Patents by Inventor Jung Yu

Jung Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11825661
    Abstract: A planar insulating spacer layer can be formed over a substrate, and a combination of a semiconducting material layer, a thin film transistor (TFT) gate dielectric layer, and a gate electrode can be formed over the planar insulating spacer layer. A dielectric matrix layer is formed thereabove. A source-side via cavity and a drain-side via cavity can be formed through the dielectric matrix layer over end portions of the semiconducting material layer. Mechanical stress can be generated between the end portions of the semiconducting material layer by changing a lattice constant of end portions of the semiconducting material layer. The mechanical stress can enhance the mobility of charge carriers in a channel portion of the semiconducting material layer.
    Type: Grant
    Filed: July 7, 2021
    Date of Patent: November 21, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Hui-Hsien Wei, Yen-Chung Ho, Chia-Jung Yu, Yong-Jie Wu, Pin-Cheng Hsu
  • Publication number: 20230371278
    Abstract: A semiconductor device includes a semiconducting metal oxide fin located over a lower-level dielectric material layer, a gate dielectric layer located on a top surface and sidewalls of the semiconducting metal oxide fin, a gate electrode located on the gate dielectric layer and straddling the semiconducting metal oxide fin, an access-level dielectric material layer embedding the gate electrode and the semiconducting metal oxide fin, a memory cell embedded in a memory-level dielectric material layer and including a first electrode, a memory element, and a second electrode, and a bit line overlying the memory cell. The first electrode may be electrically connected to a drain region within the semiconducting metal oxide fin through a first electrically conductive path, and the second electrode is electrically connected to the bit line.
    Type: Application
    Filed: July 25, 2023
    Publication date: November 16, 2023
    Inventors: Yong-Jie WU, Yen-Chung HO, Hui-Hsien WEI, Chia-Jung YU, Pin-Cheng HSU, Mauricio MANFRINI, Chung-Te LIN
  • Publication number: 20230361221
    Abstract: A semiconductor device includes a first dielectric layer, a gate electrode embedded within the first dielectric layer, a layer stack including a gate dielectric layer, a channel layer including a semiconducting metal oxide material, and a second dielectric layer, and a source electrode and a drain electrode embedded in the second dielectric layer and contacting a respective portion of a top surface of the channel layer. A combination of the gate electrode, the gate dielectric layer, the channel layer, the source electrode, and the drain electrode forms a transistor. The total length of the periphery of a bottom surface of the channel layer that overlies the gate electrode is equal to the width of the gate electrode or twice the width of the gate electrode, and resputtering of the gate electrode material on sidewalls of the channel layer is minimized.
    Type: Application
    Filed: July 19, 2023
    Publication date: November 9, 2023
    Inventors: Yong-Jie Wu, Hui-Hsien Wei, Yen-Chung Ho, Mauricio Manfrini, Chia-Jung Yu, Chung-Te Lin, Pin-Cheng Hsu
  • Publication number: 20230354191
    Abstract: A method and an apparatus for allocating a flexible transmission slot in a wireless local area network (LAN) system are disclosed. A flexible transmission slot allocation method of an access point (AP) in a wireless local area network (WLAN) system according to an exemplary embodiment includes transmitting a beacon including a traffic indication map (TIM) bit to a station, receiving a power save poll (PS-Poll) from the station in a slot implicitly allocated by the TIM bit, and transmitting an acknowledgement (ACK) including transmission slot allocation information on downlink data to the station.
    Type: Application
    Filed: July 6, 2023
    Publication date: November 2, 2023
    Inventors: Jae Seung LEE, Mln Ho CHEONG, Hyoung Jin KWON, Hee Jung YU, Jae Woo PARK, Sok Kyu LEE
  • Publication number: 20230348003
    Abstract: A device for adjusting a seat height includes a fixation seat, an outer tube, an inner tube received in the outer tube, a cylinder housed in the inner tube, and a piston rod accommodated in the cylinder and combined with the inner tube. The fixation seat is attached to a bicycle seat. The outer tube is adapted to be connected with a bicycle frame. The piston rod can be displaced relative to the cylinder, so that the inner tube is driven by the piston rod to move relative to the outer tube within a displacement stroke, so as to adjust the height of the bicycle seat. In addition, the inner tube can be displaced relative to the piston rod by the rotation of the piston rod, so that the rider can adjust the bicycle seat height according to his own height or specific needs.
