Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A tool assembly includes a first body, a connector and a second body. The first body has a first end and a second end. A slot is defined through the wall of the body and extends from the second end of the first body to the middle portion of the first body. The slot includes a first end having a first connection portion, and a second end having a second connection portion. The connector is mounted to the second body and has an outer threaded section. The outer threaded section is threadedly connected to either the first connection portion or the second connection portion of the first body to locate the first body at different angular position relative to the second body.

Abstract: A circuit allowing self-recovery of an operating system (OS) includes a PCH chip, a switch chip, a first ROM, a second ROM, a connector, and a storage unit. The switch chip, the second ROM, and the connector are coupled to the PCH chip. The first ROM is coupled to the PCH chip through the switch chip. The second ROM controls the PCH chip to output a signal according to the state of the operating system. The first ROM stores a backup the operating system. The switch chip receives control signal from the PCH chip, and controls whether the first ROM communicates with the PCH chip, to allow recovery of the entire or part of the OS in the event that repair is required.

Abstract: A retaining device for retaining a small-sized detective sensor includes a flexible rubber body. The flexible rubber body includes a first retaining portion, a first connecting portion, a main body portion, a second connecting portion, and a second retaining portion which are connected in sequence. An inner side of the first retaining portion and an inner side of the second retaining portion are provided with primary Velcro retaining straps. An inner side of the main body portion is formed with a recess for installing the small-sized detective sensor.

Abstract: A method of manufacturing anti-EMI shielding package includes manufacturing a substrate having a grounding terminal and a first through hole with a conductive film coated on electricity connected to a grounding terminal, mounting a component on the substrate and defining a second through hole coated with a conductive film electricity connected to the first through hole, encapsulating the component with a glue-injection layer, defining a notch in the glue-injection in communication with the second through hole, forming a shielding metal layer on an outer surface of the glue-injection layer, and the shielding metal layer fills up the notch and is electricity connected to the second through hole. A method of manufacturing anti-EMI shielding package provides a simple and reliable shielding package formed with less material and low cost.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A wave filter package and a method for manufacturing wave filter packages are presented. The wave filter package includes a chip, a substrate, and a sealed wall, the sealed wall being set up between the chip and the substrate so as to form a sealed chamber. The distance between the substrate and the chip is minimized, so that the height of the sealed wall can be decreased, thereby reducing the size of a wave filter package.

Abstract: An electronic device is provided, the electronic device including a communication circuit, a battery, and a processor, and the processor is configured to: obtain a strength of a communication signal received by the communication circuit; determine a magnitude of power for charging the battery based on the strength of the communication signal; and charge the battery with power of the determined magnitude.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: According to various embodiments, an electronic device comprises: a housing including a first surface, a second surface facing in the opposite direction of the first surface, and side surfaces that surround at least a part of a space between the first surface and the second surface; a first sensor and a second sensor which are disposed in the housing or exposed through at least one surface; a communication circuit disposed in the housing; an antenna radiator electrically connected with the communication circuit; and a control circuit electrically connected with at least one of the first and second sensors, and the communication circuit, wherein the control circuit is configured to: transmit or receive, to or from an external device, a first signal output from the communication circuit, using the antenna radiator; detect, using the first sensor, whether an external object has approached within a predetermined distance at least a part of the antenna radiator to generate a second signal; detect, using the second

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: Methods, computer program products, and system are presented. The methods include, for instance: identifying, by one or more processor, a current task, obtaining, by the one or more processor, an indicator of a commencement of a switching event, where the switching event includes a transition originating from the current task and concluding at a new task, obtaining, by the one or more processor, behavior analysis data relating to a plurality of past switching events, where each past switching event includes a transition originating from the current task and concluding at a target task. The behavior analysis data includes a timestamp for each past switching event. The method also includes determining, by the one or more processor, based on the behavior analysis data, at least one recommended task, where the at least one recommended task includes at least one target task.

Abstract: The invention relates to a DNA sequence for increase of a mutation rate over a specific region of DNA. Particularly, the invention provides a unique guanine nucleotide sequence and a mutator insertion sequence incorporated with the guanine nucleotide sequence and their applications in increasing a mutation rate.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A method and associated apparatus for processing video data are provided. The video data includes a first frame formed by a plurality of macroblocks. The method includes providing a memory, deblocking a first macroblock in the first frame, and writing the deblocked macroblock into the memory. The step of writing the deblocked macroblock lets a plurality of pixel data of the deblocked macroblock to be stored to a first storage space at consecutive addresses in the memory.

Abstract: In various embodiments, the gaming system and method disclosed herein provides a primary game in which the gaming system provides monetary awards to a player and a secondary game in which the gaming system provides non-monetary skill units to the player. In one such embodiment, the gaming system initiates the play of the skill-based secondary game in response to a triggering even associated with a primary game of the gaming system, and forms a score for the player based on zero, one or more inputs made by the player during the play of the skill-based secondary game. The gaming system determines an amount of non-monetary skill units to provide the player based on the score, and provides the player with the non-monetary skill units. The player redeems any amount of non-monetary skill units for one or more virtual goods offered via a virtual marketplace.

Abstract: According to various embodiments, an electronic device comprises: a housing including a first surface, a second surface facing in the opposite direction of the first surface, and side surfaces that surround at least a part of a space between the first surface and the second surface; a first sensor and a second sensor which are disposed in the housing or exposed through at least one surface; a communication circuit disposed in the housing; an antenna radiator electrically connected with the communication circuit; and a control circuit electrically connected with at least one of the first and second sensors, and the communication circuit, wherein the control circuit is configured to: transmit or receive, to or from an external device, a first signal output from the communication circuit, using the antenna radiator; detect, using the first sensor, whether an external object has approached within a predetermined distance at least a part of the antenna radiator to generate a second signal; detect, using the second

Abstract: An anti-EMI shielding package includes a substrate, a component disposed on the substrate, a glue-injection layer, and a shielding metal layer covering the outer surface of the glue-injection layer. A grounding terminal is positioned on an outer side of the substrate. The substrate defines a first through hole, the component defines a second through hole, and a conductive layer is coated on the inner wall of the first through hole and the second through hole. The shielding metal layer, the conductive layer of the second through hole, the conductive layer of the first through hole, and the grounding terminal are connected and form a conductive loop, the shielding metal layer being grounded. A method of making same provides a simple and reliable shielding package formed with less material and low cost.