Patents by Inventor Jun Yi

Jun Yi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11289303
    Abstract: A calibrating method is provided including the following steps. A type of a first sensor and a type of a first sensor carrier are determined according to an external shape of a first object. The first sensor is carried by the first sensor carrier, and a relative coordinate of the first object is measured by the first sensor. The relative coordinate of the first object is compared with a predetermined coordinate of the first object to obtain a first object coordinate error, and the first object coordinate error is corrected. After the first object coordinate error is corrected, the first object is driven to perform an operation on a second object or the second object is driven to perform the operation on the first object. A calibrating system is also provided.
    Type: Grant
    Filed: March 10, 2020
    Date of Patent: March 29, 2022
    Assignee: Industrial Technology Research Institute
    Inventors: Yen-Cheng Chen, Chung-Yin Chang, Jun-Yi Jiang, Qi-Zheng Yang, Kai-Ming Pan, Chen-Yu Kai
  • Publication number: 20220060569
    Abstract: The present disclosure provides packet aggregation and disaggregation methods. In the packet aggregation methods, the protocol-independent packet processor (P4) switch stores plural message headers of plural packets in the ring buffer. When the plural message headers stored in the ring buffer reach a pre-defined amount of data, the P4 switch replaces the first flag header in the current packet with a second flag header so as to form a work packet. The egress pipeline of the P4 switch recirculates the work packet repeatedly, whenever it receives a work packet, a message header is extracted from a plurality of message headers in the ring buffer and added to the working packet for packet aggregation.
    Type: Application
    Filed: December 17, 2020
    Publication date: February 24, 2022
    Inventors: Shie-Yuan WANG, Jun-Yi LI, Yi-Bing LIN
  • Patent number: 11190628
    Abstract: A high-speed data-plane packet aggregation and disaggregation method is disclosed. The method includes following steps: receiving a plurality of packets by the P4 switch; parsing each of the plurality of packets by using a parse graph; determining the type of the packets by using a match-action table; conducting packet aggregation and disaggregation process at the pipeline of the P4 switch; and transmitting the aggregated packet or the original data packet to a deparser of the P4 switch and outputting the aggregated packet or the original data packet by the P4 switch.
    Type: Grant
    Filed: April 3, 2019
    Date of Patent: November 30, 2021
    Assignee: NATIONAL CHIAO TUNG UNIVERSITY
    Inventors: Shie-Yuan Wang, Chia-Ming Wu, Yi-Bing Lin, Jun-Yi Li
  • Patent number: 11188057
    Abstract: A drilling system including a feed control module, a force control module, a hole breaking control module, a conversion module and a computing unit is provided. The feed control module sets a feed force threshold and a feed speed threshold for the computing unit to determine whether the current mode satisfies a first conversion condition. The hole breaking control module sets a drilling penetration force threshold and a drilling penetration speed threshold for the computing unit to determine whether the current mode satisfies a second conversion condition. The conversion module informs to change the feed force and the feed speed according to the determination results of the two conversion conditions. The force control module provides the feed force. With the drilling system, possible impact on the workpiece due to resistance change which occurs when the drill just touches and nearly gets through the workpiece will be reduced.
    Type: Grant
    Filed: March 17, 2020
    Date of Patent: November 30, 2021
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Guan-Wei Su, Chen-Yu Kai, Kai-Ming Pan, Jun-Yi Jiang
  • Patent number: 11132376
    Abstract: A system can comprise one or more processors; and one or more non-transitory computer-readable media storing computing instructions configured to run on the one or more processors and perform: receiving a request for a write operation of an input record in a data store associated with a sharded database and an alternate-key-global-index (AKGI) database; generating a new optimistic lock value, the new optimistic lock value being unique in the sharded database; when the data store does not include a data record associated with the input record, creating the dummy data record in the data store; locking the data record for the write operation by setting the DROpLock of the data record to the new optimistic lock value; and performing the write operation of the input record in the AKGI database and the sharded database.
