Patents by Inventor Huiming Bu
Huiming Bu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20160336348Abstract: A method of forming a polysilicon resistor in replacement metal gate (RMG) processing of finFET devices includes forming a plurality of semiconductor fins over a buried oxide layer of a silicon-on-insulator substrate; forming a trench in the buried oxide layer; forming a polysilicon layer over the semiconductor fins and in the trench, the polysilicon layer having a depression corresponding to a location of the trench; forming an insulating layer over the polysilicon layer, and performing a planarizing operation to remove the insulating layer except for a portion of the insulating layer formed in the depression, thereby defining a protective island; patterning the polysilicon layer to define both a dummy gate structure over the fins and the polysilicon resistor; and etching the polysilicon layer to remove the dummy gate structure, wherein the protective island prevents the polysilicon resistor from being removed.Type: ApplicationFiled: May 18, 2016Publication date: November 17, 2016Inventors: Veeraraghavan S. Basker, Huiming Bu, Tenko Yamashita
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Patent number: 9496225Abstract: A method of fabricating a contact above a source or drain region of an integrated circuit includes depositing a first liner conformally in a bottom and along a sidewall of a trench formed above the source or drain region, depositing a second liner conformally over the first liner, and stripping the first liner and the second liner from a portion of the sidewall from an opening of the trench to a height above the bottom of the trench. The method also includes depositing a third liner conformally over the second liner on the bottom and to the height above the bottom of the trench and on the portion of the sidewall, and depositing a metal fill to fill the trench.Type: GrantFiled: February 8, 2016Date of Patent: November 15, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Praneet Adusumilli, Veeraraghavan S. Basker, Huiming Bu, Zuoguang Liu
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Publication number: 20160315076Abstract: Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.Type: ApplicationFiled: June 30, 2016Publication date: October 27, 2016Inventors: Huiming BU, Junjun LI, Theodorus E. STANDAERT, Tenko YAMASHITA
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Patent number: 9425184Abstract: Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.Type: GrantFiled: October 14, 2015Date of Patent: August 23, 2016Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Huiming Bu, Junjun Li, Theodorus E. Standaert, Tenko Yamashita
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Patent number: 9281303Abstract: Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.Type: GrantFiled: May 28, 2014Date of Patent: March 8, 2016Assignee: International Business Machines CorporationInventors: Huiming Bu, Junjun Li, Theodorus E. Standaert, Tenko Yamashita
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Publication number: 20160035718Abstract: Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.Type: ApplicationFiled: October 14, 2015Publication date: February 4, 2016Inventors: Huiming BU, Junjun LI, Theodorus E. STANDAERT, Tenko YAMASHITA
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Publication number: 20150348958Abstract: Electrostatic discharge (ESD) devices and methods of manufacture are provided. The method includes forming a plurality of fin structures and a mesa structure from semiconductor material. The method further includes forming an epitaxial material with doped regions on the mesa structure and forming gate material over at least the plurality of fin structures. The method further includes planarizing at least the gate material such that the gate material and the epitaxial material are of a same height. The method further includes forming contacts in electrical connection with respective ones of the doped regions of the epitaxial material.Type: ApplicationFiled: May 28, 2014Publication date: December 3, 2015Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Huiming BU, Junjun LI, Theodorus E. STANDAERT, Tenko YAMASHITA
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Patent number: 9082788Abstract: A method of making a semiconductor device includes forming an intermediate structure including second semiconductor fin portions above a first semiconductor layer, and top first semiconductor fin portions extending from respective ones of the second semiconductor fin portions. The second semiconductor fin portions are selectively etchable with respect to the top first semiconductor fin portions. A dummy gate is on the intermediate structure. The second semiconductor fin portions are selectively etched to define bottom openings under respective ones of the top first semiconductor fin portions. The bottom openings are filled with a dielectric material.Type: GrantFiled: May 31, 2013Date of Patent: July 14, 2015Assignees: STMICROELECTRONICS, INC., INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Nicolas Loubet, Prasanna Khare, Huiming Bu