    Type: Application
    Filed: November 4, 2022
    Publication date: November 2, 2023
    Inventor: Jung-Yu Hsu
  • Publication number: 20230339068
    Abstract: A method of using a polishing pad includes applying a slurry to a first location on the polishing pad. The method further includes rotating the polishing pad. The method further includes spreading the slurry across a first region of the polishing pad at a first rate, wherein the first region includes a plurality of first grooves. The method further includes spreading the slurry across a second region, surrounding the first region of the polishing pad at a second rate different from the first rate, wherein the second region includes a plurality of second grooves. The method further includes spreading the slurry across a third region, surrounding the second region of the polishing pad at a third rate less than the first rate and the second rate, wherein the third region includes a plurality of third grooves.
    Type: Application
    Filed: June 26, 2023
    Publication date: October 26, 2023
    Inventors: ChunHung CHEN, Jung-Yu LI, Sheng-Chen WANG, Shih-Sian HUANG
  • Publication number: 20230340243
    Abstract: The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multiblock copolymer having a structure in which a polystyrene chain is attached to both ends of a polypropylene and polyolefin chain, and the thermoplastic resin composition according to the present invention has excellent elongation and tensile strength as well as high fluidity properties, and thus, may exhibit excellent molding processability.
    Type: Application
    Filed: July 30, 2021
    Publication date: October 26, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Hyun Mo Lee, Seul Ki Im, Ji Hyun Park, Yun Kon Kim, Seung Jung Yu, Seok Pil Sa, Ki Soo Lee, Eun Ji Shin
  • Publication number: 20230345740
    Abstract: A memory device and method of making the same, the memory device including bit lines disposed on a substrate; memory cells disposed on the bit lines; a first dielectric layer disposed on the substrate, surrounding the bit lines and the memory cells; a second dielectric layer disposed on the first dielectric layer; thin film transistors (TFTs) embedded in the second dielectric layer and configured to selectively provide electric power to corresponding memory cells, the TFTs comprising drain lines disposed on the memory cells, source lines disposed on the first dielectric layer, and selector layers electrically connected to the source lines and the drain lines; and word lines disposed on the second dielectric layer and electrically connected to the TFTs.
    Type: Application
    Filed: June 30, 2023
    Publication date: October 26, 2023
    Inventors: Yen-Chung HO, Hui-Hsien Wei, Mauricio MANFRINI, Chia-Jung Yu, Yong-Jie Wu, Ken-Ichi Goto, Pin-Cheng Hsu
  • Publication number: 20230326969
    Abstract: A transistor structure including a substrate, a gate structure, first pocket doped regions, second pocket doped regions, and source/drain extension regions, and source/drain regions is provided. The gate structure is located on the substrate. The first pocket doped regions are located in the substrate aside the gate structure. A dopant of the first pocket doped region includes a group IVA element. The second pocket doped regions are located in the substrate aside the gate structure. A depth of the second pocket doped region is greater than a depth of the first pocket doped region. The source/drain extension regions are located in the first pocket doped regions. The source/drain regions are located in the substrate aside the gate structure. The source/drain extension region is located between the source/drain region and the gate structure.
    Type: Application
    Filed: June 30, 2022
    Publication date: October 12, 2023
    Applicant: MACRONIX International Co., Ltd.
    Inventors: Jeng Hwa Liao, Zong-Jie Ko, Hsing-Ju Lin, Jung-Yu Shieh, Ling-Wuu Yang
  • Publication number: 20230303753
    Abstract: The present invention relates to a method for preparing a polyolefin-polystyrene-based multiblock copolymer having a uniform structure and showing excellent physical properties through continuous type coordination polymerization and batch type anionic polymerization.
