Abstract: In various embodiments, the gaming system and method disclosed herein provides a primary game in which the gaming system provides monetary awards to a player and a secondary game in which the gaming system provides non-monetary skill units to the player. In one such embodiment, the gaming system initiates the play of the skill-based secondary game in response to a triggering even associated with a primary game of the gaming system, and forms a score for the player based on zero, one or more inputs made by the player during the play of the skill-based secondary game. The gaming system determines an amount of non-monetary skill units to provide the player based on the score, and provides the player with the non-monetary skill units. The player redeems any amount of non-monetary skill units for one or more virtual goods offered via a virtual marketplace.

Abstract: A fabrication method of manufacturing a package a plurality of electronic components in an encapsulation body, firstly, mounting the plurality of electronic components and one ends of a plurality of metal resilient units on a substrate. After that, the plurality of electronic components and the plurality of metal resilient units are encapsulated on the substrate to form an encapsulation body with another ends of the plurality of metal resilient units exposed on an exterior surface of the encapsulation body. Then etching remaining epoxy resin on the other ends of the plurality of metal resilient units.

Abstract: One aspect of the present invention includes a reference current generator circuit. The circuit includes a bias circuit configured to generate a reference current along a first current path and a second current along a second current path. The reference current and the second current can be proportional. The circuit also includes a first pair of transistors connected in series and configured to conduct the reference current in the first current path. The circuit further includes a second pair of transistors connected in series and configured to conduct the second current in the second current path. The second pair of transistors can be coupled to the first pair of transistors to provide a collective resistance value of the second pair of transistors that is proportional to temperature.

Abstract: A backlight module includes: a light diffusion unit including a diffusing plate and a plurality of light diffusion elements formed on the diffusing plate, each of the light diffusion elements having a first diffusion pattern which has a first light-permeable region and a first light-blocking region, and a second diffusion pattern which surrounds the first diffusion pattern and which has a continuous second light-permeable region and a plurality of second light-blocking regions distributed in the continuous light-permeable region; and a light source disposed adjacent to the light diffusion unit and emitting light beams to the light diffusion unit.

Abstract: Method of updating revocation list is disclosed. Time information of revocation list indicating registration time of most recently registered revocation entity included in revocation list of first device is extracted, and time information of revocation list indicating registration time of the most recently registered revocation entity included in the revocation list of a second device connected to the first device is also extracted. A revocation entity registered in the first device after the registration time of time information of the revocation list of the second device is copied in the revocation list of the second device, if the registration time of extracted time information of the revocation list of the first device is later than the registration time of the extracted time information of the revocation list of the second device. Thus, the revocation list can be updated by connecting the first and second devices even in an offline state.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: An optical lens is adapted for used in a light source that has an optical axis, and includes a light-entering surface, a light-exiting surface, and a modified reflection surface. The light-entering surface has two first ends. The light-exiting surface defines a light-exiting surface profile that is concave toward the light source and that has two second ends. The modified reflection surface defines two modified reflection surface profiles. Each of the first ends is connected to a corresponding one of the second ends by a corresponding one of the modified reflection surface profiles. The modified reflection surface profiles are concave in the same direction as the light-exiting surface profile.

Abstract: The present invention relates to a microplasma current switch enabling to increase the amount of electric current passing through the microplasma current switch by adjusting the areas of electrodes exposed to plasmas. The present invention includes a plasma discharge space; a plasma generating means installed within the plasma discharge space; an exposed cathode electrode installed within the plasma discharge space; and an exposed anode electrode installed within the plasma discharge space apart from the exposed cathode electrode, wherein the exposed anode electrode is connected electrically to the exposed cathode electrode by generating a plasma, and the exposed area of the exposed anode electrode to the plasma is smaller than that of the exposed cathode electrode.

Abstract: An organic light emitting display apparatus that is transparent and in which transmittance of external light is high and transmittance is locally different. The organic light emitting display apparatus includes: a first region comprising a plurality of pixels for displaying an image, a first transmitting unit, and a second transmitting unit, the first and second transmitting units being for transmitting external light, and the first transmitting unit being formed smaller than the second transmitting unit; and a second region comprising a plurality of pixels for displaying an image and another first transmitting unit for transmitting external light.

