Abstract: A light source module configured to provide a light beam along a first direction is provided. The light source module includes first to third light source groups and first to fourth beam-combining devices, wherein each of a light exiting surface of the first light source group and a light exiting surface of the third light source group is not parallel to a light exiting surface of the second light source group. An emitted light of the first light source group is transmitted along the first direction after being reflected by the first and second beam-combining devices. An emitted light of the third light source group is transmitted along the first direction after being reflected by the third and fourth beam-combining devices. An emitted light of the second light source group is transmitted along the first direction and passes through the first and third beam-combining devices.

Abstract: A surface-treated copper foil includes a treating surface, and a peak extreme height (Sxp) of the treating surface being in a range of 0.4-2.5 ?m, where the hysteresis loop of the surface-treated copper foil includes a first magnetization and a second magnetization when the magnetic field strength of the hysteresis loop is zero, and the absolute difference between the value of the first magnetization and the value of the second magnetization is in a range of 20-1200 emu/m3.

Abstract: Methods of forming semiconductor devices are provided. The methods include: forming a trench in a substrate, wherein the trench includes a defect protruding from a bottom surface of the trench; forming a flowable material on the substrate to at least partially cover the defect; performing an etching process to reduce the height of the defect; and removing the flowable material.

Abstract: Provided is a display panel, including a substrate, multiple pixel circuits, an insulating layer, multiple first electrodes, a first isolation structure, and a second isolation structure. The pixel circuits are located on the substrate. The insulating layer is located on the pixel circuits and has multiple through holes. The first electrodes are located on the insulating layer and are respectively electrically connected to the pixel circuits through the through holes. The first isolation structure is located on the insulating layer and overlaps the through holes. The second isolation structure includes multiple separating parts and multiple cover parts. The separating parts and the first isolation structure at least partially overlap, and the cover parts respectively overlap the through holes and the first isolation structure.

Abstract: The disclosure provides a data transmission device. The data transmission device includes a storage medium, a processor and a communication interface. The storage medium is configured to store a plurality of applications. The processor is coupled to the storage media and configured to determine a host application among the plurality of applications, where the host application includes a software development kit (SDK) program, and executes the SDK program of the host application to request behavior data of the plurality of applications. The communication interface is coupled to the processor and is configured to transmit the behavior data to a server.

Abstract: An electrodeposited copper foil includes a bulk copper foil. When a weight of the electrodeposited copper foil is increased to 105.0 wt % during a thermogravimetric analysis (TGA) performed on the electrodeposited copper foil at a heating rate of 5° C./min and an air flow rate of 95 mL/min, a heating temperature of the TGA is defined as T105.0 wt % and in a range of 550° C. to 750° C.

Abstract: An electronic device and an antenna feeding module are provided. The electronic device includes a metal housing and an antenna feeding module. The metal housing is provided with a slot with an opening end and a closed end. The antenna feeding module includes a carrier board and a feeding circuit. The feeding circuit includes a feeding element and a radiating element. The radiating element includes a coupling portion, a radiating branch and a feeding portion. There is a coupling gap between the coupling portion and the metal housing, and the coupling gap is less than 0.5 times the width of the slot. The feeding circuit is used to excite the metal housing, so that the metal housing and the radiating element generate a first resonance path with a first resonance mode and a second resonance path with a second resonance mode.

Abstract: An IC structure comprises a first transistor formed on a substrate, a first interconnect structure over the first transistor, a dielectric layer over the first interconnect structure, a plurality of 2D semiconductor islands on the dielectric layer, and a plurality of second transistors formed on the plurality of 2D semiconductor islands.

Abstract: An organic light-emitting panel, including a substrate, a planarization layer, a reflective layer and a bank layer, is provided. The substrate has a display region and a periphery region beside the display region. The planarization layer is disposed on the substrate and has an indentation. The reflective layer is disposed on the planarization layer. The reflective layer is formed along a sidewall of the indentation. The bank layer is disposed on the planarization layer, covers the indentation, and has a periphery taper surface. The indentation is adjacent to the periphery taper surface and is closer to the display region than the periphery taper surface. A fabrication method of the above organic light-emitting panel is also provided.

Abstract: Provided herein are IL-21 prodrugs and methods of making and using thereof for stimulating the immune system, or treating cancer or an infectious disease.

