Abstract: Components of a memory system, such as a memory controller and memory device, which detect accumulated memory read disturbances and correct such disturbances before they reach a level that causes errors. The memory device includes a memory array and a disturbance control circuit. The memory array includes a plurality of memory rows. Each memory row is associated with a disturbance warning circuit having a state that corresponds to an accumulated disturbance in the memory row. The disturbance control circuit determines, responsive to an activation of a memory row of the plurality of memory rows specified by a row access command, whether the disturbance condition is present in the memory row based on the state of the disturbance warning circuit associated with the memory row. If a disturbance condition is present, the disturbance control circuit causes a recovery operation to be performed on the memory row to reduce the accumulated disturbances.

Abstract: Multiple devices, including a first device and a second device, have operational circuitry and opposing first and second surfaces. First and second electrical contacts are formed at the first surface, while a third electrical contact is formed at the second surface opposite the first electrical contact. The first electrical contact is electrically connected to the operational circuitry, and the second electrical contact is electrically connected to the third electrical contact. The first device and the second device are subsequently stacked such that the first surface of the second device is located adjacent the second surface of the first device such that the first electrical contact of the second device is aligned with the third electrical contact of the first device. The first electrical contact of the second device is electrically connected to the third electrical contact of the first device.

Abstract: A memory controller includes an interface to receive a data strobe signal and corresponding read data. The data strobe signal and the read data correspond to a read command issued by the memory controller, and the read data is received in accordance with the data strobe signal and an enable signal. A circuit in the memory controller is to dynamically adjust a timing offset between the enable signal and the data strobe signal, and control logic is to issue a supplemental read command in accordance with a determination that a time interval since a last read command issued by the memory controller exceeds a predetermined value.

Abstract: A memory system supporting error detection and correction (EDC) coverage. The system includes a memory controller and a memory buffer. The memory buffer includes an interface to a first group of memory devices and an interface to a second group of memory devices. The memory buffer accesses data from the first group of memory devices and accesses first error information corresponding to the data from the second group of devices. The memory buffer also accesses additional data from the second group of memory devices and accesses second error information corresponding to the additional data from a device in the first group of memory devices. EDC coverage may also be configured by the memory controller so that some data accesses have EDC coverage and other data accesses do not have EDC coverage.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: Components of a memory system, such as a memory controller and a memory device, that reduce delay in exiting self-refresh mode by controlling the refresh timing of the memory device. The memory device includes a memory core. An interface circuit of the memory device receives an external refresh signal indicating an intermittent refresh event. A refresh circuit of the memory device generates an internal refresh signal indicating an internal refresh event of the memory device. A refresh control circuit of the memory device performs a refresh operation on a portion of the memory core responsive to the internal refresh event, at a time relative to the intermittent refresh event indicated by the external refresh signal.

Abstract: In an integrated circuit device having dynamically selected on-die termination, a set of data inputs are coupled respectively to a set of termination circuits, each termination circuit having multiple controllable termination impedance configurations.

Abstract: An integrated circuit device transmits, to a dynamic random access memory device (DRAM), a write command indicating that write data is to be sampled by a data interface of the DRAM, and a plurality of commands that specify programming a plurality of control values into a plurality of corresponding registers in the DRAM. The plurality of control values include first and second control values that indicate respective first and second terminations that the DRAM is to apply to the data interface during a time interval that begins a predetermined amount of time after the DRAM receives the write command, the first termination to be applied during a first portion of the time interval while the data interface is sampling the write data and the second termination to be applied during a second portion of the time interval after the write data is sampled.

Abstract: A system includes a plurality of memory devices arranged in a fly-by topology, each of the memory devices having on-die termination (ODT) circuitry for connection to an address and control (RQ) bus. The ODT circuitry has at least one input for controlling termination of one or more signal lines of the RQ bus. Application of a first logic level to the at least one input enables termination of the one or more signal lines. Application of a second logic level to the at least one input disables termination of the one or more signal lines.

