Abstract: A high-voltage semiconductor device structure is provided. The high-voltage semiconductor device structure includes a semiconductor substrate, a source ring in the semiconductor substrate, and a drain region in the semiconductor substrate. The high-voltage semiconductor device structure also includes a doped ring surrounding sides and a bottom of the source ring and a well region surrounding sides and bottoms of the drain region and the doped ring. The well region has a conductivity type opposite to that of the doped ring. The high-voltage semiconductor device structure further includes a conductor electrically connected to the drain region and extending over and across a periphery of the well region. In addition, the high-voltage semiconductor device structure includes a shielding element ring between the conductor and the semiconductor substrate. The shielding element ring extends over and across the periphery of the well region.

Abstract: A wireless input apparatus is provided, applied to a computer host. The wireless input apparatus includes a wireless dongle and an input module. The wireless dongle is physically connected to the computer host to receive an effect command, and includes a data segmentation unit and a first transceiver unit. The data segmentation unit segments the effect command into a plurality of data segments. The first transceiver unit sequentially transmits the plurality of data segments outwards. The input module includes a second transceiver unit, a merging unit, an effect generation unit, and a control unit. The second transceiver unit is coupled to the first transceiver unit to sequentially receive the plurality of data segments. The merging unit merges the plurality of data segments into the effect command. The control unit receives the effect command, and controls the effect generation unit to generate an effect according to the effect command.

Abstract: A color-mixing lighting control method is used for receiving an original color-mixing light data to control a color-mixing light source. The color-mixing light source includes a plurality of light-emitting elements to produce a plurality of emission colors. The original color-mixing light data includes a plurality of original light intensity values corresponding to the emission colors. The color-mixing lighting control method comprising: determining a maximum value of the original light intensity values; calculating the light intensity percentage of each of the emission colors in the original color-mixing light data according to the original light intensity values; generating the corrected light intensity value of each of the emission colors according to the maximum value and the light intensity percentage of each of the emission colors; and respectively controlling the light-emitting elements by using the corresponding corrected light intensity value of each of the emission colors.

Abstract: A semiconductor package carrier board, a method for fabricating the same, and an electronic package having the same are provided. The method includes forming on a circuit structure a graphene layer that acts as an insulation heat dissipating layer. Since the heat conductivity of the graphene layer is far greater than the heat conductivity of ink (about 0.4 W/m·k), which is used as solder resist, the heat of the semiconductor package carrier board can be conducted quickly, and thus can avoid the problem that the heat will be accumulated on the semiconductor package carrier board.

Abstract: A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.

Abstract: A method for manufacturing a device may include providing an ultra-high voltage (UHV) component that includes a source region and a drain region, and forming an oxide layer on a top surface of the UHV component. The method may include connecting a low voltage terminal to the source region of the UHV component, and connecting a high voltage terminal to the drain region of the UHV component. The method may include forming a shielding structure on a surface of the oxide layer provided above the drain region of the UHV component, forming a high voltage interconnection that connects to the shielding structure and to the high voltage terminal, and forming a metal routing that connects the shielding structure and the low voltage terminal.

Abstract: A cantilever force sensor with relatively lower On-Force is disclosed, which comprises a top stack, a bottom stack, and a spacer. The first spacer is configured between the top stack and the bottom stack and configured in a first side of the force sensor. A second side, opposite to the first side, of the top stack, is cantilevered from the bottom stack. When the force sensor is depressed from the top side, the second side of the top stack moves down using the first spacer as a fulcrum. Since the cantilevered side can be easily depressed down so that the On-Force for the force sensor is reduced and hence a force sensor with a relatively higher sensitivity is created.

Abstract: Methods are proposed to derive measurement results for User Equipment (UE) antenna selection, beam selection, cell selection, handover, and radio resource management (RRM). First, UE determines its mobility state by using at least two of the following metrics: 1) Doppler information (e.g., from mobility detection gear, MD); 2) beam ping-pong rate, beam change rate, beam change per time period; and 3) moving speed and moving direction from an accelerometer sensor, rotation speed from a gyroscope, ambient magnetic field from a magnetic field sensor, and at least one active antenna set. Next, UE uses an averaging number that is adapted based on its mobility state to derive an average measurement result including at least one of RSRP, RSRQ, RSSI, IL, SNR, and SINR. Finally, UE performs antenna selection, beam selection, cell selection, or RRM based on the average measurement result and joint consideration.

Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.

Abstract: Preventing Transport Layer Security session man-in-the-middle attacks is provided. A first security digest generated by an endpoint device is compared with a second security digest received from a peer device. It is determined whether a match exists between the first security digest and the second security digest based on the comparison. In response to determining that a match does not exist between the first security digest and the second security digest, a man-in-the-middle attack is detected and a network connection for a Transport Layer Security session is terminated with the peer device.

Abstract: An antenna structure with a wide beamwidth includes a dielectric substrate, a ground plane, a first radiation element, a plurality of first conductive via elements, and a first feeding connection element. The dielectric substrate has a first surface and a second surface which are opposite to each other. The ground plane is disposed on the second surface of the dielectric substrate. The first radiation element is disposed on the first surface of the dielectric substrate. A first notch is formed on the first radiation element. The first conductive via elements penetrate the dielectric substrate. The first conductive via elements are coupled between the first radiation element and the ground plane. The first feeding connection element is coupled to the first radiation element. The first feeding connection element extends into the first notch of the first radiation element.

