Patents by Inventor Hung Chou

Hung Chou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor package structure
    Patent number: 11398424
    Abstract: A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.
    Type: Grant
    Filed: February 18, 2020
    Date of Patent: July 26, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Jaw-Ming Ding, Ren-Hung Chou, Yi-Hung Lin
  • SHIELDING STRUCTURE FOR ULTRA-HIGH VOLTAGE SEMICONDUCTOR DEVICES
    Publication number: 20220231133
    Abstract: A method for manufacturing a device may include providing an ultra-high voltage (UHV) component that includes a source region and a drain region, and forming an oxide layer on a top surface of the UHV component. The method may include connecting a low voltage terminal to the source region of the UHV component, and connecting a high voltage terminal to the drain region of the UHV component. The method may include forming a shielding structure on a surface of the oxide layer provided above the drain region of the UHV component, forming a high voltage interconnection that connects to the shielding structure and to the high voltage terminal, and forming a metal routing that connects the shielding structure and the low voltage terminal.
    Type: Application
    Filed: January 15, 2021
    Publication date: July 21, 2022
    Inventors: Yi-Cheng CHIU, Tian Sheng LIN, Hung-Chou LIN, Yi-Min CHEN, Chiu-Hua CHUNG
  • CANTILEVER FORCE SENSOR
    Publication number: 20220228931
    Abstract: A cantilever force sensor with relatively lower On-Force is disclosed, which comprises a top stack, a bottom stack, and a spacer. The first spacer is configured between the top stack and the bottom stack and configured in a first side of the force sensor. A second side, opposite to the first side, of the top stack, is cantilevered from the bottom stack. When the force sensor is depressed from the top side, the second side of the top stack moves down using the first spacer as a fulcrum. Since the cantilevered side can be easily depressed down so that the On-Force for the force sensor is reduced and hence a force sensor with a relatively higher sensitivity is created.
    Type: Application
    Filed: January 19, 2021
    Publication date: July 21, 2022
    Inventors: Chih-Sheng HOU, Chia-Hung CHOU
  • Methods and Apparatus for Measurement and UE Antenna Selection
    Publication number: 20220231883
    Abstract: Methods are proposed to derive measurement results for User Equipment (UE) antenna selection, beam selection, cell selection, handover, and radio resource management (RRM). First, UE determines its mobility state by using at least two of the following metrics: 1) Doppler information (e.g., from mobility detection gear, MD); 2) beam ping-pong rate, beam change rate, beam change per time period; and 3) moving speed and moving direction from an accelerometer sensor, rotation speed from a gyroscope, ambient magnetic field from a magnetic field sensor, and at least one active antenna set. Next, UE uses an averaging number that is adapted based on its mobility state to derive an average measurement result including at least one of RSRP, RSRQ, RSSI, IL, SNR, and SINR. Finally, UE performs antenna selection, beam selection, cell selection, or RRM based on the average measurement result and joint consideration.
    Type: Application
    Filed: February 22, 2021
    Publication date: July 21, 2022
    Inventors: Kuan-Hung Chou, Wenze Qu
  • METHOD AND APPARATUS FOR DOWNLINK TRANSMISSION IN A CLOUD RADIO ACCESS NETWORK
    Publication number: 20220224378
    Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.
    Type: Application
    Filed: April 1, 2022
    Publication date: July 14, 2022
    Inventors: TZU-YU LIN, SHANG-HO TSAI, YU-HENG YOU, HSIN-HUNG CHOU, WEI-HAN HSIAO
  • Transport layer security session man-in-the-middle attack prevention
    Patent number: 11381595
    Abstract: Preventing Transport Layer Security session man-in-the-middle attacks is provided. A first security digest generated by an endpoint device is compared with a second security digest received from a peer device. It is determined whether a match exists between the first security digest and the second security digest based on the comparison. In response to determining that a match does not exist between the first security digest and the second security digest, a man-in-the-middle attack is detected and a network connection for a Transport Layer Security session is terminated with the peer device.
    Type: Grant
    Filed: November 9, 2018
    Date of Patent: July 5, 2022
    Assignee: International Business Machines Corporation
    Inventors: Wei-Hsiang Hsiung, Sheng-Tung Hsu, Kuo-Chun Chen, Chih-Hung Chou
  • ANTENNA STRUCTURE WITH WIDE BEAMWIDTH
    Publication number: 20220209416
    Abstract: An antenna structure with a wide beamwidth includes a dielectric substrate, a ground plane, a first radiation element, a plurality of first conductive via elements, and a first feeding connection element. The dielectric substrate has a first surface and a second surface which are opposite to each other. The ground plane is disposed on the second surface of the dielectric substrate. The first radiation element is disposed on the first surface of the dielectric substrate. A first notch is formed on the first radiation element. The first conductive via elements penetrate the dielectric substrate. The first conductive via elements are coupled between the first radiation element and the ground plane. The first feeding connection element is coupled to the first radiation element. The first feeding connection element extends into the first notch of the first radiation element.
