Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 5% to 30% by weight of crystallization modifier; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of one or more ingredients selected from polyamide polymers. The resin composition has a low crystallization temperature and an appropriate crystallization rate.

Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 0% to 30% by weight of reinforcer; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of PCT and derivatives of PCT. The resin composition has a low crystallization temperature and an appropriate crystallization rate.

Abstract: A package structure comprises a substrate, a plurality of electronic components configured and structured on the substrate, a plurality of metal resilient units electrically connected to the substrate, and an encapsulation body encapsulating the plurality of electronic components and the plurality of resilient units together with the substrate. Part of each of the plurality of metal resilient units away from the substrate is exposed out of an exterior surface of the encapsulation body.

Abstract: A resin composition used to being injection molded to metal to make composite of resin and metal, comprises 40% to 90% by weight of main resin, 5% to 30% by weight of crystallization modifier; and 0% to 40% by weight of filler. The main resin comprises one or more ingredients selected from a group consisting of polyethylene terephthalate and derivatives of polyethylene terephthalate. The resin composition has a low the crystallization temperature and an appropriate crystallization rate.

Abstract: Provided are methods of manufacturing semiconductor devices by which two different kinds of contact holes with different sizes are formed using one photolithography process. The methods include preparing a semiconductor substrate in which an active region is titled in a diagonal direction. A hard mask is formed on the entire surface of the semiconductor substrate. A mask hole is patterned not to overlap a word line. A first oxide layer is deposited on the hard mask, and the hard mask is removed to form a piston-shaped sacrificial pattern. A first polysilicon (poly-Si) layer is deposited on the sacrificial pattern and patterned to form a cylindrical first sacrificial mask surrounding the piston-shaped sacrificial pattern. A second oxide layer is coated on the first sacrificial mask to such an extent as to form voids. A second poly-Si layer is deposited in the voids and patterned to form a pillar-shaped second sacrificial mask. The second oxide layer is removed to expose the active region.

Abstract: A package structure comprising a first substrate, a second substrate, an encapsulation layer sandwiched between the first and second substrates, and at least one electronic component mounted on the first substrate and isolated from the second substrate by the encapsulation layer. At least one conducting hole is defined in the encapsulation layer to communicate the at least one electronic component with the second substrate. An inner wall of each of the at least one conducting hole is coated with a first metal layer to electrically connect the at least one electronic component to the second substrate.

Abstract: The novel group of polymers is presented under the name of Powdered Metastable Polymer Material (PMPM). PMPM is in a chemically stable state at an ambient temperature of 25° C. for a relatively long time, but it is in a thermodynamically unstable state, and may change to either a stable state (in this case, re-vulcanization), or an unstable state (in this case, decomposition). According to the prior art, these PMPMs are, under various conditions, reactive, malleable, processable, compoundable, re-vulcanizable and re-polymerizable, and thus makes it possible to form new vulcanized or coagulated products, with or without moulds, with or without other polymers or elastomers, cross-linking agents, compatibilizers, various additives, etc.

Abstract: Electronic devices with more than one video output terminals and capable of providing distinct videos at different video output terminals. The electronic device comprises first and second display processors driving first and second video output terminals, respectively. The first display processor comprises a blender and a multiplexer. The blender blends a video with image signals, provides a fully-blended video for the first video output terminal, outputs the video, the partly-blended videos and the fully-blended video to the multiplexer. The second display processor is coupled between the output terminal of the multiplexer and the second video output terminal.

Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.

Abstract: A semiconductor assembly package includes a package unit, a shielding layer and a protection layer. The package unit includes a semiconductor assembly, a daughter substrate and a mold compound. The semiconductor assembly is disposed on and electrically connected to the daughter substrate. The daughter substrate includes a metal portion grounded. The mold compound encapsulates the semiconductor assembly and the daughter substrate to expose the metal portion out of the package unit. The shielding layer is applied to the package unit and electrically connected to the metal portion, to provide electromagnetic shielding for the semiconductor assembly. The non-conductive protection layer is covered on the shielding layer.

Abstract: Provided are methods of manufacturing semiconductor devices by which two different kinds of contact holes with different sizes are formed using one photolithography process. The methods include preparing a semiconductor substrate in which an active region is titled in a diagonal direction. A hard mask is formed on the entire surface of the semiconductor substrate. A mask hole is patterned not to overlap a word line. A first oxide layer is deposited on the hard mask, and the hard mask is removed to form a piston-shaped sacrificial pattern. A first polysilicon (poly-Si) layer is deposited on the sacrificial pattern and patterned to form a cylindrical first sacrificial mask surrounding the piston-shaped sacrificial pattern. A second oxide layer is coated on the first sacrificial mask to such an extent as to form voids. A second poly-Si layer is deposited in the voids and patterned to form a pillar-shaped second sacrificial mask. The second oxide layer is removed to expose the active region.

