Abstract: A package assembly for divided electromagnetic shielding includes a substrate, pad groups, chips, a first colloid, an electromagnetic shielding layer, and a second colloid. The pad groups on the substrate are separate and electrically connected to the substrate. Chips are soldered on the pad groups, and each chip corresponds to one pad group. The first colloid covers the chips as a seal, the electromagnetic shielding layer being electroplated onto the outer layer of the first colloid. The second colloid is injected on an outer layer of the electromagnetic shielding layer to cover the electromagnetic shielding layer and form a package assembly. The package assembly can be cut into separate products. A method of manufacturing the package assembly is also provided.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for surrounding dielectric layers. The insert layer may be applied between two dielectric layers. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A machine verification system is provided, including a machine, an online server and a user end. The machine has identification information which corresponds to the machine and has a prompt unit. The online server is communicatively connected to the machine via internet. The user end is communicatively connected to the online server via the internet. The user end sends, via the internet, a request information which matches the identification information, through the online server and to the machine, the machine displays information to be verified on the prompt unit, the user end obtains the information to be verified on the prompt unit and sends, via the internet, verification information which matches the information to be verified through the online server to the machine, and if the verification information matches the information to be verified, the machine executes an operation command.

Abstract: A light-emitting device comprises a semiconductor structure comprising a first conductivity-type semiconductor layer, a second conductivity-type semiconductor layer, a first intermediate layer, a second intermediate layer, and an active region capable of emitting radiation, wherein the active region is between the first intermediate layer and the second intermediate layer, the first intermediate layer is in direct contact with the first conductivity-type semiconductor layer, the second intermediate layer is in direct contact with the second conductivity-type semiconductor layer, and the active region comprises alternated well layers and barrier layers, wherein each barrier layer has a thickness; wherein a first difference between a refractive index of the first intermediate layer and a refractive index of the first conductivity-type semiconductor layer is less than a second difference between a refractive index of the second intermediate layer and a refractive index of the second conductivity-type semiconduct

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.

Abstract: A method for indicating and alarming about wet level of a diaper involves using a humidity sensor to perform relative humidity detection on the diaper, when the detected relative humidity is below 50% rh˜60% rh, showing the diaper's wet level as 0% rh, and when the detected relative humidity is 85% rh˜95% rh or more, showing the diaper's wet level as 100% rh, wherein functional conversion is performed to convert the relative humidity ranging between 60% rh and 85% rh˜95% rh proportionally into the diaper's wet level between 0% rh and 100% rh.

Abstract: A method for detecting an infant's urination includes: determining that Condition 1 is satisfied if a relative humidity value collected lastly is greater than humidity values of previous N times and is 1% rh˜3% rh greater than a minimum of the previous N times; determining that Condition 2 is satisfied and the first urination has happened if humidity values collected in continuous M times satisfy Condition 1, and the humidity value collected in the Mth time is 3% rh˜6% rh greater than a minimum of the previous N+M times; starting to detect a second urination when humidity variation becomes steady; and determining that the second urination has happened if a time for humidity to increase 0.1% rh is less than a half of a previous time for humidity to increase 0.1% rh, and a next time for humidity to increase 0.1% rh is also less than a half of the previous time.

Abstract: A computer provides search suggestions by capturing data from a first application, wherein the data includes data displayed on a screen by the first application. The computer segments the data from the first application into blocks. The computer extracts words from the data from the first application. The computer generates tokens of phrases and words using natural language processing tokenization. The computer scores the blocks based upon the data from the first application. The computer scores the tokens based upon the scoring of the blocks and the data from the first application. The computer detects a switch action from the first application to a second application, wherein the second application contains a search function. The computer provides the scored tokens to the search function of the second application.