    Type: Application
    Filed: July 12, 2021
    Publication date: June 30, 2022
    Inventor: Keng-Hung CHOU
  • Multifunctional shaft apparatus
    Patent number: 11370062
    Abstract: A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.
    Type: Grant
    Filed: November 28, 2019
    Date of Patent: June 28, 2022
    Assignees: METAL INDUSTRIES RESEARCH & DEVELOPMENT CENTRE, PARFAITE TOOL CO., LTD.
    Inventors: Yu-Ting Lyu, Yu-Fu Lin, Jui-Teng Chen, Chih-Hung Chou
  • PROJECTION OPTICAL SYSTEM
    Publication number: 20220171169
    Abstract: A projection optical system, comprising: an image source; a lens group; a reflector; an image and an aperture, the lens group and the reflector form multiple optical paths between the image and image source, each optical path has a chief ray and a marginal ray, the chief ray of one of the optical paths forms a chief ray of a paraxial image height at the part where image source be near to the optical axis, the chief ray of another one of the optical paths forms a marginal ray of an off-axis image height at the part where image source be far from the optical axis; whereby forming a first point and a second point, the first point located at the origin and the second point is located in the first quadrant, and forming a third point and a fourth point, the third point located at the fourth quadrant and the fourth point is located in the second quadrant.
    Type: Application
    Filed: November 30, 2020
    Publication date: June 2, 2022
    Inventors: SHENG-CHE WU, YU-HUNG CHOU, WEI-HAO HUANG
  • Power supplying device
    Patent number: 11349335
    Abstract: A power supplying device comprising a battery, a charging circuit and a DC-AC conversion circuit is provided. The charging circuit is electrically coupled to an AC power source and configured to charge the battery. The DC-AC conversion circuit is electrically coupled to the battery and configured to supply an AC output. When the power supplying device is powered on, both of the charging circuit and the DC-AC conversion circuit are enabled.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: May 31, 2022
    Assignee: CYBER POWER SYSTEMS, INC.
    Inventors: Lien-Hsun Ho, Shou-Ting Yeh, Jui-Hung Chou, Kai-Tsung Yang
  • Method for forming semiconductor structure
    Patent number: 11335568
    Abstract: A method for forming a semiconductor structure is provided. The method includes: forming first and second hard mask layers and a target layer on a substrate; patterning the second hard mask layer to form patterned second hard masks including a second wide mask and second narrow masks; and forming spacers on sidewalls of the second wide mask and the second narrow masks. Then, a photoresist layer is formed to cover the second wide mask and the spacers on the sidewalls of the second wide mask. The second narrow masks and the photoresist layer are removed. And, the first hard mask layer is etched with the spacers and the second wide mask together as a mask to form patterned first hard masks on the target layer, wherein the spacers define a first line width, and the second wide mask and the pair of spacers define a second line width.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: May 17, 2022
    Assignee: WINBOND ELECTRONICS CORP.
    Inventors: Ting-Wei Wu, Cheng-Ta Yang, Hsin-Hung Chou
  • Semiconductor package substrate, electronic package and methods for fabricating the same
    Patent number: 11335630
    Abstract: A semiconductor packaging substrate and a method for fabricating the same are provided. The method includes forming a solder resist structure having a hole on a circuit structure, with a portion of the circuit structure exposed from the hole, and forming a cup-shaped solder stand on the exposed circuit layer and a hole wall of the hole. During a packaging process, the design of the solder stand increases a contact area of a solder tin ball with a metal material. Therefore, a bonding force between the solder tin ball and the solder stand is increased, and the solder tin ball can be protected from being broken or fell off. An electronic package having the semiconductor packaging substrate and a method for fabricating the electronic package are also provided.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: May 17, 2022
    Assignee: PHOENIX PIONEER TECHNOLOGY CO., LTD.
    Inventors: Pao-Hung Chou, Chun-Hsien Yu, Shih-Ping Hsu
  • METHOD AND SYSTEM FOR PROCESSING UPLINK SIGNAL IN CLOUD RADIO ACCESS NETWORKS
    Publication number: 20220149905
    Abstract: A method and a system for processing uplink signals in cloud radio access networks are disclosed The system comprising a baseband unit and a number of remote radio heads. The baseband unit and the remote radio heads are connected through fronthaul links. When one remote radio head receives a signal transmitted from a user equipment, the remote radio head first encodes the received signal according to a post-coding matrix, then quantizes the encoded signal according to a number of quantization bits allocated to the user equipment, and finally transmits the quantized signal to the baseband unit.