Abstract: A communication method for performing communication between a specific user equipment and a network to count the number of user equipments, which desire to receive a specific broadcast/multicast service in a mobile communication system, comprises receiving a first message from the network, the first message being transmitted to count the number of user equipments which desire to receive the broadcast/multicast service; and transmitting a second message to the network in response to the first message, the second message being a first layer message or second layer message of the network.

Abstract: The present technology generally relates to skin care compositions, cosmeceuticals or formulations and methods of making or using the same. More specifically, the presently described technology generally relates to methods of making and using compositions, cosmeceuticals or formulations including a unique composition collected and refine from a gastropod, namely Helix Aspersa Müller, among others.

Abstract: The present invention relates to a microplasma current switch enabling to increase the amount of electric current passing through the microplasma current switch by adjusting the areas of electrodes exposed to plasmas. The present invention includes a plasma discharge space; a plasma generating means installed within the plasma discharge space; an exposed cathode electrode installed within the plasma discharge space; and an exposed anode electrode installed within the plasma discharge space apart from the exposed cathode electrode, wherein the exposed anode electrode is connected electrically to the exposed cathode electrode by generating a plasma, and the exposed area of the exposed anode electrode to the plasma is smaller than that of the exposed cathode electrode.

Abstract: In a method of forming a wire structure, first active regions and second active regions are formed on a substrate. Each of the first active regions has a first sidewall of a positive slope and a second sidewall opposed to the first sidewall. The second active regions are arranged along a first direction. An isolation layer is between the first active regions and the second active regions. A first mask is formed on the first active regions, the second active regions and the isolation layer. The first mask has an opening exposing the first sidewall and extending along the first direction. The first active regions, the second active regions and the isolation layer are etched using the first mask to form a groove extending along the first direction and to form a fence having a height substantially higher than a bottom face of the groove. A wire is formed to fill the groove. A contact is formed on the wire. The contact is disposed toward the second active regions from the fence.

Abstract: A method for controlling an uplink connection of an idle UE in a wireless communication system is disclosed.

Abstract: A method of performing random access procedure in a wireless communication system is disclosed. The present invention includes the steps of receiving a first message transmitted to count the number of user equipments attempting to receive the broadcast/multicast service from a network, transmitting a preamble for a random access to the network, receiving a second message including a user equipment identifier for identifying the user equipment and uplink (UL) radio resource allocation information in response to the preamble from the network, transmitting a third message to the network using the uplink radio resource allocation information, and stopping the random access in case of receiving a contention resolution message from the network.

Abstract: A memory cell for an electrically writeable and erasable memory medium as well as a memory medium thereof is provided. The memory cell comprises a data recording element, the data recording element has a plurality of multiple-layer structure disposed one on top of another; each the multiple-layer structure comprising a plurality of sequentially disposed individual layers. At least one of the plurality of individual layers is capable of changing phase between a crystalline state and an amorphous state in response to an electrical pulse, one of the plurality of individual layers having at least one atomic element which is absent from other one of the plurality of individual layers, and the plurality of multiple-layer structure is of a superlattice-like structure to lower a heat diffusion out of the data recording element to shorten a phase change time of the respective individual layers.

Abstract: Electronic devices with more than one video output terminals and capable of providing distinct videos at different video output terminals. The electronic device comprises first and second display processors driving first and second video output terminals, respectively. The first display processor comprises a blender and a multiplexer. The blender blends a video with image signals, provides a fully-blended video for the first video output terminal, outputs the video, the partly-blended videos and the fully-blended video to the multiplexer. The second display processor is coupled between the output terminal of the multiplexer and the second video output terminal.

Abstract: The invention relates to a method of fabricating a flexible-rigid PCB which includes a flexible circuit substrate and a rigid circuit substrate. The flexible circuit substrate defines a rigid region and an exposed region and has a conductive pattern, such as conductive traces, formed on the exposed region. The method includes the steps of providing the flexible circuit substrate; printing a paste containing epoxy-silicone hybrid materials onto the conductive pattern; curing the paste; and building up the rigid circuit substrate on the rigid region of the flexible circuit substrate. Particularly, the paste having a specific composition is subjected to predetermined conditions of temperature and time in order to transform the paste into a peelable mask with heat resistance, chemical resistance and a contact angle greater than 20 degrees.