provided. The display module includes a main display panel, an auxiliary display panel and a backlight module which are laminated sequentially, at least one temperature sensing circuit in the auxiliary display panel, and a control circuit coupled to the at least one temperature sensing circuit. The temperature sensing circuit is configured to generate, based on temperature of the auxiliary display panel, a temperature signal related to the temperature, and the control circuit is configured to adjust a display parameter of the main display panel based on the temperature signal.

Abstract: Provided is a traffic sign recognition method based on a lightweight neural network, which including: a lightweight neural network model is constructed for training and pruning to obtain a lightweight neural network model; the lightweight neural network model comprises a convolution feature extraction part and a classifier part; the convolution feature extraction part includes one layer of conventional 3×3 convolution and 16 layers of separable asymmetric convolution. The classifier part includes three layers of separable full connection modules.

Abstract: A heating system for compressed parts capable of controlling process atmosphere and pressure includes an accommodating body, a heating device, an atmosphere controlling device, and a processing pressure adjusting device. The heating device is disposed inside or outside of the accommodating body to heat a component to be heated, so as to remove an impurity within the component to be heated. The atmosphere controlling device transports a reaction gas, such as hydrogen, oxygen, water vapor, or plasma, into a cavity for reacting with the impurity within the component to be heated. A phase transition or a chemical reaction can be carried out, such that the impurity is gasified, oxidized, carbonized, or disintegrated. The processing pressure adjusting device uses an inert gas (e.g., a nitrogen gas or an argon gas) to control the processing pressure in the cavity to be from 800 Torr to 10?2 Torr.