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Patent number: 9064885Abstract: A diode and a method for an electrostatic discharge resistant diode. The method includes, for example, receiving a wafer. The wafer includes a silicon layer electrically isolated from a silicon substrate by a buried oxide (BOX) layer. The BOX layer is in physical contact with the silicon layer and the silicon substrate. An N-type well is implanted in the silicon substrate. Furthermore, a vertical column of P+ doped epitaxial silicon and a vertical column of N+ doped epitaxial silicon are formed over the N-type well and extend through the BOX layer and the silicon layer. Both vertical columns may form electrical junctions with the N-type well.Type: GrantFiled: September 25, 2013Date of Patent: June 23, 2015Assignee: International Business Machines CorporationInventors: Huiming Bu, Robert J. Gauthier, Jr., Terence B. Hook, Effendi Leobandung, Tenko Yamashita
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Patent number: 9054124Abstract: A diode and a method for an electrostatic discharge resistant diode. The method includes, for example, receiving a wafer. The wafer includes a silicon layer electrically isolated from a silicon substrate by a buried oxide (BOX) layer. The BOX layer is in physical contact with the silicon layer and the silicon substrate. An N-type well is implanted in the silicon substrate. Furthermore, a vertical column of P+ doped epitaxial silicon and a vertical column of N+ doped epitaxial silicon are formed over the N-type well and extend through the BOX layer and the silicon layer. Both vertical columns may form electrical junctions with the N-type well.Type: GrantFiled: December 14, 2012Date of Patent: June 9, 2015Assignee: International Business Machines CorporationInventors: Huiming Bu, Robert J. Gauthier, Jr., Terence B. Hook, Effendi Leobandung, Tenko Yamashita
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Publication number: 20150145042Abstract: Fin field effect transistors or semiconductor nanowire field effect transistors having different lateral channel dimensions can be formed by providing multiple disposable gate structures, removing one type of disposable gate structures while masking at least another type of disposable gate structures, thinning physically exposed semiconductor material portions by oxidation and an oxide etch, repeatedly performing the thinning process for any additional type of disposable gate structures, and filling gate cavities with replacement gate structures. Field effect transistors having different lateral channel dimensions can provide different threshold voltages and other device characteristics to provide a variety of field effect transistors on a same semiconductor substrate.Type: ApplicationFiled: November 25, 2013Publication date: May 28, 2015Applicant: International Business Machines CorporationInventors: Huiming Bu, Terence B. Hook, Effendi Leobandung, Theodorus E. Standaert
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Patent number: 8933515Abstract: A semiconductor device and method for fabricating a semiconductor device include providing a strained semiconductor layer having a first strained axis, forming an active region within a surface of the strained semiconductor layer where the active region has a longitudinal axis along the strained axis and forming gate structures over the active region. Raised source/drain regions are formed on the active regions above and over the surface of the strained semiconductor layer and adjacent to the gate structures to form transistor devices.Type: GrantFiled: June 22, 2012Date of Patent: January 13, 2015Assignee: International Business Machines CorporationInventors: Stephen W. Bedell, Huiming Bu, Kangguo Cheng, Bruce B. Doris, Johnathan E. Faltermeier, Ali Khakifirooz, Devendra K. Sadana, Chun-Chen Yeh
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Publication number: 20140357036Abstract: A method of making a semiconductor device includes forming an intermediate structure including second semiconductor fin portions above a first semiconductor layer, and top first semiconductor fin portions extending from respective ones of the second semiconductor fin portions. The second semiconductor fin portions are selectively etchable with respect to the top first semiconductor fin portions. A dummy gate is on the intermediate structure. The second semiconductor fin portions are selectively etched to define bottom openings under respective ones of the top first semiconductor fin portions. The bottom openings are filled with a dielectric material.Type: ApplicationFiled: May 31, 2013Publication date: December 4, 2014Applicants: INTERNATIONAL BUSINESS MACHINES CORPORATION, STMICROELECTRONICS, INC.Inventors: Nicolas Loubet, Prasanna Khare, Huiming Bu
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Publication number: 20140167202Abstract: A diode and a method for an electrostatic discharge resistant diode. The method includes, for example, receiving a wafer. The wafer includes a silicon layer electrically isolated from a silicon substrate by a buried oxide (BOX) layer. The BOX layer is in physical contact with the silicon layer and the silicon substrate. An N-type well is implanted in the silicon substrate. Furthermore, a vertical column of P+ doped epitaxial silicon and a vertical column of N+ doped epitaxial silicon are formed over the N-type well and extend through the BOX layer and the silicon layer. Both vertical columns may form electrical junctions with the N-type well.Type: ApplicationFiled: December 14, 2012Publication date: June 19, 2014Applicant: International Business Machines CorporationInventors: Huiming Bu, Robert J. Gauthier, JR., Terence B. Hook, Effendi Leobandung, Tenko Yamashita
