Abstract: The present disclosure provides a semiconductor structure. The semiconductor structure includes an insulation layer. A bottom electrode via is disposed in the insulation layer. The bottom electrode via includes a conductive portion and a capping layer over the conductive portion. A barrier layer surrounds the bottom electrode via. A magnetic tunneling junction (MTJ) is disposed over the bottom electrode via.

Abstract: A vertical oscillation auxiliary platform, wherein a drive mechanism drives an upper cover tread board to make vertical up-and-down movements with a transmission mechanism; when the drive mechanism drives a transmission shaft rotate, the transmission shaft drives lower parts of 8-shaped bearing blocks to rotate eccentrically, and upper parts thereof move horizontally; the 8-shaped bearing blocks drive one end of triangular bearing blocks to move horizontally with horizontal transmission rods, and the triangular bearing blocks, without moving a third end, convert horizontal movements at one end to be vertical movements at another end, and drive finally the upper cover tread board to generate stable vertical oscillation, so that singularity and stability of vertical movements of the upper cover tread board can be promised, and more stable and comfortable feeling and passive exercise effects can be gained, without deteriorating the exercise effects and exercise comfort due to additional disorganized lateral move

Abstract: A power supply including a first conversion circuit, a second conversion circuit, a first output capacitor, a second output capacitor, a first discharge circuit, and a second discharge circuit is provided. The first conversion circuit converts a first alternating current (AC) power to a first direct current (DC) power. The second conversion circuit converts a second AC power to a second DC power. The first output capacitor is configured to store the first DC power. The second output capacitor is configured to store the second DC power. The first discharge circuit provides a first discharge path to discharge the first output capacitor in response to the first DC power being greater than the second DC power. The second discharge circuit provides a second discharge path to discharge the second output capacitor in response to the second DC power being greater than the first DC power.

Abstract: Provided is a fingerprint sensing system disposed under a display. The fingerprint sensing system includes a sensor and a controller. The sensor has a plurality of sensing pixels arranged into an array, and the sensing pixels includes at least one functional sensing pixel. The controller is electrically connected to the sensor. The controller calculates an environmental parameter according to a signal obtained by the at least one functional sensing pixel.

Abstract: A method of forming integrated circuits includes forming Magnetic Tunnel Junction (MTJ) stack layers, depositing a conductive etch stop layer over the MTJ stack layers, depositing a conductive hard mask over the conductive etch stop layer, and patterning the conductive hard mask to form etching masks. The patterning is stopped by the conductive etch stop layer. The method further includes etching the conducive etch stop layer using the etching masks to define patterns, and etching the MTJ stack layers to form MTJ stacks.

Abstract: A display apparatus includes: a base substrate including a display area and a non-display area adjacent to the display area; a first power supply wire in the non-display area, a first power supply voltage being applied to the first power supply wire; a second power supply wire in the non-display area and spaced apart from the first power supply wire, a second power supply voltage being applied to the second power supply wire; and a dam overlapping the first power supply wire and the second power supply wire, having a first height on the first power supply wire, and having a second height greater than the first height between the first power supply wire and the second power supply wire.

Abstract: The present disclosure provides a method for manufacturing semiconductor structure, including forming an insulation layer, forming a first via trench in the insulation layer, forming a barrier layer in the first via trench, forming a bottom electrode via in the first via trench, forming a magnetic tunneling junction (MTJ) layer above the bottom electrode via, and performing an ion beam etching operation, including patterning the MTJ layer to form an MTJ and removing a portion of the insulation layer from a top surface.

Abstract: An in-plane magnetized spin-orbit magnetic device is provided. The in-plane magnetized spin-orbit magnetic device includes a heavy metal layer, an antiferromagnetic layer, and a magnetic tunnel junction. The antiferromagnetic layer is disposed on the heavy metal layer, and the magnetic tunnel junction is disposed on the antiferromagnetic layer. The magnetic tunnel junction includes a free layer, a barrier layer, and a pinned layer. The barrier layer is disposed on the free layer, and the pinned layer is disposed on the barrier layer. A film surface shape of the free layer is a rounded rectangle.

Abstract: A charging method with hysteresis includes the steps of: performing a pre-determination process to check whether the battery temperature of a battery cell is higher than or equal to a predetermined temperature; if the battery temperature is higher than or equal to the predetermined temperature, enabling a hysteresis mechanism; Upon the hysteresis mechanism, initially charging the battery cell with a small charging current; performing a first determination process to check whether the battery temperature decreases to a first threshold temperature; if the battery temperature decreases to the first threshold temperature, charging the battery cell with a large charging current; performing a second determination process to check whether the battery temperature increases to a second threshold temperature; and if the battery temperature increases to the second threshold temperature, charging the battery cell with the small charging current.

Abstract: A method of forming integrated circuits includes forming Magnetic Tunnel Junction (MTJ) stack layers, depositing a conductive etch stop layer over the MTJ stack layers, depositing a conductive hard mask over the conductive etch stop layer, and patterning the conductive hard mask to form etching masks. The patterning is stopped by the conductive etch stop layer. The method further includes etching the conducive etch stop layer using the etching masks to define patterns, and etching the MTJ stack layers to form MTJ stacks.

Abstract: A method of manufacturing blind rivets is revealed. First cutting a steel wire rod to get a rod with required length and forming a head portion at one end of the rod. Then performing threading on an outer surface of the rod to form outer threads and carrying out heat treatment including quenching and tempering at 380° C.±50° C. to get a threaded rod. Next cutting a steel wire rod according to a length required to get a tube and forming a through hole axially penetrating the tube and corresponding to the threaded rod. Then forming a mounting portion at an outer edge of one end of the tube, carrying out optical heat treatment at 1100° C.±100° C., and performing electroplating to get an outer tube. Lastly the threaded rod is inserted into the through hole of the outer tube and the assembly is completed.