Abstract: One aspect of the present invention includes a reference current generator circuit. The circuit includes a bias circuit configured to generate a reference current along a first current path and a second current along a second current path. The reference current and the second current can be proportional. The circuit also includes a first pair of transistors connected in series and configured to conduct the reference current in the first current path. The circuit further includes a second pair of transistors connected in series and configured to conduct the second current in the second current path. The second pair of transistors can be coupled to the first pair of transistors to provide a collective resistance value of the second pair of transistors that is proportional to temperature.

Abstract: A molding device for a semiconductor chip package includes a first molding die, a second molding die opposite to the first molding die and a plurality of pistons. The second molding die defines a plurality of cylinders for receiving the corresponding pistons. The first molding die and the second molding die collectively form a molding cavity to accommodate a substrate. The first molding die includes a protruding portion defining a groove opening towards the second molding die. The protruding portion and the second molding die collectively form an entrance and an exit on two sides of the groove. Each of the plurality of pistons is compressed to force a molding compound flowing through the entrance, the groove and the exit to fill into the molding cavity so as to encapsulate the substrate.

Abstract: A multi-layer ceramic electronic component includes a ceramic base, a pair of exterior electrodes located on two ends of the ceramic base, respectively, an inner electrode embedded in the ceramic base, and a solder blocking layer located between the pair of the exterior electrodes and projecting from an exterior surface of the ceramic base.

Abstract: An exemplary electronic package structure includes a substrate configured with a solder pad, a metal support element, an electronic component connected to the solder pad, and an encapsulation body. The metal support element is located between the solder pad and the electronic component. As a result, a gap is defined between the substrate and the electronic component. A height of the gap is equal to a height of the solder pad plus a height of the metal support element. The encapsulation body encapsulates the electronic component together with the substrate and the gap is completely filled with material of the encapsulation body.

Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 5% to 30% by weight of crystallization modifier; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of one or more ingredients selected from polyamide polymers. The resin composition has a low crystallization temperature and an appropriate crystallization rate.

Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 0% to 30% by weight of reinforcer; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of PCT and derivatives of PCT. The resin composition has a low crystallization temperature and an appropriate crystallization rate.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 5% to 30% by weight of crystallization modifier; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of polyethylene terephthalate and derivatives of polyethylene terephthalate. The resin composition has a low the crystallization temperature and an appropriate crystallization rate.

Abstract: Provided are methods of manufacturing semiconductor devices by which two different kinds of contact holes with different sizes are formed using one photolithography process. The methods include preparing a semiconductor substrate in which an active region is titled in a diagonal direction. A hard mask is formed on the entire surface of the semiconductor substrate. A mask hole is patterned not to overlap a word line. A first oxide layer is deposited on the hard mask, and the hard mask is removed to form a piston-shaped sacrificial pattern. A first polysilicon (poly-Si) layer is deposited on the sacrificial pattern and patterned to form a cylindrical first sacrificial mask surrounding the piston-shaped sacrificial pattern. A second oxide layer is coated on the first sacrificial mask to such an extent as to form voids. A second poly-Si layer is deposited in the voids and patterned to form a pillar-shaped second sacrificial mask. The second oxide layer is removed to expose the active region.

Abstract: A package structure comprising a first substrate, a second substrate, an encapsulation layer sandwiched between the first and second substrates, and at least one electronic component mounted on the first substrate and isolated from the second substrate by the encapsulation layer. At least one conducting hole is defined in the encapsulation layer to communicate the at least one electronic component with the second substrate. An inner wall of each of the at least one conducting hole is coated with a first metal layer to electrically connect the at least one electronic component to the second substrate.

Abstract: The novel group of polymers is presented under the name of Powdered Metastable Polymer Material (PMPM). PMPM is in a chemically stable state at an ambient temperature of 25° C. for a relatively long time, but it is in a thermodynamically unstable state, and may change to either a stable state (in this case, re-vulcanization), or an unstable state (in this case, decomposition). According to the prior art, these PMPMs are, under various conditions, reactive, malleable, processable, compoundable, re-vulcanizable and re-polymerizable, and thus makes it possible to form new vulcanized or coagulated products, with or without moulds, with or without other polymers or elastomers, cross-linking agents, compatibilizers, various additives, etc.