Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: 0 ? ? ? T ? ? 1 T ? ? 2 ? A ? ( T ) ? dT - ? T ? ? 1 T ? ? 3 ? E ? ( T ) ? dT ? ? < 0.01 wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: A steam turbine having a steam supplementing structure and an operating method therefor. The steam turbine includes an outer casing and an inner casing, a rotor having a thrust balancing piston, the rotor being rotatably mounted inside the inner casing; and a steam flow channel formed between the inner casing and the rotor. Impeller blades fitted with the rotor and guide blades fitted with the inner casing are alternately arranged to form multiple stages of blade groups. Steam is fed from the steam throughflow downstream of a first designated blade staging in multiple stages of blade groups to a thrust balancing piston chamber disposed between the inner casing and the thrust balancing piston of the rotor. An interlayer for the steam to circulate is formed between the inner casing and the outer casing, the interlayer including a supplemental steam chamber which can receive the steam from a sealed chamber between the rotor and the inner casing.

Abstract: In one example in accordance with the present disclosure, a wearable communication device is described. The device includes a housing to be worn by a user and an antenna structure disposed within the housing. The antenna structure includes a substrate, a first antenna array disposed on a first surface of the substrate, and a second antenna array disposed on a second surface of the substrate. The antenna structure also includes a reflective wall facing the second surface.

Abstract: A package structure and method for forming the same are provided. The package structure includes a first through via structure formed in a substrate and a semiconductor die formed below the first through via structure. The package structure further includes a conductive structure formed in a passivation layer over the substrate. The conductive structure includes a first via portion and a second via portion, the first via portion is directly over the first through via structure, and there is no conductive material directly below and in direct contact with the second via portion.

Abstract: An LTCC microwave dielectric material, including the following components: a Ba5Si8O21+(1?a) (MgxCaySrzBa1-x-y-z)WO4+Ba—B—Si glass; wherein 0.4?a?0.8, 0?x?1, 0?y?1, 0?z?1. By adjusting the amounts of Ba5Si8O21 and (MgxCaySrzBa1-x-y-z)WO4, the temperature coefficient of resonance frequency can be adjusted to nearly zero. The material is suitable for the fields of high-frequency communication and radiofrequency. Also disclosed is a method for preparing the LTCC microwave dielectric material.

Abstract: An electronic device including two bodies, at least one hinge assembly, and a hinge cover is provided. The two bodies are pivoted to each other through the hinge assembly. The hinge cover is connected between the two bodies and covers the hinge assembly. The hinge cover includes a plurality of shell parts, and the shell parts are movably connected to each other in sequence. The hinge cover has at least one first heat dissipation opening and at least one heat dissipation flow channel, and the at least one heat dissipation flow channel communicates the first heat dissipation opening and an inner space of at least one of the bodies.

Abstract: A method for obtaining and processing image data by using a medical visual aid system including a monitor and an endoscope configured to be inserted into a body cavity and including an image capturing device and a light emitting device, the method including illuminating a field of view of the image capturing device with the light emitting device, capturing the image data using the image capturing device, providing a non-linear scaling model adapted to the body cavity, adjusting the image data by applying the non-linear scaling model such that adjusted image data is formed, and presenting the adjusted image data on the monitor.

Abstract: The present disclosure provides an interface apparatus and a display apparatus. The interface apparatus is provided with a power supply circuit and an HDMI receptacle. The power supply circuit is coupled to a first power source and the HDMI receptacle, and is configured to convert a first voltage from the first power source into a preset voltage and provide the preset voltage to the HDMI receptacle. The HDMI receptacle is configured to output the preset voltage to an external device coupled to the HDMI receptacle.

Abstract: A folding-type electronic device including a first housing, a second housing, at least one hinge structure, an elastic cover, two bearing plates, a flexible screen, first synchronous gears, and second synchronous gears is provided. The first housing and the second housing are symmetrical to a centerline. The hinge structure is respectively connected to the first housing and the second housing, and the centerline passes through the hinge structure. The elastic cover is slidably disposed between the hinge structure and the first housing and the second housing and has first racks. The bearing plates have second racks. The flexible screen is disposed on the bearing plates. Each first and second synchronous gear is respectively pivoted to the first and second housings. Each first and second synchronous gear is engaged with each corresponding first and second rack.

