Patents by Inventor Jian Shen

Jian Shen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11469168
    Abstract: A capacitor includes at least one multi-wing structure; a laminated structure, where the laminated structure clads the at least one multi-wing structure and includes at least one dielectric layer and a plurality of conductive layers, and the at least one dielectric layer and the plurality of conductive layers form a structure that a conductive layer and a dielectric layer are adjacent to each other; at least one first external electrode, where the first external electrode is electrically connected to some conductive layer(s) in the plurality of conductive layers; at least one second external electrode, wherein the second external electrode is electrically connected to the other conductive layer(s) in the plurality of conductive layers, and a conductive layer in the laminated structure adjacent to each conductive layer in the some conductive layer(s) includes at least one conductive layer in the other conductive layer(s).
    Type: Grant
    Filed: September 26, 2020
    Date of Patent: October 11, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11462490
    Abstract: A security chip includes: a first medium layer; a second medium layer disposed on the first medium layer, where the first medium layer is an optically denser medium relative to the second medium layer, and a roughness of an upper surface of the first medium layer is greater than or equal to a preset threshold, so that light entering the second medium layer from the first medium layer is able to be totally reflected and/or scattered; and a semiconductor chip disposed on the second medium layer. Based on the above technical solution, light incident from a lower surface of the first medium layer is able to be totally reflected or scattered by the upper surface of the first medium layer, so that most of light cannot reach a logic or storage area on the front of the security chip, thereby achieving the purpose of resisting a laser attack.
    Type: Grant
    Filed: September 19, 2020
    Date of Patent: October 4, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11462609
    Abstract: A capacitor includes: at least one multi-wing structure including N axes and M wings, where the N axes extend along a first direction, and the M wings are a convex structure formed by extending from side walls of the N axes toward a direction perpendicular to the first direction, a first wing of the M wings and the N axes are formed of a first conductive material, and other wings are formed of a second conductive material; a conductive structure cladding the multi-wing structure; a dielectric layer disposed between the multi-wing structure and the conductive structure to isolate the multi-wing structure from the conductive structure; a first external electrode electrically connected to some or all multi-wing structures; and a second external electrode electrically connected to the conductive structure.
    Type: Grant
    Filed: September 27, 2020
    Date of Patent: October 4, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Publication number: 20220276097
    Abstract: An optical sensor circuit is provided. In the optical sensor circuit, an output stage circuit transmits a voltage of first and second node to the output line according to a first driving signal. A first sensor is configured to generate a first photocurrent according to a first color light that senses an ambient light, and generate a second photocurrent according to a second color light. A second sensor is configured to generate a third photocurrent according to a third color light, and generate a fourth photocurrent according to the second color light. In a sensing phase, when the first sensor senses the first color light, and the second sensor senses the third color light, the first sensor adjusts a voltage level of the voltage according to the first photocurrent, and the second sensor adjusts the voltage level of the voltage according to the third photocurrent.
    Type: Application
    Filed: May 11, 2022
    Publication date: September 1, 2022
    Applicants: Au Optronics Corporation, National Cheng-Kung University
    Inventors: Chih-Lung Lin, Chia-En Wu, Chia-Lun Lee, Jui-Hung Chang, Jian-Shen Yu
  • Publication number: 20220254714
    Abstract: The present application provides a capacitor and a method for producing the same The capacitor includes: a multi-wing structure, including N groups of wing structures and N support structures, each group of the wing structures includes M wing structures arranged in parallel, M limit slots are formed on an outer side wall of the support structure, the M wing structures are fixed on outside of the support structure through the M limit slots, respectively, and M and N are positive integers; a laminated structure, covering the multi-wing structure and including at least one dielectric layer and a plurality of conductive layers; at least one first external electrode, electrically connecting to part or all of the odd-number conductive layers in the plurality of conductive layers; and at least one second external electrode, electrically connecting to part or all of even-number conductive layers in the plurality of conductive layers.
    Type: Application
    Filed: April 26, 2022
    Publication date: August 11, 2022
    Inventors: Bin LU, Jian SHEN
  • Patent number: 11409340
    Abstract: A PCD may include an active heat transfer system configured to transfer heat from the PCD to a docking device. The active heat transfer system may include a thermoelectric cooler, a heat pipe, or other heat transfer elements. The active heat transfer system may, based on temperature measurements, be activated when the PCD is coupled to the docking device.
