Patents by Inventor Jung Wang

Jung Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7715133
    Abstract: A method of the present invention duplicates data of a source medium to target media. The source medium is stored ground data and effective data, wherein the ground data are repeated to fill up the source medium and the effective data overwrite some of the ground data. Next, reading data of the source medium and comparing the data to the ground data. If the data are not as same as the ground data, then copy the data to the at least one target medium. If the data are as same as the ground data, then read the next t data of the source medium and repeating the comparing step.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: May 11, 2010
    Assignee: An Chen Computer Co., Ltd.
    Inventors: Sung-Jung Wang, Tai-Ching Chiu, Shih-Chiang Tsao
  • Publication number: 20100107317
    Abstract: An impact-protection safety structure is provided for a headwear, including an impact protector formed by a knitted resilient net lining having a suitable thickness and fixed at a suitable location on an inside surface of the headwear to serve as padding, whereby when the head of a wearer is subjected to impacts, proper buffering and protection are ensured so as to realize safety and protection against impact to the head after the headwear is worn.
    Type: Application
    Filed: November 6, 2008
    Publication date: May 6, 2010
    Inventor: Mao-Jung Wang
  • Publication number: 20100088433
    Abstract: A direct memory access (DMA) system includes a memory unit, a memory control unit electrically connected to the memory unit to control the memory unit for data import or data export, a memory bus is electrically connected to the memory unit, an intermediate control unit electrically connected to the memory bus to receive data of the memory unit through the memory bus, and a plurality of DMA units, each of which includes a DMA controller electrically connected to the intermediate control unit and the memory control unit and a data in/out unit electrically connected to the DMA controller and the intermediate control unit. The DMA controllers control the data in/out units to receive data from the intermediate control unit. The present invention may reduce the load on bandwidth of the memory bus 31 and speed up the data transmission.
    Type: Application
    Filed: October 3, 2008
    Publication date: April 8, 2010
    Applicant: AN CHEN COMPUTER CO., LTD.
    Inventor: Sung-Jung Wang
  • Publication number: 20100075760
    Abstract: A computerized wagering game system includes a gaming module operable to conduct a wagering game on which monetary value can be wagered, and a nonvolatile storage module comprising two or more partitions on at least one nonvolatile storage device and a controller operable to manage the two or more partitions.
    Type: Application
    Filed: July 10, 2007
    Publication date: March 25, 2010
    Applicant: WMS GAMING INC.
    Inventors: Jorge L. Shimabukuro, Craig J. Sylla, Jung Wang
  • Publication number: 20100066327
    Abstract: A voltage conversion apparatus includes a DC-to-DC conversion circuit, a sensing circuit, and a compensation circuit. The voltage conversion apparatus is capable of adaptively adjusting the system bandwidth according to the load. The system bandwidth is increased to make the converted voltage responding to the load rapidly when the voltage conversion apparatus is operated at a transient state; and the system bandwidth is decreased to increase the system stability when the voltage conversion circuit is operated at a steady state.
    Type: Application
    Filed: September 10, 2009
    Publication date: March 18, 2010
    Inventors: Ke-Horng Chen, Yu-Huei Lee, Shih-Jung Wang, Chun-Yu Hsieh, Ying-Hsi Lin
  • Patent number: 7646207
    Abstract: A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: January 12, 2010
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Jian-Hong Lin, Chin Chuan Peng, Shou-Chung Lee, Chien-Jung Wang, Chien Shih Tsai, Bi-Ling Lin, Yi-Lung Cheng
  • Publication number: 20090271603
    Abstract: An embedded system includes a controller and a memory. The memory includes a primary firmware module, a backup firmware module, and a boot loader module. The primary firmware module has a primary firmware id_address. The backup firmware module has a backup firmware id_address. The boot loader module has a boot loader id_address. The controller is capable of activating the boot loader module to check status of the primary firmware module via the primary firmware id_address. Upon the condition that status of the primary firmware module is ok, the controller is capable of activating the primary firmware module. Upon the condition that status of the primary firmware module is not ok, the controller is capable of activating the backup firmware module via the backup firmware id_address.
    Type: Application
    Filed: May 28, 2008
    Publication date: October 29, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: HUNG-JUNG WANG
  • Publication number: 20090177824
    Abstract: A system for setting data communication addresses includes a master device, a plurality of slave devices, and a bus. The master device is connected to the slave devices via the bus. Each of the slave devices includes a control signal pin and an ID_Set Flag. The master device controls the enable status of the control signal pins and the logical values of the slave devices to set addresses for the slave devices.