    Type: Application
    Filed: August 25, 2021
    Publication date: September 28, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Yun Kon Kim, Seul Ki Im, Hyun Mo Lee, Ji Hyun Park, Dong Min Kim, Mi Kyung Kim, Ki Soo Lee, Eun Ji Shin, Seok Pil Sa, Seung Jung Yu
  • Patent number: 11767634
    Abstract: A sprayable and hygroscopic ink for a digital printing process on a fabric includes 3.0 parts by weight to 6.0 parts by weight of a colorant, 0.5 parts by weight to 2.0 parts by weight of a hygroscopic agent, 0.5 parts by weight to 1.0 part by weight of a surfactant, and a balance of a solvent, in which a pH value of the hygroscopic agent is between 6.0 and 8.5 at 25° C., and a particle diameter D90 of the sprayable and hygroscopic ink is between 180 nm and 220 nm.
    Type: Grant
    Filed: October 23, 2020
    Date of Patent: September 26, 2023
    Assignee: TAIWAN TEXTILE RESEARCH INSTITUTE
    Inventors: Jung-Yu Tsai, Chia-Yi Lin
  • Patent number: 11762507
    Abstract: A fingerprint sensing device that includes an analog-front-end (AFE) circuit, an analog-to-digital converter (ADC) and a correction circuit is introduced. The AFE circuit generates an image signal, and the ADC converts the image signal to an output digital code. The correction circuit receives a plurality of first output digital codes that are generated by performing a plurality of first fingerprint sensing operations in a plurality of first exposure time periods. The correction circuit is further configured to calculate a second exposure time period for a second fingerprint sensing operation according to the first output digital codes and the first exposure time periods, wherein the fingerprint sensing device performs the second fingerprint operation in the second exposure time period to generate a second output digital code.
    Type: Grant
    Filed: August 4, 2022
    Date of Patent: September 19, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventors: Min Huang, Jung-Yu Tsai, Chi-Ting Chen
  • Publication number: 20230287207
    Abstract: The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multi-block copolymer having a structure in which a polystyrene chain is attached to both ends of a polypropylene and polyolefin chain, and the thermoplastic resin composition according to the present invention has significantly improved low-temperature and room temperature impact strength properties as well as high fluidity properties, and thus, may exhibit excellent molding processability.
    Type: Application
    Filed: July 30, 2021
    Publication date: September 14, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Ji Hyun Park, Seul Ki Im, Hyun Mo Lee, Yun Kon Kim, Seung Jung Yu, Seok Pil Sa, Ki Soo Lee, Eun Ji Shin
  • Publication number: 20230287208
    Abstract: The present invention relates to a thermoplastic resin composition including a polyolefin-polystyrene-based multi-block copolymer having a structure in which a polystyrene chain is attached to both ends of a polypropylene and polyolefin chain, and the thermoplastic resin composition according to the present invention exhibits high fluidity properties as well as soft feel and high restoring force.
    Type: Application
    Filed: August 6, 2021
    Publication date: September 14, 2023
    Applicant: LG Chem, Ltd.
    Inventors: Tae Hee Kim, Ki Soo Lee, Eun Ji Shin, Seok Pil Sa, Seul Ki Im, Hyun Mo Lee, Ji Hyun Park, Yun Kon Kim, Seung Jung Yu
  • Patent number: 11757047
    Abstract: A semiconductor device includes a first dielectric layer, a gate electrode embedded within the first dielectric layer, a layer stack including a gate dielectric layer, a channel layer including a semiconducting metal oxide material, and a second dielectric layer, and a source electrode and a drain electrode embedded in the second dielectric layer and contacting a respective portion of a top surface of the channel layer. A combination of the gate electrode, the gate dielectric layer, the channel layer, the source electrode, and the drain electrode forms a transistor. The total length of the periphery of a bottom surface of the channel layer that overlies the gate electrode is equal to the width of the gate electrode or twice the width of the gate electrode, and resputtering of the gate electrode material on sidewalls of the channel layer is minimized.
