Abstract: A memory controller includes an interface to receive a data strobe signal and corresponding read data. The data strobe signal and the read data correspond to a read command issued by the memory controller, and the read data is received in accordance with the data strobe signal and an enable signal. A circuit in the memory controller is to dynamically adjust a timing offset between the enable signal and the data strobe signal, and control logic is to issue a supplemental read command in accordance with a determination that a time interval since a last read command issued by the memory controller exceeds a predetermined value.

Abstract: A memory control component outputs a memory write command to a memory IC and also outputs write data to be received via data inputs of the memory IC. Prior to reception of the write data within the memory IC, the memory control component asserts a termination control signal that causes the memory IC to apply to the data inputs a first on-die termination impedance during reception of the write data followed by a second on-die termination impedance after the write data has been received. The memory control component deasserts the termination control signal to cause the memory IC to apply no termination impedance to the data inputs.

Abstract: In an illustrative embodiment, the memory circuit includes first and second data paths on which data is transferred for read and write memory operations and first and second mixer circuits for adjusting the phase of clock signals applied to their inputs. The mixer circuits are cross-coupled so that the outputs of the first and second mixers are both available to both the first and second data paths. One mixer is used to provide a first phase adjusted clock signal for use by the operating circuit and the other mixer is used to provide a second phase adjusted clock signal for use by a following operation whatever that may be.

Abstract: An IC die transmits command signals, address signals and data signals to a flash memory device at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within an array of non-volatile storage elements of the flash memory device. The IC die additionally transmits a control signal to the flash memory device via one or more external control signal lines, the control signal directing the flash memory device to switchably couple an on-die termination element to the time-multiplexed signaling line.

Abstract: Exemplary embodiments provide a disaggregated memory appliance, comprising: a plurality of leaf memory switches that manage one or more memory channels of one or more of leaf memory modules; a low-latency memory switch that arbitrarily connects one or more external processors to the plurality of leaf memory modules over a host link; and a low-latency routing protocol used by both the low-latency memory switch and the leaf memory switches that encapsulates memory technology specific semantics by use of tags that uniquely identify specific types of memory technology used in the memory appliance during provisioning, monitoring and operation.

Abstract: Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the sub-row to be activated.

Abstract: A memory controller includes a clock generator to generate a first clock signal and a timing circuit to generate a second clock signal from the first clock signal. The second clock signal times communications with any of a plurality of memory devices in respective ranks, including a first memory device in a first rank and a second memory device in a second rank. The timing circuit is configured to adjust a phase of the first clock signal, when the memory controller is communicating with the second memory device, based on calibration data associated with the second memory device and timing adjustment data associated with feedback from at least the first memory device.

Abstract: Example embodiments provide a disaggregated memory appliance, comprising: a plurality of leaf memory switches that manage one or more memory channels of one or more of leaf memory modules; a low-latency memory switch that arbitrarily connects one or more external processors to the plurality of leaf memory modules over a host link; and a management processor that responds to requests from one or more external processors for management, maintenance, configuration and provisioning of the leaf memory modules within the memory appliance.

Abstract: In a non-volatile memory device having an array of non-volatile storage elements, control information received via one or more control input nodes indicates, at different times, that (i) data signals representative of data to be stored within the array of non-volatile storage elements are to be received via a plurality of input/output (I/O) nodes of the non-volatile memory device, and (ii) data signals representative of data read from the array of non-volatile storage elements are to be output via the plurality of I/O nodes. First termination elements are switchably coupled to and decoupled from the I/O nodes based at least in part on the control information, and second termination elements are switchably coupled to and decoupled from the one or more control input nodes based at least in part on the control information.

Abstract: A non-volatile memory device determines, based at least partly on a first multi-bit device address received via a signaling interface and an incoming chip-select signal, whether the device is to participate in a memory access transaction by receiving or outputting data via an I/O node of the signaling interface. Based at least in part on that determination, on-die termination circuitry within the non-volatile memory device switchably couples or decouples a termination resistance between the I/O node and a supply voltage node during a data transmission phase of the memory access transaction.