    Type: Grant
    Filed: June 23, 2020
    Date of Patent: August 9, 2022
    Assignee: QUALCOMM Incorporated
    Inventor: Jian Shen
  • Patent number: 11371885
    Abstract: An optical sensor circuit is provided. In the optical sensor circuit, an output stage circuit transmits a voltage of first and second node to the output line according to a first driving signal. A first sensor is configured to generate a first photocurrent according to a first color light that senses an ambient light, and generate a second photocurrent according to a second color light. A second sensor is configured to generate a third photocurrent according to a third color light, and generate a fourth photocurrent according to the second color light. In a sensing phase, when the first sensor senses the first color light, and the second sensor senses the third color light, the first sensor adjusts a voltage level of the voltage according to the first photocurrent, and the second sensor adjusts the voltage level of the voltage according to the third photocurrent.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: June 28, 2022
    Assignees: Au Optronics Corporation, National Cheng-Kung University
    Inventors: Chih-Lung Lin, Chia-En Wu, Chia-Lun Lee, Jui-Hung Chang, Jian-Shen Yu
  • Patent number: 11362171
    Abstract: A capacitor includes: a semiconductor substrate including at least one substrate trench group; at least one laminated structure, each laminated structure includes n conductive layers and m dielectric layers, the first conductive layer in the n conductive layers is disposed above the semiconductor substrate and in the substrate trench group, the i-th conductive layer in the n conductive layers is provided with the i-th conductive layer trench group, and the (i+1)th conductive layer in the n conductive layers is disposed above the i-th conductive layer and in the i-th conductive layer trench group, where m, n, and i are positive integers, and n?2, 1?i?n?1; a first external electrode connected to some conductive layers; and a second external electrode connected to other conductive layers.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: June 14, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11362173
    Abstract: Present disclosure provide a capacitor includes: a semiconductor substrate; a laminated structure including n conductive layers and m dielectric layer(s), the i-th conductive layer being provided with at least one i-th isolation trench, the (i+1)-th conductive layer being provided above the i-th conductive layer and in the i-th isolation trench, isolation trenches in odd-numbered and even-numbered conductive layers having a first and a second overlap region in a vertical direction respectively, and the first overlap region not overlapping the second overlap region, where m, n, and i are positive integers, n?2, and 1?i?n?1; at least one first external electrode electrically connected to all odd-numbered conductive layer(s) through a first conductive via structure in the second overlap region; and at least one second external electrode electrically connected to all even-numbered conductive layer(s) through a second conductive via structure in the first overlap region.
    Type: Grant
    Filed: September 23, 2020
    Date of Patent: June 14, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Publication number: 20220179049
    Abstract: A laser radar includes at least one transmitting module and at least one receiving module. The at least one transmitting module is corresponding to the at least one receiving module one by one. The at least one transmitting module is configured to transmit a laser beam to a target area. Each receiving module is configured to receive an echo beam of the laser beam emitted by one corresponding transmitting module and reflected by the target area. Each transmitting module includes at least one transmitter. Each receiving module includes at least two receivers. Each transmitter of the at least one transmitting module corresponds to the at least two receivers of one corresponding receiving module.
    Type: Application
    Filed: January 6, 2022
    Publication date: June 9, 2022
    Inventors: Xiaobo Hu, Jian Shen
  • Patent number: 11336590
    Abstract: Some embodiments provide a method that receives a request for information regarding a path between endpoints of a logical network. The method provides, for display, a visualization of the path including (i) a set of logical network components between the endpoints and (ii) a set of physical network components that implement the logical network components. The physical network components and the logical network components are aligned in the display. In some embodiments, the method receives data regarding a packet tracing operation between the endpoints. The method generates a display including (i) a visualization of the path between the endpoints of the logical network and (ii) a representation of the received data regarding the packet tracing operation, with the packet tracing operation data is visually linked to the components of the path.
    Type: Grant
    Filed: October 12, 2020
    Date of Patent: May 17, 2022
    Assignee: NICIRA, INC.
    Inventors: Alexander Nhu, Brighton Vino Jegarajan, Jian Shen Sik, Venkata Ranganath Babu Golla, Shivraj Shahajirao Sonawane
  • Patent number: 11315975
    Abstract: The present disclosure provides an image sensor including a substrate (400) and at least one pixel unit. The pixel unit comprises a photodetector (401) arranged in the substrate, a photosensitive surface of the photodetector facing a back surface of the substrate to generate a charge upon receiving an incident light from the back surface of the substrate, a spherical crown structure (406) arranged on the substrate and located on an opposite surface of the photosensitive surface, a conformal dielectric layer (420) arranged on the spherical crown structure and used to generate a dielectric-layer reflective light when the incident light reaches the conformal dielectric layer, and a reflective layer (430) arranged on the conformal dielectric layer and used to generate a reflective-layer reflective light when the incident light reaches the reflective layer. In this way, an absorption ratio for the incident light is increased, thereby improving signal quality of an image.
    Type: Grant
    Filed: November 19, 2019
    Date of Patent: April 26, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Guofeng Yao, Jian Shen, Yunning Li
  • Patent number: 11276750
    Abstract: A capacitor includes: a semiconductor substrate; a first insulating layer disposed under the substrate; a first trench group disposed in the substrate and the first insulating layer, the first trench group includes two first trenches which penetrate through the substrate downward from an upper surface of the substrate and enter the first insulating layer, and bottoms of the two first trenches are communicated to form a first cavity structure located in the first insulating layer; a laminated structure disposed above the substrate, in the first trench group, and in the first cavity structure, the laminated structure includes m insulating layers and n conductive layers forming a structure that each insulating layer electrically isolates each conductive layer from each other; a first electrode layer electrically connected to all odd-numbered conductive layers; and a second electrode layer electrically connected to all even-numbered conductive layers.