Abstract: An electronic apparatus and a load adjusting method thereof are provided. The method includes the following steps. Powering of an external power supply is detected. A self-power consumption time of the battery from a full capacity to a preset capacity is calculated and recorded when the powering of the external power supply is detected. A first average value of multiple self-power consumption times recorded within a preset period from a current time is calculated, and the first average value is compared with a second average value of the self-power consumption times of a previous preset period of the preset period. A value of a power limit for controlling the electronic apparatus to enter a load adjusting state is adjusted according to a comparison result.

Abstract: A horizontal assembly press apparatus for performing a press-fit operation of a workpiece assembly along a horizontal axis includes a machine body unit, two moving units, two camera units, two pressing bed units and a processing unit. The machine body unit includes two main machine bodies defining an operating channel therebetween. The moving units are respectively and movably disposed on the main machine bodies. The camera units fetch images of the workpiece assembly entered the operating channel and output image signals. The pressing bed units are operated to press the workpiece assembly. The processing unit receives and analyzes the image signals, determines a target position of the horizontal axis, controls movement of the moving units to bring the pressing bed units to the target position, and controls movement of the pressing bed units to perform the press-fit operation of the workpiece assembly.

Abstract: A power supply device is provided. The power supply device includes a housing, a power converter, a controller, multiple humidity sensitive capacitors, and a feedback circuit. The housing has multiple joints. The controller controls the power converter to provide an output voltage. The humidity sensitive capacitors are respectively configured in the housing and adjacent to a corresponding joint of the joints. The humidity sensitive capacitors jointly provide a sensing capacitance value. The feedback circuit changes a gain value and a compensation bandwidth of the output voltage in response to the change of the sensing capacitance value. When the humidity of at least one of the joints increases, the sensing capacitance value is reduced, so that the gain value and the compensation bandwidth are reduced.

Abstract: A display is provided. The display device includes a display area and a non-display area located around the display area; a base layer; an organic light-emitting diode (OLED) that is located on the base layer in the display area; and a first crack detection line that is located on the base layer in the non-display area; wherein the first crack detection line comprises a first line that extends substantially in a first direction along a first edge of the display area, a second line that is separated from the first line and extends substantially in the first direction, and a third line that is connected to an end of the first line and an end of the second line, wherein a cross-sectional shape of the first line in a second direction crossing the first direction is inversely tapered.

Abstract: A display apparatus includes: a base substrate including a display area and a non-display area adjacent to the display area; a first power supply wire in the non-display area, a first power supply voltage being applied to the first power supply wire; a second power supply wire in the non-display area and spaced apart from the first power supply wire, a second power supply voltage being applied to the second power supply wire; and a dam overlapping the first power supply wire and the second power supply wire, having a first height on the first power supply wire, and having a second height greater than the first height between the first power supply wire and the second power supply wire.

Abstract: Provided is an analytical method of providing an information for diagnosis of a hepatocellular carcinoma patient having susceptibility to sorafenib, wherein the expression levels of eight genes, i.e., CDH1, CHAD, EFNA2, FANCC, MAP2K1, MEN1, PBRM1, and PPARG genes, in combination, are measured in carcinoma tissues of a hepatocellular carcinoma patient, and thereby the response (susceptibility) to sorafenib can be predicted with high accuracy, and the combination of said genes can be usefully applied as a biomarker for selecting a hepatocellular carcinoma patient having susceptibility to sorafenib.

Abstract: An electronic device and a method for manufacturing a flexible circuit board are provided. The electronic device includes the flexible circuit board. The flexible circuit board includes a first flexible substrate, a first seed layer, a first conductive layer, and a second seed layer. The first seed layer is disposed on the first flexible substrate. The first conductive layer is disposed on the first seed layer. The second seed layer is disposed on the first conductive layer. The first seed layer is in contact with the first conductive layer.

Abstract: In a method of patterning an integrated circuit, test layer thickness variation data is received when a test layer with a known thickness disposed over a test substrate undergoes tilted angle plasma etching. Overlay offset data per substrate locations caused by the tilted angle plasma etching is determined. The overlay offset data is determined based on the received thickness variation data. The overlay offset data is associated with an overlay between first circuit patterns of a first layer on the semiconductor substrate and corresponding second circuit patterns of a second layer disposed over the first layer on the substrate. A location of the substrate is adjusted based on the overlay offset data during a lithography operation to pattern a resist layer over the second layer. The second layer is patterned based on the projected layout patterns of the reticle and using the tilted angle plasma etching.

Abstract: A vertical oscillation auxiliary platform, wherein a drive mechanism drives an upper cover tread board to make vertical up-and-down movements with a transmission mechanism; when the drive mechanism drives a transmission shaft rotate, the transmission shaft drives lower parts of 8-shaped bearing blocks to rotate eccentrically, and upper parts thereof move horizontally; the 8-shaped bearing blocks drive one end of triangular bearing blocks to move horizontally with horizontal transmission rods, and the triangular bearing blocks, without moving a third end, convert horizontal movements at one end to be vertical movements at another end, and drive finally the upper cover tread board to generate stable vertical oscillation, so that singularity and stability of vertical movements of the upper cover tread board can be promised, and more stable and comfortable feeling and passive exercise effects can be gained, without deteriorating the exercise effects and exercise comfort due to additional disorganized lateral move