Abstract: An integrated circuit memory device stores a plurality of digital values that specify respective termination impedances. The memory device switchably couples respective sets of load elements to a data input/output (I/O) to apply the termination impedances specified by the digital values, including, applying a first termination impedance to the data I/O during an idle state of the memory device, applying a first one of two non-equal termination impedances to the data I/O while the memory device receives write data in a memory write operation and applying a second one of the two non-equal termination impedances to the data I/O while another memory device receives write data in a memory write operation. When outputting read data via the data I/O in a memory read operation, the memory device switchably couples to the data I/O at least a portion of the load elements included in the sets of load elements.

Abstract: A memory controller includes a clock generator to generate a first clock signal and a timing circuit to generate a second clock signal from the first clock signal. The second clock signal times communications with any of a plurality of memory devices in respective ranks, including a first memory device in a first rank and a second memory device in a second rank. The timing circuit is configured to adjust a phase of the first clock signal, when the memory controller is communicating with the second memory device, based on calibration data associated with the second memory device and timing adjustment data associated with feedback from at least the first memory device.

Abstract: Row activation operations within a memory component are carried out with respect to subrows instead of complete storage rows to reduce power consumption. Further, instead of activating subrows in response to row commands, subrow activation operations are deferred until receipt of column commands that specify the column operation to be performed and the subrow to be activated.

Abstract: A memory controller includes an interface to receive a data strobe signal and corresponding read data. The data strobe signal and the read data correspond to a read command issued by the memory controller, and the read data is received in accordance with the data strobe signal and an enable signal. A circuit in the memory controller is to dynamically adjust a timing offset between the enable signal and the data strobe signal, and control logic is to issue a supplemental read command if a time interval since a last read command issued by the memory controller exceeds a predetermined value.

Abstract: Components of a memory system, such as a memory controller or memory device, that operate in different power states to reduce the overall power consumption of the memory system. In some of the power states, distribution circuitry that distributes a timing signal within the components may be powered on when the output of the distribution circuitry is needed. In other power states, the distribution circuitry may be powered off when the output of the distribution circuitry is not needed. Additionally, power states in the memory device may be triggered off memory access commands issued by the memory controller.

Abstract: A memory module having a plurality of memory devices and a memory buffer that translates between a variable width primary data port and a plurality of fixed width secondary data ports, each of which is coupled to one of the memory devices. The translation is effected by distributing the width of the primary data port to all or to a subset of the secondary data ports. In another aspect, the invention comprises a memory buffer that supports adjustable data width in a variety of ways.

Abstract: In a system having a memory device, an event is detected during system operation. The memory device is heated to reverse use-incurred degradation of the memory device in response to detecting the event. In another system, the memory device is heated to reverse use-incurred degradation concurrently with execution of a data access operation within another memory device of the system. In another system having a memory controller coupled to first and second memory devices, data is evacuated from the first memory device to the second memory device in response to determining that a maintenance operation is needed within the first memory device.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: An integrated circuit device transmits, to a dynamic random access memory device (DRAM), a write command indicating that write data is to be sampled by a data interface of the DRAM, and a plurality of commands that specify programming a plurality of control values into a plurality of corresponding registers in the DRAM. The plurality of control values include first and second control values that indicate respective first and second terminations that the DRAM is to apply to the data interface during a time interval that begins a predetermined amount of time after the DRAM receives the write command, the first termination to be applied during a first portion of the time interval while the data interface is sampling the write data and the second termination to be applied during a second portion of the time interval after the write data is sampled.

Abstract: A memory controller having a time-staggered request signal output. A first timing signal is generated while a second timing signal is generated having a first phase difference relative to the first timing signal. An address value is transmitted in response to the first timing signal and a control value is transmitted in response to the second timing signal, the address value and control value constituting portions of a first memory access request.

Abstract: A control component outputs to an integrated circuit device an indication to apply one of a plurality of controllable termination impedance configurations at a data input of the integrated circuit device. The indication causes the integrated circuit device to apply a first of the controllable termination impedance configurations at the data input during a first internal state of the integrated circuit device corresponding to the reception of write data on the data input, and causes the integrated circuit device to apply a second of the controllable termination impedance configurations at the data input during a second internal state of the integrated circuit device that follows the first internal state.