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Publication number: 20140167203Abstract: A diode and a method for an electrostatic discharge resistant diode. The method includes, for example, receiving a wafer. The wafer includes a silicon layer electrically isolated from a silicon substrate by a buried oxide (BOX) layer. The BOX layer is in physical contact with the silicon layer and the silicon substrate. An N-type well is implanted in the silicon substrate. Furthermore, a vertical column of P+ doped epitaxial silicon and a vertical column of N+ doped epitaxial silicon are formed over the N-type well and extend through the BOX layer and the silicon layer. Both vertical columns may form electrical junctions with the N-type well.Type: ApplicationFiled: September 25, 2013Publication date: June 19, 2014Applicant: International Business Machines CorporationInventors: Huiming Bu, Robert J. Gauthier, JR., Terence B. Hook, Effendi Leobandung, Tenko Yamashita
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Patent number: 8753964Abstract: A semiconductor device which includes fins of a semiconductor material formed on a semiconductor substrate and then a gate electrode formed over and in contact with the fins. An insulator layer is deposited over the gate electrode and the fins. A trench opening is then etched in the insulator layer. The trench opening exposes the fins and extends between the fins. The fins are then silicided through the trench opening. Then, the trench opening is filled with a metal in contact with the silicided fins to form a local interconnect connecting the fins.Type: GrantFiled: January 27, 2011Date of Patent: June 17, 2014Assignee: International Business Machines CorporationInventors: Andres Bryant, Huiming Bu, Dechao Guo, Wilfried E. Haensch, Chun-Chen Yeh
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Patent number: 8723262Abstract: FinFETS and methods for making FinFETs with a recessed stress liner. A method includes providing an SOI substrate with fins, forming a gate over the fins, forming an off-set spacer on the gate, epitaxially growing a film to merge the fins, depositing a dummy spacer around the gate, and recessing the merged epi film. Silicide is then formed on the recessed merged epi film followed by deposition of a stress liner film over the FinFET. By using a recessed merged epi process, a MOSFET with a vertical silicide (i.e. perpendicular to the substrate) can be formed. The perpendicular silicide improves spreading resistance.Type: GrantFiled: September 7, 2012Date of Patent: May 13, 2014Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, Huiming Bu, Effendi Leobandung, Theodorus E. Standaert, Tenko Yamashita, Chun-Chen Yeh
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Patent number: 8680651Abstract: Techniques for incorporating nanotechnology into decoupling capacitor designs are provided. In one aspect, a decoupling capacitor is provided. The decoupling capacitor comprises a first electrode; an intermediate layer adjacent to the first electrode having a plurality of nanochannels therein; a conformal dielectric layer formed over the intermediate layer and lining the nanochannels; and a second electrode at least a portion of which is formed from an array of nanopillars that fill the nanochannels in the intermediate layer. Methods for fabricating the decoupling capacitor are also provided, as are semiconductor devices incorporating the decoupling capacitor design.Type: GrantFiled: June 22, 2012Date of Patent: March 25, 2014Assignee: International Business Machines CorporationInventors: Satya N. Chakravarti, Dechao Guo, Huiming Bu, Keith Kwong Hon Wong
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Publication number: 20140061792Abstract: A field effect transistor device includes a bulk semiconductor substrate, a fin arranged on the bulk semiconductor substrate, the fin including a source region, a drain region, and a channel region, a first shallow trench isolation (STI) region arranged on a portion of the bulk semiconductor substrate adjacent to the fin, a first recessed region partially defined by the first STI region and the channel region of the fin, and a gate stack arranged over the channel region of the fin, wherein a portion of the gate stack is partially disposed in the first recessed region.Type: ApplicationFiled: August 28, 2012Publication date: March 6, 2014Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Huiming Bu, Terence B. Hook, Reinaldo A. Vega
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Patent number: 8637931Abstract: A finFET device is provided. The finFET device includes a BOX layer, fin structures located over the BOX layer, a gate stack located over the fin structures, gate spacers located on vertical sidewalls of the gate stack, an epi layer covering the fin structures, source and drain regions located in the semiconductor layers of the fin structures, and silicide regions abutting the source and drain regions. The fin structures each comprise a semiconductor layer and extend in a first direction, and the gate stack extends in a second direction that is perpendicular. The gate stack comprises a high-K dielectric layer and a metal gate, and the epi layer merges the fin structures together. The silicide regions each include a vertical portion located on the vertical sidewall of the source or drain region.Type: GrantFiled: December 27, 2011Date of Patent: January 28, 2014Assignee: International Business Machines CorporationInventors: Veeraraghavan S. Basker, Andres Bryant, Huiming Bu, Wilfried Haensch, Effendi Leobandung, Chung-Hsun Lin, Theodorus E. Standaert, Tenko Yamashita, Chun-chen Yeh