Patents by Inventor Junichi Sasaki
Junichi Sasaki has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20090310922Abstract: Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.Type: ApplicationFiled: August 3, 2009Publication date: December 17, 2009Applicant: NEC CorporationInventor: Junichi SASAKI
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Patent number: 7620272Abstract: A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.Type: GrantFiled: April 23, 2007Date of Patent: November 17, 2009Assignee: NEC CorporationInventors: Tomoyuki Hino, Kazuhiko Kurata, Ichiro Ogura, Junichi Sasaki, Ichiro Hatakeyama, Yoichi Hashimoto, Ryosuke Kuribayashi
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Publication number: 20090245737Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.Type: ApplicationFiled: June 9, 2009Publication date: October 1, 2009Applicants: Fujikura Ltd., NEC CorporationInventors: Kunihiko Fujiwara, Akito Nishimura, Kenji Sasaki, Yukio Hayashi, Kazuhiko Kurata, Takashi Yoshikawa, Junichi Sasaki
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Patent number: 7585119Abstract: Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.Type: GrantFiled: October 5, 2006Date of Patent: September 8, 2009Assignee: NEC CorporationInventor: Junichi Sasaki
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Publication number: 20090196548Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).Type: ApplicationFiled: April 3, 2009Publication date: August 6, 2009Applicant: NEC CorporationInventors: Kasunori MIYOSHI, Kazuhiko KURATA, Takanori SHIMIZU, Ichiro HATAKEYAMA, Junichi SASAKI
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Patent number: 7559702Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.Type: GrantFiled: November 14, 2007Date of Patent: July 14, 2009Assignees: Fujikura Ltd., NEC CorporationInventors: Kunihiko Fujiwara, Akito Nishimura, Kenji Sasaki, Yukio Hayashi, Kazuhiko Kurata, Takashi Yoshikawa, Junichi Sasaki
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Patent number: 7561762Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).Type: GrantFiled: September 20, 2005Date of Patent: July 14, 2009Assignee: NEC CorporationInventors: Kazunori Miyoshi, Kazuhiko Kurata, Takanori Shimizu, Ichiro Hatakeyama, Junichi Sasaki
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Publication number: 20090148116Abstract: An intra-housing optical communication system includes card slots 61 to 64 and at least a concentrate slot and conducts the optical communication between the slots, wherein the optical wires between the card slots are connected by using an optical fiber sheet or the like to simplify the wiring and reduce the size of the housing. The concentrate slots include an optical wiring change unit 6 for changing the form of connection between the card slots, thereby making it possible to easily change the form of connection to the desired shape (mesh, ring, etc.). Also, the optical terminals of the optical connectors are shared by a plurality of the slots and thus made available for use among the optical connectors.Type: ApplicationFiled: November 18, 2005Publication date: June 11, 2009Applicant: NEC CorporationInventors: Shigeyuki Yanagimachi, Takashi Yoshikawa, Junichi Sasaki, Kazuhiko Kurata
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Publication number: 20090052909Abstract: One or more one-dimensional array-shaped photoelectric conversion modules 302 are mounted on a board 301. A one-dimensional array-shaped light receiving/emitting element 303 is mounted in each of the one-dimensional array-shaped photoelectric conversion modules 302. Further, the one-dimensional array-shaped photoelectric conversion modules 302 are mechanically and optically connected to a flexible fiber sheet 306 through an optical connector 305. As parallel transmission paths 306 from the one-dimensional array-shaped photoelectric conversion modules 302 approach an end of a board 301, they are laminated with each other and connected to a two-dimensional array-shaped optical connector 307 at an end of the board. Further, a wavelength multiplexer/demultiplexer is connected to the optical connector.Type: ApplicationFiled: January 21, 2006Publication date: February 26, 2009Applicant: NEC CORPORATIONInventors: Tomoyuki Hino, Kazuhiko Kurata, Yutaka Urino, Ichirou Ogura, Junichi Sasaki, Youichi Hashimoto
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Patent number: 7488122Abstract: An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.Type: GrantFiled: March 30, 2007Date of Patent: February 10, 2009Assignee: NEC CorporationInventors: Youichi Hashimoto, Junichi Sasaki, Ichiro Hatakeyama, Kazuhiko Kurata