Abstract: A computer provides search suggestions by capturing data from a first application, wherein the data includes data displayed on a screen by the first application. The computer segments the data from the first application into blocks. The computer extracts words from the data from the first application. The computer generates tokens of phrases and words using natural language processing tokenization. The computer scores the blocks based upon the data from the first application. The computer scores the tokens based upon the scoring of the blocks and the data from the first application. The computer detects a switch action from the first application to a second application, wherein the second application contains a search function. The computer provides the scored tokens to the search function of the second application.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A tool assembly includes a first body, a connector and a second body. The first body has a first end and a second end. A slot is defined through the wall of the body and extends from the second end of the first body to the middle portion of the first body. The slot includes a first end having a first connection portion, and a second end having a second connection portion. The connector is mounted to the second body and has an outer threaded section. The outer threaded section is threadedly connected to either the first connection portion or the second connection portion of the first body to locate the first body at different angular position relative to the second body.

Abstract: A circuit allowing self-recovery of an operating system (OS) includes a PCH chip, a switch chip, a first ROM, a second ROM, a connector, and a storage unit. The switch chip, the second ROM, and the connector are coupled to the PCH chip. The first ROM is coupled to the PCH chip through the switch chip. The second ROM controls the PCH chip to output a signal according to the state of the operating system. The first ROM stores a backup the operating system. The switch chip receives control signal from the PCH chip, and controls whether the first ROM communicates with the PCH chip, to allow recovery of the entire or part of the OS in the event that repair is required.

Abstract: A retaining device for retaining a small-sized detective sensor includes a flexible rubber body. The flexible rubber body includes a first retaining portion, a first connecting portion, a main body portion, a second connecting portion, and a second retaining portion which are connected in sequence. An inner side of the first retaining portion and an inner side of the second retaining portion are provided with primary Velcro retaining straps. An inner side of the main body portion is formed with a recess for installing the small-sized detective sensor.

Abstract: A method of manufacturing anti-EMI shielding package includes manufacturing a substrate having a grounding terminal and a first through hole with a conductive film coated on electricity connected to a grounding terminal, mounting a component on the substrate and defining a second through hole coated with a conductive film electricity connected to the first through hole, encapsulating the component with a glue-injection layer, defining a notch in the glue-injection in communication with the second through hole, forming a shielding metal layer on an outer surface of the glue-injection layer, and the shielding metal layer fills up the notch and is electricity connected to the second through hole. A method of manufacturing anti-EMI shielding package provides a simple and reliable shielding package formed with less material and low cost.

Abstract: An apparatus for disassembling an electronic component from a circuit board includes a base, a controller, a positioning assembly, and a heating and suction assembly. The controller is fixed to the base. The positioning assembly is arranged on the base and coupled to the controller. The positioning assembly is configured to be controlled by the controller to position the circuit board at a first predetermined position. The heating and suction assembly is movably arranged on the base and coupled to the controller. The heating and suction assembly is moved to a second predetermined position to heat the electronic component and moved to a third predetermined position to attract and hold the heated electronic component by suction, whereby the electronic component is disassembled from the circuit board.

Abstract: A wave filter package and a method for manufacturing wave filter packages are presented. The wave filter package includes a chip, a substrate, and a sealed wall, the sealed wall being set up between the chip and the substrate so as to form a sealed chamber. The distance between the substrate and the chip is minimized, so that the height of the sealed wall can be decreased, thereby reducing the size of a wave filter package.

Abstract: An electronic device is provided, the electronic device including a communication circuit, a battery, and a processor, and the processor is configured to: obtain a strength of a communication signal received by the communication circuit; determine a magnitude of power for charging the battery based on the strength of the communication signal; and charge the battery with power of the determined magnitude.

Abstract: A device, structure, and method are provided whereby an insert layer is utilized to provide additional support for weaker and softer dielectric layer. The insert layer may be applied between two weaker dielectric layers or the insert layer may be used with a single layer of dielectric material. Once formed, trenches and vias are formed within the composite layers, and the insert layer will help to provide support that will limit or eliminate undesired bending or other structural motions that could hamper subsequent process steps, such as filling the trenches and vias with conductive material.