    Type: Grant
    Filed: February 28, 2019
    Date of Patent: September 28, 2021
    Assignee: WALMART APOLLO, LLC
    Inventors: Jason Christopher Sardina, William R. Eschenbruecher, III, Jun Yi, Yi Lu, Nitin Chhabra, III, Ying Zhang, Alexei Olkhovskii, Robert Bruce Woods, III, Scott Melvin Harvester, Robert Perry Lowell
  • Publication number: 20210269710
    Abstract: A method of fabricating the organic-inorganic hybrid coating layer includes: preparing a gel mixture including an organic precursor and colloidal silica particles; preparing a first mixed solution by heating the gel mixture; preparing a second mixed solution by adding quantum dots to the first mixed solution; and coating the second mixed solution on a substrate and irradiating light thereon to form a polymer matrix in which the organic precursor and the colloidal silica particles are crosslinked, and preparing a coating layer in which the quantum dots are dispersed in the polymer matrix, wherein the organic precursor may include at least one of dipentaerythritol pentaacrylate (DPPA) or dipentaerythritol hexaacrylate (DPHA).
    Type: Application
    Filed: February 22, 2021
    Publication date: September 2, 2021
    Inventors: Sang Ook Kang, Seung Jun Yi, Ho Jin Son, Eun Hye Yang
  • Publication number: 20210225607
    Abstract: A calibrating method is provided including the following steps. A type of a first sensor and a type of a first sensor carrier are determined according to an external shape of a first object. The first sensor is carried by the first sensor carrier, and a relative coordinate of the first object is measured by the first sensor. The relative coordinate of the first object is compared with a predetermined coordinate of the first object to obtain a first object coordinate error, and the first object coordinate error is corrected. After the first object coordinate error is corrected, the first object is driven to perform an operation on a second object or the second object is driven to perform the operation on the first object. A calibrating system is also provided.
    Type: Application
    Filed: March 10, 2020
    Publication date: July 22, 2021
    Applicant: Industrial Technology Research Institute
    Inventors: Yen-Cheng Chen, Chung-Yin Chang, Jun-Yi Jiang, Qi-Zheng Yang, Kai-Ming Pan, Chen-Yu Kai
  • Patent number: 11056904
    Abstract: An electronic device is provided, the electronic device including a communication circuit, a battery, and a processor, and the processor is configured to: obtain a strength of a communication signal received by the communication circuit; determine a magnitude of power for charging the battery based on the strength of the communication signal; and charge the battery with power of the determined magnitude.
    Type: Grant
    Filed: August 18, 2017
    Date of Patent: July 6, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hoon Choi, Yong-Youn Kim, Dong-Jun Lee, Hyang-Bok Lee, Seong-Kyu Maeng, Ki-Yong Shin, Han-Jun Yi, Jong-Wook Choi
  • Publication number: 20210162513
    Abstract: A drilling system including a feed control module, a force control module, a hole breaking control module, a conversion module and a computing unit is provided. The feed control module sets a feed force threshold and a feed speed threshold for the computing unit to determine whether the current mode satisfies a first conversion condition. The hole breaking control module sets a drilling penetration force threshold and a drilling penetration speed threshold for the computing unit to determine whether the current mode satisfies a second conversion condition. The conversion module informs to change the feed force and the feed speed according to the determination results of the two conversion conditions. The force control module provides the feed force. With the drilling system, possible impact on the workpiece due to resistance change which occurs when the drill just touches and nearly gets through the workpiece will be reduced.
    Type: Application
    Filed: March 17, 2020
    Publication date: June 3, 2021
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Guan-Wei SU, Chen-Yu KAI, Kai-Ming PAN, Jun-Yi JIANG
  • Publication number: 20210074581
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Application
    Filed: November 16, 2020
    Publication date: March 11, 2021
    Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-Yi Ruan
  • Publication number: 20210072095
    Abstract: This invention discloses a chip wiring layer temperature sensing circuit, a temperature sensing method, a chip stereo temperature sensor, and a chip thereof. The chip wiring layer temperature sensing circuit includes a metal wiring layer temperature detection module, a pulse delay detection module, and a temperature transition module; wherein the metal wiring layer temperature detection module is disposed at a metal interconnection structure of a metal wiring layer of a chip; and the metal interconnection structure is electrically connected to the pulse delay detection module; wherein the pulse delay detection module includes a system high-speed clock, a delay data generated after a pulse passing through the metal wiring layer temperature detection module detected by the system high-speed clock, and the delay data was sent to the temperature transition module; wherein the temperature transition module calculates a temperature of the metal wiring layer according to the delay data.
    Type: Application
    Filed: July 13, 2020
    Publication date: March 11, 2021
    Inventors: Bo WANG, Hongfeng ZHU, Jian LIU, Jun YI, Qibin ZHU
  • Patent number: 10849260
    Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.