    Type: Application
    Filed: March 20, 2008
    Publication date: July 9, 2009
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Hung-Jung Wang
  • Publication number: 20090176378
    Abstract: A manufacturing method of a dual damascene structure is provided. First, a first dielectric layer, a second dielectric layer, and a mask layer are formed. A first trench structure is formed in the mask layer. A via structure is formed in the mask layer, the second dielectric layer, and the first dielectric layer. A portion of the second dielectric layer is then removed, so as to transform the first trench structure into a second trench structure. Here, a bottom of the second trench structure exposes the first dielectric layer.
    Type: Application
    Filed: March 18, 2009
    Publication date: July 9, 2009
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventor: Chih-Jung Wang
  • Publication number: 20090134526
    Abstract: An interconnect structure that may reduce or eliminate stress induced voids is provided. In an embodiment, a via is formed below a conductive line to provide an electrical connection to an underlying conductive region. The conductive line includes a widened region above the via. The widened region serves to reduce or eliminate stress induced voids between the via and the underlying conductive region. In another embodiment, one or more redundant lines are formed extending from a conductive region, such as a contact pad, such that the redundant line does not electrically couple the conductive region to an underlying conductive region. In a preferred embodiment, the redundant lines extend from a conductive region on a side adjacent to a side having a conductive line coupled to a via.
    Type: Application
    Filed: January 30, 2009
    Publication date: May 28, 2009
    Inventor: Chien-Jung Wang
  • Patent number: 7533591
    Abstract: A fast-releasing controlling device of an actuator includes a clutching means, a turning means and a pulling means. The clutching means is accommodated within a base of the actuator, and includes a fixing base and a clutch. The turning means is accommodated within the casing of the actuator and includes a swinging arm pivoted to the base. One end of the swinging arm is arranged to correspond to the clutch so as to control clutching action of the clutch relative to the fixing base. The pulling means includes a pulling rod assembly. One end of the pulling rod assembly is accommodated within the casing and connected to the swinging arm, and the other end thereof penetrates out of the casing and is joined with a connecting block.
    Type: Grant
    Filed: March 3, 2007
    Date of Patent: May 19, 2009
    Assignee: T-Motion Technology Co., Ltd.
    Inventor: Chia-Jung Wang
  • Patent number: 7531448
    Abstract: A manufacturing method of a dual damascene structure is provided. First, a barrier layer, a first dielectric layer, a second dielectric layer, a cap layer, a metal-containing hard mask layer, a dielectric hard mask layer, a first bottom anti-reflection coating (BARC) layer and a first photoresist layer are sequentially formed over the substrate. Next, the patterned first photoresist layer is used as a mask during an etch process to form a first trench structure. A second BARC layer is formed to fill the first trench structure and to cover the surface of the dielectric hard mask layer. A second photoresist layer is formed over the second BARC layer. The patterned second photoresist layer is used as a mask during an etch process to form a first via structure. The first trench structure and the first via structure are etched to obtain a second trench structure and a second via structure.
    Type: Grant
    Filed: June 22, 2005
    Date of Patent: May 12, 2009
    Assignee: United Microelectronics Corp.
    Inventor: Chih-Jung Wang
  • Patent number: 7504731
    Abstract: An interconnect structure that may reduce or eliminate stress induced voids is provided. In an embodiment, a via is formed below a conductive line to provide an electrical connection to an underlying conductive region. The conductive line includes a widened region above the via. The widened region serves to reduce or eliminate stress induced voids between the via and the underlying conductive region. In another embodiment, one or more redundant lines are formed extending from a conductive region, such as a contact pad, such that the redundant line does not electrically couple the conductive region to an underlying conductive region. In a preferred embodiment, the redundant lines extend from a conductive region on a side adjacent to a side having a conductive line coupled to a via.
    Type: Grant
    Filed: May 2, 2007
    Date of Patent: March 17, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chien-Jung Wang
  • Publication number: 20090058434
    Abstract: A method for measuring a property of interconnections is provided. The method includes the following steps. A plurality of interconnection test patterns are provided. A pad to which the plurality of interconnection test patterns are parallelly connected is formed. At least one resistor is formed between at least one of the plurality of interconnection test patterns and the pad. The property of the plurality of interconnection test patterns is measured by applying a current, a voltage and/or a mechanical stress to the pad.