Abstract: A display panel includes a substrate, a first isolation structure, a second isolation structure and a plurality of light emitting structures. The first isolation structure is disposed on the substrate and includes a plurality of through holes. The second isolation substrate is laminated on the first isolation substrate and fills up the plurality of through holes of the first isolation substrate. The plurality of light emitting structures are disposed on the substrate and are isolated from each other via the second isolation structure.

Abstract: Implementations of the present disclosure provide methods for preventing contact damage or oxidation after via/trench opening formation. In one example, the method includes forming an opening in a structure on the substrate to expose a portion of a surface of an electrically conductive feature, and bombarding a surface of a mask layer of the structure using energy species formed from a plasma to release reactive species from the mask layer, wherein the released reactive species form a barrier layer on the exposed surface of the electrically conductive feature.

Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.

Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.

Abstract: An integrated circuit (IC) device includes a functional circuit electrically coupled to a first power supply node and operable by a first power supply voltage on the first power supply node, and a power control circuit including a first transistor and a second transistor of different types. The first transistor includes a gate terminal configured to receive a control signal, a first terminal electrically coupled to the first power supply node, and a second terminal electrically coupled to a second power supply node. The second transistor includes a gate terminal configured to receive the control signal, and first and second terminals configured to receive a predetermined voltage. The first transistor is configured to, in response to the control signal, connect or disconnect the first and second power supply nodes to provide or cutoff power supply to the functional circuit.

Abstract: A positionable probe card includes a space transformer, a plurality of positioning pins, and a probe head. The space transformer includes a space transforming substrate, the space transforming substrate includes a plurality of apertures, and the positioning pins are respectively fixed in the apertures. The probe head includes a plurality of positioning holes, and the positioning pins are respectively inserted into corresponding positioning holes. In addition, a method of manufacturing a positionable probe card is also disclosed herein.

Abstract: An electromagnetic measuring probe device for measuring a thickness of a dielectric layer of a circuit board and a method thereof are disclosed. The circuit board has at least one dielectric layer, at least two conductive layers and a test area. The test area has a test pattern and a through hole. The electromagnetic measuring probe device has a probe-measuring unit, an external conductive element, plural magnetic powder groups, and a maintaining unit. The probe-measuring unit has a transparent tube and an internal conductive pin. The external conductive element electrically connects with the test pattern. The conductive layers and the internal conductive pin generate a magnetic field while the probe-measuring unit enters into the through hole. The magnetic powder groups magnetically attracted are gathered to positions corresponding to thickness-range positions of the conductive layers and held by the maintaining unit, thus a gap between the two dielectric layers is obtained.

Abstract: A method for measuring thickness of dielectric layer in circuit board includes the following steps: First, circuit board including dielectric layer and circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes test area including test pattern and through hole. The test pattern includes first conductor and second conductors. The distance between the side of the through hole and the second conductor is less than the distance between the side of the through hole and the first conductor. Next, measuring device including conductive pin and sensing element is provided. Next, the conductive pin is powered, and one end of the conductive pin is electrically connected to the second conductor. Next, the sensing element is moved along the through hole to obtain sensing curve, and the thickness of the dielectric layer is calculated via variations of the sensing curve.

Abstract: A method for measuring a thickness of a dielectric layer in a circuit board is provided. The method for measuring the thickness of the dielectric layer includes the following steps. First, a circuit board including at least one dielectric layer and at least two circuit layers is provided. The dielectric layer is between the circuit layers, and the circuit board further includes a test area including a test pattern and a through hole. The test pattern includes at least two metal layers. Next, a measuring device including a main body, at least one light source and a lens module is provided. When the main body is moved into the through hole, the light source emits light to the dielectric layer and the metal layer, and the lens module shoots the dielectric layer and the metal layer to form a captured image. The thickness of the dielectric layer is obtained via the captured image.

Abstract: Provided are an electrolytic copper foil, an electrode comprising the same, and a lithium ion battery comprising the same. The electrolytic copper foil has a drum side and a deposited side opposing to the drum side, wherein a nanoindentation hardness of the drum side is equal to or larger than 0.5 GPa and equal to or smaller than 3.5 GPa; and a lightness of the drum side is equal to or larger than 25 and equal to or smaller than 75.