    Type: Grant
    Filed: March 30, 2021
    Date of Patent: September 12, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yong-Jie Wu, Yen-Chung Ho, Hui-Hsien Wei, Chia-Jung Yu, Pin-Cheng Hsu, Mauricio Manfrini, Chung-Te Lin
  • Patent number: 11749016
    Abstract: A method for fingerprint recognition and a fingerprint recognition device are provided. The method includes the following steps. A touch position of a touch panel is obtained as a fingerprint position. A fingerprint recognition operation is performed according to the fingerprint position. Whether the fingerprint recognition operation is successful is determined. In response to determining that the fingerprint recognition operation is not successful, at least one first position of the touch panel as an updated fingerprint position is generated according to the touch position of the touch panel, and the fingerprint recognition operation is performed according to the updated fingerprint position.
    Type: Grant
    Filed: September 21, 2022
    Date of Patent: September 5, 2023
    Assignee: Novatek Microelectronics Corp.
    Inventor: Jung-Yu Tsai
  • Patent number: 11737288
    Abstract: A memory device and method of making the same, the memory device including bit lines disposed on the substrate; memory cells disposed on the bit lines; a first dielectric layer disposed on the substrate, surrounding the bit lines and the memory cells; a second dielectric layer disposed on the first dielectric layer; thin film transistors (TFTs) embedded in the second dielectric layer and configured to selectively provide electric power to corresponding memory cells, the TFTs comprising drain lines disposed on the memory cells, source lines disposed on the first dielectric layer, and selector layers electrically connected to the source lines and the drain lines; and word lines disposed on the second dielectric layer and electrically connected to the TFTs.
    Type: Grant
    Filed: April 5, 2021
    Date of Patent: August 22, 2023
    Assignee: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Yen-Chung Ho, Yong-Jie Wu, Chia-Jung Yu, Hui-Hsien Wei, Mauricio Manfrini, Ken-Ichi Goto, Pin-Cheng Hsu
  • Patent number: 11729715
    Abstract: A method and an apparatus for allocating a flexible transmission slot in a wireless local area network (LAN) system are disclosed. A flexible transmission slot allocation method of an access point (AP) in a wireless local area network (WLAN) system according to an exemplary embodiment includes transmitting a beacon including a traffic indication map (TIM) bit to a station, receiving a power save poll (PS-Poll) from the station in a slot implicitly allocated by the TIM bit, and transmitting an acknowledgement (ACK) including transmission slot allocation information on downlink data to the station.
    Type: Grant
    Filed: October 25, 2021
    Date of Patent: August 15, 2023
    Assignee: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Jae Seung Lee, Mln Ho Cheong, Hyoung Jin Kwon, Hee Jung Yu, Jae Woo Park, Sok Kyu Lee
  • Publication number: 20230245975
    Abstract: A semiconductor package includes a redistribution layer having a first surface and a second surface opposite to each other, the redistribution layer including a plurality of first redistribution pads on the first surface, a semiconductor chip on the second surface of the redistribution layer, an active surface of the semiconductor chip facing the redistribution layer, a plurality of conductive structures on the second surface of the redistribution layer, the plurality of conductive structures being spaced apart from the semiconductor chip, and a plurality of external connection terminals on and coupled to the conductive structures, the plurality of first redistribution pads have a pitch smaller than a pitch of the plurality of external connection terminals.
    Type: Application
    Filed: April 12, 2023
    Publication date: August 3, 2023
    Inventors: Hae-Jung YU, Kyung Suk OH
  • Publication number: 20230230412
    Abstract: A fingerprint sensing device that includes an analog-front-end (AFE) circuit, an analog-to-digital converter (ADC) and a correction circuit is introduced. The AFE circuit generates an image signal, and the ADC converts the image signal to an output digital code. The correction circuit receives a plurality of first output digital codes that are generated by performing a plurality of first fingerprint sensing operations in a plurality of first exposure time periods. The correction circuit is further configured to calculate a second exposure time period for a second fingerprint sensing operation according to the first output digital codes and the first exposure time periods, wherein the fingerprint sensing device performs the second fingerprint operation in the second exposure time period to generate a second output digital code.
    Type: Application
    Filed: August 4, 2022
    Publication date: July 20, 2023
    Applicant: Novatek Microelectronics Corp.
    Inventors: Min Huang, Jung-Yu Tsai, Chi-Ting Chen