    Type: Application
    Filed: November 4, 2021
    Publication date: May 12, 2022
    Inventors: XIANG-QUAN SER, CHI-CHEN WANG, SHANG-HO TSAI, HSIN-HUNG CHOU, WEI-HAN HSIAO
  • Control circuit
    Patent number: 11327578
    Abstract: A control circuit for an input device including a micro-switch is provided. The control circuit includes an input circuit, a receiver circuit, a control unit, and a detecting unit. The input circuit includes a first contact and a second contact for electrically connecting to the micro-switch. The receiver circuit includes a third contact and a fourth contact for electrically connecting to the micro-switch. The control unit is electrically connected to the first contact and the third contact for providing an input signal via the first contact to the micro-switch and receiving a switching signal from the micro-switch via the third contact. The detecting unit detects a voltage of the second contact to generate a detecting signal. The control unit receives the detecting signal to determine a type of the micro-switch.
    Type: Grant
    Filed: June 22, 2021
    Date of Patent: May 10, 2022
    Assignee: ASUSTEK COMPUTER INC.
    Inventors: Kuo-En Lin, Shau-Yang Hsieh, Ming-Hsing Chuang, Sheng-Yu Wang, Chih-Yuan Lin, Shih-Hung Chou, Xin-Han Cai, I-Ting Hsieh
  • Method and apparatus for downlink transmission in a cloud radio access network
    Patent number: 11329700
    Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.
    Type: Grant
    Filed: September 25, 2020
    Date of Patent: May 10, 2022
    Assignee: HON LIN TECHNOLOGY CO., LTD.
    Inventors: Tzu-Yu Lin, Shang-Ho Tsai, Yu-Heng You, Hsin-Hung Chou, Wei-Han Hsiao
  • Package structure and manufacturing method thereof
    Patent number: 11322438
    Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.
    Type: Grant
    Filed: September 8, 2020
    Date of Patent: May 3, 2022
    Assignee: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Chun-Hung Lin
  • Zoom lens
    Patent number: 11314063
    Abstract: A zoom lens includes a first lens group with a negative refractive power, a second lens group with a positive refractive power, and an aperture stop disposed in and movable with the second lens group. Each of the first lens group and the second lens group moves individually. The zoom lens further includes a doublet lens disposed on a first side of the aperture stop and between the first lens group and the aperture stop, and at most two lenses including at least one aspheric lens are disposed on a second side of the aperture stop.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: April 26, 2022
    Assignee: YOUNG OPTICS INC.
    Inventors: Hung-You Cheng, Kuo-Chuan Wang, Yu-Hung Chou
  • METHOD FOR FORMING SEMICONDUCTOR MEMORY STRUCTURE
    Publication number: 20220108894
    Abstract: A method for forming a semiconductor memory structure includes sequentially forming an active layer, a hard mask layer and a core layer over a substrate, and etching the core layer to form a core pattern. The core pattern includes a first strip, a second strip, and a plurality of supporting features abutting the first and second strips. The method also includes forming a spacer layer alongside the core pattern, removing the core pattern, forming a photoresist pattern above the spacer layer, etching the hard mask layer using the photoresist pattern and the spacer layer to form a hard mask pattern, and transferring the hard mask pattern into the active layer to form a gate stack.
    Type: Application
    Filed: September 21, 2021
    Publication date: April 7, 2022
    Inventors: Hsin-Hung CHOU, Tsung-Wei LIN, Kao-Tsair TSAI
  • EMULSIFIER SYSTEM FOR AGRICULTURAL COMPOSITIONS COMPRISING A PESTICIDAL NATURAL OIL
    Publication number: 20220079144
    Abstract: Agricultural compositions comprising emulsifier systems for a pesticidal natural oil active ingredient are disclosed. One such composition includes a pesticidal natural oil active ingredient and an emulsifier system with a first component selected from glyceryl oleate, ethoxylated oleate, and ethoxylated soybean oil; and a second component comprising ethoxylated castor oil; wherein the ratio between the first component and said second component is between 1:3 and 3:1; and where the emulsifier system disperses the pesticidal natural oil active ingredient in a water emulsion. Methods for providing agricultural compositions and applications to control one or more pests are also disclosed.
    Type: Application
    Filed: December 20, 2019
    Publication date: March 17, 2022
    Inventors: Hangsheng LI, Doug Ta Hung CHOU
  • PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
    Publication number: 20220077051
    Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.
    Type: Application
    Filed: September 8, 2020
    Publication date: March 10, 2022
    Applicant: Winbond Electronics Corp.
    Inventors: Yen-Jui Chu, Hsin-Hung Chou, Chun-Hung Lin