Abstract: A memory controller transmits a plurality of control values to a non-volatile memory device together with one or more programming commands. The plurality of control values include (i) a first control value that specifies a first termination resistance to be applied to an I/O node of the non-volatile memory device during an interval in which a first data signal transmitted on a bidirectional signaling line coupled to the I/O node is to be received within the non-volatile memory device and (ii) a second control value that specifies a second termination resistance to be applied to the I/O node during an interval in which a second data signal is transmitted on the bidirectional signaling line by another non-volatile memory device.

Abstract: On-die termination circuitry within a non-volatile memory device applies a first termination resistance to an I/O node in response to a data storage command indicating that a data signal conveyed on a bidirectional signaling line is to be received within the non-volatile memory device via the I/O node, and applies a second termination resistance to the I/O node in response to information indicating that another memory device is to output a data signal onto the bidirectional signaling line.

Abstract: An identifier value stored within a programmable register of a memory device is compared with a selector address received, together with a memory access command, via a signaling interface having at least one I/O node coupled to a bidirectional signaling line. On-die termination circuitry is transitioned between first and second states or maintained in one or the other of the first and second states based, at least in part, on whether the selector address matches the identifier value, with transition to the first state including switchably coupling a first termination resistance between the I/O node and a supply voltage line.

Abstract: A memory controller includes an interface to receive a data strobe signal and corresponding read data. The data strobe signal and the read data correspond to a read command issued by the memory controller, and the read data is received in accordance with the data strobe signal and an enable signal. A circuit in the memory controller is to dynamically adjust a timing offset between the enable signal and the data strobe signal, and control logic is to issue a supplemental read command in accordance with a determination that a time interval since a last read command issued by the memory controller exceeds a predetermined value.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: An IC die transmits command signals, address signals and data signals to a flash memory device at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within an array of non-volatile storage elements of the flash memory device. The IC die additionally transmits a control signal to the flash memory device via one or more external control signal lines, the control signal directing the flash memory device to switchably couple an on-die termination element to the time-multiplexed signaling line.

Abstract: In a non-volatile memory device having an array of non-volatile storage elements, command, address and data signals are received at respective times via a time-multiplexed external signaling line, the data signals representing data to be stored within the array of non-volatile storage elements. A control signal is received via a signaling path external to the non-volatile memory device, and an on-die termination element is switchably coupled to the time-multiplexed signaling line at least in part in response to a transition of the control signal from a first logic state to a second logic state.

Abstract: A memory system supporting error detection and correction (EDC) coverage. The system includes a memory controller and a memory buffer. The memory buffer includes an interface to a first group of memory devices and an interface to a second group of memory devices. The memory buffer accesses data from the first group of memory devices and accesses first error information corresponding to the data from the second group of devices. The memory buffer also accesses additional data from the second group of memory devices and accesses second error information corresponding to the additional data from a device in the first group of memory devices. EDC coverage may also be configured by the memory controller so that some data accesses have EDC coverage and other data accesses do not have EDC coverage.

Abstract: A memory controller includes a clock generator to generate a first clock signal and a timing circuit to generate a second clock signal from the first clock signal. The second clock signal times communications with any of a plurality of memory devices in respective ranks, including a first memory device in a first rank and a second memory device in a second rank. The timing circuit is configured to adjust a phase of the first clock signal, when the memory controller is communicating with the second memory device, based on calibration data associated with the second memory device and timing adjustment data associated with feedback from at least the first memory device.

Abstract: In a memory module having an integrated-circuit buffer device coupled to one or more integrated-circuit memory devices, the buffer device receives write data signals from an external control component via a set of data inputs, the write data signals indicating write data to be stored within one or more of the memory devices. Logic within the buffer device sequentially applies controllable termination impedance configurations at the data inputs based on an indication received from the control component and an internal state of the buffer device, applying a first controllable termination impedance configuration at each of the data inputs during a first internal state of the buffer device corresponding to the reception of the write data signals on the data inputs, and applying a second controllable termination impedance configuration at each of the data inputs during a second internal state of the buffer device that succeeds the first internal state.