    Type: Grant
    Filed: June 5, 2018
    Date of Patent: November 24, 2020
    Assignees: Fu Tai Hua Industry (Shenzhen) Co., Ltd., HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Jin-Song Zheng, Jing-Bin Liang, Hai-Gui Huang, Jun-Xi Liu, Ming-Jun Yi, Er-Hui Guo, Zhou Chen, Xi-Qiang Hu
  • Patent number: 10840134
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Grant
    Filed: April 22, 2019
    Date of Patent: November 17, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chia-Cheng Chou, Chih-Chien Chi, Chung-Chi Ko, Yao-Jen Chang, Chen-Yuan Kao, Kai-Shiang Kuo, Po-Cheng Shih, Tze-Liang Lee, Jun-yi Ruan
  • Publication number: 20200357778
    Abstract: A structure of a packaging module includes a top substrate, a bottom substrate, a first component, at least one interposer, and a first molding compound. The top substrate has a first side. The bottom substrate has a second side facing the first side of the top substrate. The first component is disposed on the first side of the top substrate or the second side of the bottom substrate. At least one interposer connects to the first side of the top substrate and the second side of the bottom substrate and surrounds the first component to form a first cavity between the top substrate and the bottom substrate. The first molding compound is injected into the first cavity to cover the first and other components.
    Type: Application
    Filed: August 28, 2019
    Publication date: November 12, 2020
    Inventor: JUN-YI XIAO
  • Publication number: 20200357922
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Application
    Filed: July 27, 2020
    Publication date: November 12, 2020
    Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
  • Publication number: 20200318007
    Abstract: The present invention relates to a method for producing a core-shell structure including a CdSe core based on a glyme solvent. The method of the present invention enables the production of a core-shell structure including a CdSe core in a simple and economical manner. The present invention also relates to a core-shell structure including a CdSe core produced by the method. The core-shell structure of the present invention includes a large amount of CdSe and is uniform in size. Particularly, the core-shell structure of the present invention can be coated on a flexible plastic substrate of an optical device or semiconductor device due to its high stability.
    Type: Application
    Filed: May 19, 2017
    Publication date: October 8, 2020
    Applicant: KOREA UNIVERSITY RESEARCH AND BUSINESS FOUNDATION, SEJONG CAMPUS
    Inventors: Seung Jun YI, Sang Ook KANG, Ho-Jin SON
  • Publication number: 20200322465
    Abstract: A high-speed data-plane packet aggregation and disaggregation method is disclosed. The method includes following steps: receiving a plurality of packets by the P4 switch; parsing each of the plurality of packets by using a parse graph; determining the type of the packets by using a match-action table; conducting packet aggregation and disaggregation process at the pipeline of the P4 switch; and transmitting the aggregated packet or the original data packet to a deparser of the P4 switch and outputting the aggregated packet or the original data packet by the P4 switch.
    Type: Application
    Filed: April 3, 2019
    Publication date: October 8, 2020
    Inventors: SHIE-YUAN WANG, CHIA-MING WU, YI-BING LIN, JUN-YI LI
  • Patent number: 10727350
    Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.
    Type: Grant
    Filed: July 27, 2018
    Date of Patent: July 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Yao-Jen Chang, Chih-Chien Chi, Chen-Yuan Kao, Hung-Wen Su, Kai-Shiang Kuo, Po-Cheng Shih, Jun-Yi Ruan
  • Patent number: 10585923
    Abstract: A computer provides search suggestions by capturing data from a first application, wherein the data includes data displayed on a screen by the first application. The computer segments the data from the first application into blocks. The computer extracts words from the data from the first application. The computer generates tokens of phrases and words using natural language processing tokenization. The computer scores the blocks based upon the data from the first application. The computer scores the tokens based upon the scoring of the blocks and the data from the first application. The computer detects a switch action from the first application to a second application, wherein the second application contains a search function. The computer provides the scored tokens to the search function of the second application.
    Type: Grant
    Filed: April 25, 2017
    Date of Patent: March 10, 2020
    Assignee: International Business Machines Corporation
    Inventors: Jun Yi Du, Yue Liu, Chuan Yang Wang
  • Patent number: D929370
    Type: Grant
    Filed: September 17, 2019
    Date of Patent: August 31, 2021
    Assignee: Hefei Tuwa Technology Co., Ltd.
    Inventors: Yu Tian, Lei Xie, Liang Zhang, Jun Yi