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Patent number: 7473038Abstract: An optical connector according to the present invention including a connector body mounted on an optical module mounted on a circuit board, and a connector fixing member for pressing the connector body against the optical module. The connector fixing member can be engaged/disengaged with/from the circuit board, and thus the connector body can be attached/detached to/from the optical module.Type: GrantFiled: May 22, 2006Date of Patent: January 6, 2009Assignees: Fujikura Ltd., NEC CorporationInventors: Kunihiko Fujiwara, Akito Nishimura, Kenji Sasaki, Yukio Hayashi, Ichiro Hatakeyama, Youichi Hashimoto, Junichi Sasaki, Ryosuke Kuribayashi, Kazunori Miyoshi, Kazuhiko Kurata
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Publication number: 20080175544Abstract: A connector holder fixes an optical connector assembled at a leading end of an optical fiber to an optical module having a light input/output end so that the optical fiber and the light input/output end is optically connected. The connector holder is provided with a holding section for storing at least a part of the optical connector, and a cover section attached to the holding section to be freely opened and closed. The cover section is provided with a cover section main body, and a pressing section which presses the optical connector toward the optical module.Type: ApplicationFiled: November 14, 2007Publication date: July 24, 2008Applicants: FUJIKURA LTD, NEC CORPORATIONInventors: Kunihiko FUJIWARA, Akito NISHIMURA, Kenji SASAKI, Yukio HAYASHI, Kazuhiko KURATA, Takashi YOSHIKAWA, Junichi SASAKI
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Patent number: 7333683Abstract: An LSI package having an optical interface is mounted on a surface of a photoelectric wiring board. The photoelectric wiring board and the optical interface are optically connected with sufficient precision. A wiring board side guide member including socket pins and guide pins is soldered and fixed onto the photoelectric wiring board including an optical transmission line, a guide pin, and a mirror. An optical interface side guide member having a fitting hole is glued to the optical interface. The optical interface is mounted on an interposer of the LSI package. The guide pin of the photoelectric wiring board is fitted into the fitting hole formed through the interposer. The guide pin of the guide member is fitted into the fitting hole of the guide member. As a result, position alignment between the optical interface and the photoelectric wiring board is conducted with high precision.Type: GrantFiled: October 7, 2005Date of Patent: February 19, 2008Assignee: NEC CorproationInventors: Junichi Sasaki, Ichiro Hatakeyama, Kazunori Miyoshi, Hikaru Kouta, Kaichiro Nakano, Mikio Oda, Hisaya Takahashi, Mitsuru Kurihara
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Publication number: 20080036021Abstract: A semiconductor device has printed wiring board (11) where electric wiring (18) connected to LSI chip (17) and to planar optical element (21) is formed, and where optical waveguide (25) which transfers light inputted into planar optical element (21) and/or light outputted from planar optical element (21) is fixed. Planar optical element (21) is mounted in one end of small substrate (13), and another end of small substrate (13) is connected to printed wiring board (11) by solder bump (26). One end of small substrate (13) where planar optical element (21) is mounted is fixed to printed wiring board (11) by a fixing mechanism. Small substrate (13) has flexible section (15), which is easily deformable compared with other portions of printed wiring board (11) and small substrate (13), in at least a partial region between one end where planar optical element (21) is mounted and another end electrically connected to printed wiring board (11).Type: ApplicationFiled: September 20, 2005Publication date: February 14, 2008Applicant: NEC CORPORATIONInventors: Kazunori Miyoshi, Kazuhiko Kurata, Takanori Shimizu, Ichiro Hatakeyama, Junichi Sasaki
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Publication number: 20080038673Abstract: A method for adjusting the lateral critical dimension (i.e., length and width) of a feature formed in a layer on a substrate using a dry etching process. One or more thin intermediate sub-layers are inserted in the layer within which the feature is to be formed. Once an intermediate sub-layer is reached during the etching process, an etch process is performed to correct and/or adjust the lateral critical dimensions before etching through the intermediate sub-layer and continuing the layer etch.Type: ApplicationFiled: August 8, 2006Publication date: February 14, 2008Applicant: TOKYO ELECTRON LIMITEDInventors: Toshifumi Nagaiwa, Junichi Sasaki, Stefan Sawusch