Abstract: A multifunctional shaft apparatus includes a shaft base, a spindle, a tool holder, an ultrasonic vibration assembly, a laser light source and a mirror assembly. The spindle is disposed in the shaft base. The spindle has a laser channel extending along the spindle. The tool holder is disposed on the spindle. The tool holder has a hollow passage, an inner space and a recessed portion. The hollow passage is communicated with the laser channel. An inner wall of the hollow passage has at least one through hole communicated with the inner space, and the recessed portion is disposed on a bottom surface of the tool holder. The bottom surface has a light outlet. The ultrasonic vibration assembly includes a vibration member disposed in the recessed portion. The mirror assembly is disposed in the tool holder and is configured to reflect the laser light beam generated by the laser light source.

Abstract: A projection optical system, comprising: an image source; a lens group; a reflector; an image and an aperture, the lens group and the reflector form multiple optical paths between the image and image source, each optical path has a chief ray and a marginal ray, the chief ray of one of the optical paths forms a chief ray of a paraxial image height at the part where image source be near to the optical axis, the chief ray of another one of the optical paths forms a marginal ray of an off-axis image height at the part where image source be far from the optical axis; whereby forming a first point and a second point, the first point located at the origin and the second point is located in the first quadrant, and forming a third point and a fourth point, the third point located at the fourth quadrant and the fourth point is located in the second quadrant.

Abstract: A power supplying device comprising a battery, a charging circuit and a DC-AC conversion circuit is provided. The charging circuit is electrically coupled to an AC power source and configured to charge the battery. The DC-AC conversion circuit is electrically coupled to the battery and configured to supply an AC output. When the power supplying device is powered on, both of the charging circuit and the DC-AC conversion circuit are enabled.

Abstract: A method for forming a semiconductor structure is provided. The method includes: forming first and second hard mask layers and a target layer on a substrate; patterning the second hard mask layer to form patterned second hard masks including a second wide mask and second narrow masks; and forming spacers on sidewalls of the second wide mask and the second narrow masks. Then, a photoresist layer is formed to cover the second wide mask and the spacers on the sidewalls of the second wide mask. The second narrow masks and the photoresist layer are removed. And, the first hard mask layer is etched with the spacers and the second wide mask together as a mask to form patterned first hard masks on the target layer, wherein the spacers define a first line width, and the second wide mask and the pair of spacers define a second line width.

Abstract: A semiconductor packaging substrate and a method for fabricating the same are provided. The method includes forming a solder resist structure having a hole on a circuit structure, with a portion of the circuit structure exposed from the hole, and forming a cup-shaped solder stand on the exposed circuit layer and a hole wall of the hole. During a packaging process, the design of the solder stand increases a contact area of a solder tin ball with a metal material. Therefore, a bonding force between the solder tin ball and the solder stand is increased, and the solder tin ball can be protected from being broken or fell off. An electronic package having the semiconductor packaging substrate and a method for fabricating the electronic package are also provided.

Abstract: A method and a system for processing uplink signals in cloud radio access networks are disclosed The system comprising a baseband unit and a number of remote radio heads. The baseband unit and the remote radio heads are connected through fronthaul links. When one remote radio head receives a signal transmitted from a user equipment, the remote radio head first encodes the received signal according to a post-coding matrix, then quantizes the encoded signal according to a number of quantization bits allocated to the user equipment, and finally transmits the quantized signal to the baseband unit.

Abstract: A control circuit for an input device including a micro-switch is provided. The control circuit includes an input circuit, a receiver circuit, a control unit, and a detecting unit. The input circuit includes a first contact and a second contact for electrically connecting to the micro-switch. The receiver circuit includes a third contact and a fourth contact for electrically connecting to the micro-switch. The control unit is electrically connected to the first contact and the third contact for providing an input signal via the first contact to the micro-switch and receiving a switching signal from the micro-switch via the third contact. The detecting unit detects a voltage of the second contact to generate a detecting signal. The control unit receives the detecting signal to determine a type of the micro-switch.

Abstract: A method for downlink transmission in a cloud radio access network for a number of users is applied in a central unit. The central unit determines a specific number of remote radio heads (RRHs) as non-serving RRHs based on a predetermined data compression ratio. For each of many pieces of user equipment (UEs), the central unit determines a combination of RRHs which are non-serving in coordinated multi-point transmission (CoMP) from a plurality of RRHs based on the determined specific number, and then performs CoMP downlink transmission based on the combination of RRHs which are non-serving in the CoMP.

Abstract: A package structure including a lead frame structure, a die, an adhesive layer, and at least one three-dimensional (3D) printing conductive wire is provided. The lead frame structure includes a carrier and a lead frame. The carrier has a recess. The lead frame is disposed on the carrier. The die is disposed in the recess. The die includes at least one pad. The adhesive layer is disposed between a bottom surface of the die and the carrier and between a sidewall of the die and the carrier. The 3D printing conductive wire is disposed on the lead frame, the adhesive layer, and the pad, and is electrically connected between the lead frame and the pad.