    Type: Grant
    Filed: September 17, 2020
    Date of Patent: March 15, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11239308
    Abstract: Embodiments of the present application disclose a capacitor and a method for producing a capacitor. The capacitor includes: an electrode layer including a first electrode and a second electrode separated from each other; a laminated structure including n dielectric layer(s) and n+1 conductive layers, where the n dielectric layer(s) and the n+1 conductive layers form a structure that a conductive layer and a dielectric layer are adjacent to each other, and the laminated structure forms at least two columnar structures, and n is a positive integer; and an interconnection structure configured to electrically connect an odd-numbered conductive layer in the n+1 conductive layers to the first electrode and electrically connect an even-numbered conductive layer in the n+1 conductive layers to the second electrode. According to the technical solution of the embodiments of the present application, capacitance density of the capacitor could be improved.
    Type: Grant
    Filed: September 16, 2020
    Date of Patent: February 1, 2022
    Assignee: SHENZHEN GOODIX TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11233194
    Abstract: Embodiments of the present application provide a memristor electrode material preparation method and apparatus, and a memristor electrode material. The preparation method includes: depositing a metal nitride on a substrate by a reactive sputtering process to obtain a metal nitride substrate; and subjecting the metal nitride substrate to laser annealing treatment in a nitrogen-containing atmosphere to nitride an unreacted metal on the metal nitride substrate, so as to obtain a memristor electrode material.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: January 25, 2022
    Assignee: SHENZHEN WEITONGBO TECHNOLOGY CO., LTD.
    Inventors: Guofeng Yao, Jian Shen
  • Publication number: 20220006201
    Abstract: The silicon waveguides consist of an input waveguide and an output waveguide, and the input and output silicon waveguides are arranged on the both sides of the Luneburg lens, respectively. The width of the input waveguide is larger than that of the output waveguide. The structure of the Luneburg lens is a metamaterial layer of the periodic silicon nanorod antenna array, which the upper cladding and the lower cladding are SiO2. The required refractive index distributions by the Luneburg lens can be implemented through the metamaterial structure of the gradient index profiles.
    Type: Application
    Filed: September 20, 2021
    Publication date: January 6, 2022
    Inventors: Jian Shen, Yong Zhang, Yikai Su
  • Publication number: 20210397230
    Abstract: A PCD may include an active heat transfer system configured to transfer heat from the PCD to a docking device. The active heat transfer system may include a thermoelectric cooler, a heat pipe, or other heat transfer elements. The active heat transfer system may, based on temperature measurements, be activated when the PCD is coupled to the docking device.
    Type: Application
    Filed: June 23, 2020
    Publication date: December 23, 2021
    Inventor: Jian SHEN
  • Patent number: 11183602
    Abstract: An embodiment of the present application relates to a trench capacitor and a method for manufacturing the same. The method for manufacturing the capacitor includes: fabricating a trench reaching a depth of a middle insulating layer on a semiconductor layer of an SOI substrate; and further growing an epitaxial layer of the semiconductor layer on a sidewall of the trench by selective epitaxial growth technology so as to further reduce a width of the trench; filling the trench with an electrically insulating material; and finally, fabricating two electrodes of the capacitor separately through a surface electrode. According to a trench capacitor and a method for manufacturing the same provided in an embodiment of the present application, a process flow is simple, and the capacitor manufactured has two advantages of high capacitance density and high breakdown voltage.
    Type: Grant
    Filed: October 27, 2019
    Date of Patent: November 23, 2021
    Assignee: SHENZHEN WEITONGBO TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11063113
    Abstract: A capacitor is disclosed, including: a semiconductor substrate including opposite upper and lower surfaces; one first trench disposed in the semiconductor substrate and formed downward from the upper surface; one second trench disposed in the substrate and corresponding to the first trench, and formed upward from the lower surface; a first conductive layer disposed above the substrate and in the first trench; a first insulating layer disposed between the substrate and the first conductive layer; a second conductive layer disposed on the substrate and in the first trench, the second conductive layer being electrically connected to the substrate; a second insulating layer disposed between the second conductive layer and the first conductive layer; a third conductive layer disposed below the substrate and in the second trench; and a third insulating layer disposed between the third conductive layer and the substrate, which is electrically connected to the first conductive layer.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: July 13, 2021
    Assignee: SHENZHEN WEITONGBO TECHNOLOGY CO., LTD.
    Inventors: Bin Lu, Jian Shen
  • Patent number: 11036147
    Abstract: A system for estimating front side overlay on a sample based on shape data is disclosed. The system includes a characterization sub-system and a controller. The controller includes one or more processors configured to: generate a vacuum hole map of a vacuum chuck; generate a vacuum force distribution across a sample based on the generated vacuum hole map of the vacuum chuck; determine shape data of the sample based on the vacuum force distribution and an identified relationship between backside surface roughness and vacuum force of the vacuum chuck; and convert the shape data of the sample to an overlay value of a frontside surface of the sample.
    Type: Grant
    Filed: March 6, 2020
    Date of Patent: June 15, 2021
    Assignee: KLA Corporation
    Inventors: Jian Shen, Ningqi Zhu, John McCormack, Yanfei Sun