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Publication number: 20070292081Abstract: An optical waveguide or first optical fiber whose one end optically connects with a light exit plane and/or light incidence plane of an optical element and whose other end optically connects with an second optical fiber and a connector for mechanically connecting the optical waveguide or the first optical fiber and the second optical fiber are included. The optical waveguide or first optical fiber is bent in order to change the traveling direction of light so that the light incoming from one end is emitted from the other end substantially in parallel with a board and the light incoming substantially in parallel with the board to the optical waveguide or first optical fiber from the other end is emitted from one end toward the optical element.Type: ApplicationFiled: March 30, 2007Publication date: December 20, 2007Applicant: NEC CORPORATIONInventors: Youichi Hashimoto, Junichi Sasaki, Ichiro Hatakeyama, Kazuhiko Kurata
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Publication number: 20070280594Abstract: A photoelectric composite module has an optical device, a package and a flexible printed circuit that is set along both case parts of the package, and electric wiring for the optical device is formed thereon. The package has a first case part and a second case part that is connected with the first case part by a hinge and is set on a mounted board. The optical device is joined with a surface that faces the first case part in said flexible printed circuit. The flexible printed circuit has light extraction means for transmitting an optical signal that should be exchanged between the optical device and the optical waveguide. The package has short-circuiting means for making a short circuit between the electrical wiring of the flexible printed circuit and the electrical wiring of the mounted board.Type: ApplicationFiled: April 23, 2007Publication date: December 6, 2007Inventors: Tomoyuki Hino, Kazuhiko Kurata, Ichiro Ogura, Junichi Sasaki, Ichiro Hatakeyama, Yoichi Hashimoto, Ryosuke Kuribayashi
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Patent number: 7210516Abstract: A casting apparatus including a die that contains a molten metal that is poured via an opening section disposed above the die. The casting apparatus also includes a heater disposed above the die, and a gas supplying structure for supplying an inter gas to a surface of the molten metal. The casting apparatus further includes a lid disposed between the surface of the molten metal and the heater, and a lid moving structure for moving the lid to the die relatively so as to control the opening amount of the opening section above the die.Type: GrantFiled: July 24, 2003Date of Patent: May 1, 2007Assignees: Mitsubishi Materials Corporation, Japan Electric Metals Corporation, LimitedInventors: Saburou Wakita, Junichi Sasaki, Yuuji Ishiwari, Kouji Tsuzukihashi
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Patent number: 7212453Abstract: Regular data inputted/outputted to/from external terminals is read/written to/from a regular cell array, and parity data is read/written from/to a parity cell array. Since the parity data is generated by a parity generation circuit, it is difficult to write a desired pattern to the parity cell array. The regular data and the parity data are exchanged with each other by a switch circuit, so that the regular data can be written to the parity cell array and the parity data can be written to the regular cell array. This enables the write of desired data to the parity cell array. A test of the parity data can be easily conducted. In particular, a leakage test or the like between memory cells can be easily conducted.Type: GrantFiled: June 20, 2005Date of Patent: May 1, 2007Assignee: Fujitsu LimitedInventors: Akira Kikutake, Yasuhiro Onishi, Kuninori Kawabata, Junichi Sasaki, Toshiya Miyo
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Publication number: 20070092185Abstract: Information processing equipment includes a photoelectric conversion module disposed on a circuit substrate, a first optical connector connected to the photoelectric conversion module through a plurality of first optical fibers and disposed to an edge portion of the circuit substrate, and a second optical connector disposed on an optical backplane and optically connected to the first optical connector. The disposing direction of the optical fibers in the photoelectric conversion module is in nonparallel with the main surface of the circuit substrate and the disposing direction of the optical fibers in the first optical connector and the disposing direction of the optical fibers in the second optical connector are in nonparallel with the main surface of the circuit substrate.Type: ApplicationFiled: October 5, 2006Publication date: April 26, 2007Inventor: Junichi Sasaki