    Type: Application
    Filed: September 4, 2007
    Publication date: March 5, 2009
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Jian-Hong Lin, Chin Chuan Peng, Shou-Chung Lee, Chien-Jung Wang, Chien Shih Tsai, Bi-Ling Lin, Yi-Lung Cheng
  • Patent number: 7485912
    Abstract: A flexible scheme for forming a multi-layer capacitor structure is provided. The multi-layer capacitor structure includes a first electrode and a second electrode extending through at least one metallization layer, wherein the first electrode and the second electrode are separated by dielectric materials. In each of the metallization layers, the first electrode comprises a first bus and first fingers connected to the first bus, wherein the first bus comprises a first leg in a first direction, and wherein the first fingers are parallel to each other and are in a second direction. The first direction and the second direction form an acute angle. In each of the metallization layers, the second electrode comprises a second bus and second fingers connected to the second bus, wherein the second fingers are parallel to the first fingers in a same metallization layer.
    Type: Grant
    Filed: March 28, 2006
    Date of Patent: February 3, 2009
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventor: Chien-Jung Wang
  • Publication number: 20090003226
    Abstract: A network intermediary device which determines the connection status with remote network intermediary devices by means of generating continuously connection test packets at same or different time intervals. When one remote network intermediary device does not receive the connection test packets within a predetermined timeout interval or has received fragged or damaged packets, the connection between the local network intermediary device and the remote network intermediary device is determined to be abnormal.
    Type: Application
    Filed: June 29, 2007
    Publication date: January 1, 2009
    Inventors: Chih-Jung Wang, Ming-Chung Chen
  • Publication number: 20080273923
    Abstract: A telescoping rod structure, for a linear actuator, arranged at a connecting position of a telescoping rod of a linear actuator, mainly includes a telescoping rod, a sleeve, and a connecting cap, wherein the telescoping rod is connected to a linear transmitting mechanism, and an accommodating groove passing through the telescoping rod is arranged at top of the telescoping rod; furthermore, the sleeve, arranged in the accommodating groove, is a hollow pipe piece for accommodating a connecting element to pass through; finally, the cap is a hollow lid body, the peripheral of which is arranged a plurality of corresponding projecting seats, at each of which a thorough hole is arranged such that, when the cap is fitted onto the top of the telescoping rod, it may fix the position of the sleeve arranged at the accommodating groove, in the meantime, by making the thorough holes just correspond to the hollow position of the sleeve, it being able to facilitate the connecting element to be fitted and connected securely t
    Type: Application
    Filed: May 3, 2007
    Publication date: November 6, 2008
    Inventor: Chia-Jung WANG
  • Publication number: 20080251923
    Abstract: A semiconductor chip includes a seal ring adjacent to edges of the semiconductor chip; an opening extending from a top surface to a bottom surface of the seal ring, wherein the opening has a first end on an outer side of the seal ring and a second end on an inner side of the seal ring; and a moisture barrier having a sidewall parallel to a nearest side of the seal ring, wherein the moisture barrier is adjacent the seal ring and has a portion facing the opening.
    Type: Application
    Filed: April 10, 2007
    Publication date: October 16, 2008
    Inventors: Chien-Jung Wang, Jian-Hong Lin
  • Publication number: 20080245165
    Abstract: A slide mechanism of a linear transmission apparatus includes an actuating mechanism, a guide screw and a slide mechanism. The slide mechanism includes a fixing base, a primary guide rail, left and right secondary guide rails and a slide element. The fixing base has a through hole for passing the guide screw. The primary guide rail and each secondary guide rail are engaged to the guide screw and connected to the fixing base. The primary guide rail has a top panel and two side panels. Each secondary guide rail has an extended panel protruded from a side proximate to the primary guide rail. The top of each extended panel is not lower than the bottom of the side panel, and the slide element is sheathed onto the exterior of the guide rail, and a nut secured to the guide screw is formed in each guide rail.
    Type: Application
    Filed: April 4, 2007
    Publication date: October 9, 2008
    Inventor: Chia-Jung WANG
  • Publication number: 20080210029
    Abstract: A fast-releasing device of an activator includes a clutching means, a turning means and a pulling means. The clutching means covers on a screw rod of the activator and is accommodated within a base, and includes a fixing base and a clutch. The turning means is accommodated within the casing of the activator and includes a swinging arm pivoted to the base. One end of the swinging arm is arranged to correspond to the clutch so as to control the clutching action between the fixing base and the clutch. The pulling means includes a pulling rod assembly. One end of the pulling rod assembly is accommodated within the casing and connected to the swinging arm, and the other end thereof penetrates out of the casing and is joined with a connecting block. With the above arrangement, a curved swinging movement can be transferred into a linear displacement, thereby to substantially reduce the applied tension force of an operator.
    Type: Application
    Filed: March 3, 2007
    Publication date: September 4, 2008
    Inventor: Chia-Jung Wang