Abstract: A laser device for optical communication comprises a first laser unit connected to a first optical fiber for supplying a transmission laser beam thereto. wherein the laser device is configured for providing a reference laser beam in addition to the transmission laser beam. For providing the reference laser beam the laser device further includes a second laser unit connected to a second optical fiber for supplying the reference laser beam to the second optical fiber. The first laser unit is configured for providing the transmission laser beam as a linear polarized beam that is polarized in a first polarization direction, and the second laser unit is configured for providing the reference laser beam as a linear polarized beam that is polarized in a second polarization direction.

Abstract: Disclosed herein is a method of forming an electrical connecting structure having nano-twins copper. The method includes the steps of (i) forming a first nano-twins copper layer including a plurality of nano-twins copper grains; (ii) forming a second nano-twins copper layer including a plurality of nano-twins copper grains; and (iii) joining a surface of the first nano-twins copper layer with a surface of the second nano-twins copper layer, such that at least a portion of the first nano-twins copper grains grow into the second nano-twins copper layer, or at least a portion of the second nano-twins copper grains grow into the first nano-twins copper layer. An electrical connecting structure having nano-twins copper is provided as well.

Abstract: A privacy data integration method and a server are provided. The privacy data integration method includes the following steps. A first processing device and a second processing device respectively obtain a first generative model and a second generative model according to a first privacy data and a second privacy data. A server generates a first generative data and a second generative data via the first generative model and the second generative model respectively. The server integrates the first generative data and the second generative data to obtain a synthetic data.

Abstract: Methods for manufacturing a display device are provided. The methods include providing a plurality of light-emitting units and a substrate. The methods also include transferring the light-emitting units to a transfer head. The methods further include attaching at least one of the plurality of light-emitting units on the transfer head to the substrate by a bonding process, wherein the transfer head and the substrate satisfy the following equation during the bonding process: Q?|?T1T2A(T)dT??T1T3E(T)dT|<0.01, wherein A(T) is the coefficient of thermal expansion of the transfer head, E(T) is the coefficient of thermal expansion of the substrate, T1 is room temperature, T2 is the temperature of the transfer head, and T3 is the temperature of the substrate.

Abstract: Methods and systems include ways to synchronize a press machine and tending robots, including a pick robot and a drop robot, where the press machine includes an operating area for pressing a blank into a part. The pick robot and the part are moved out of the operating area while the drop robot carrying the blank is moved into the operating area. At least a portion of the pick robot and/or the part resides within the operating area at the same time at least a portion of the drop robot and/or the blank resides within the operating area. The pick robot is in communication with the drop robot and the movement of the pick robot is synchronized with the movement of the drop robot to prevent the pick robot or part from colliding with the drop robot or the blank.

Abstract: In an embodiment, a device includes: an integrated circuit die; a redistribution structure over a front-side surface of the integrated circuit die; a socket over the redistribution structure; a mechanical brace over the socket, the mechanical brace having an opening exposing the socket, edge regions of the socket overlapping edge regions of the mechanical brace at the opening; a first standoff screw disposed in the edge regions of the mechanical brace, the first standoff screw physically contacting the socket, the first standoff screw extending a first distance between the socket and the mechanical brace; and a bolt extending through the mechanical brace and the redistribution structure.

Abstract: The present application discloses a semiconductor structure and a preparation method. The semiconductor structure includes a heterojunction, including at least two sets of channel layers and barrier layers stacked sequentially; a first p-type semiconductor, disposed in a gate region of the heterojunction and extended to a bottom of the heterojunction; and a second p-type semiconductor, disposed on the gate region of the heterojunction. By providing a heterojunction including at least two sets of channel layers and barrier layers stacked sequentially, multilayer 2DEG is realized by using multilayer channel layers and barrier layers to increase the concentration of 2DEG, thereby reducing the resistance. Since a first p-type semiconductor is disposed in a gate region of the heterojunction, the p-type semiconductor materials in the first p-type semiconductor are used to deplete the 2DEG to realize normally-off and increase the threshold voltage.

Abstract: A method for obtaining and processing image data by using a medical visual aid system including a monitor and an endoscope configured to be inserted into a body cavity and having an image capturing device and a light emitting device, the method including illuminating a field of view of the image capturing device with the light emitting device, capturing the image data using the image capturing device, providing a non-linear scaling model adapted to the body cavity, adjusting the image data by applying the non-linear scaling model such that adjusted image data is formed, and presenting the adjusted image data on the monitor.

Abstract: Embodiments of the present application provide a semiconductor structure and a manufacturing method therefor. A buffer layer is disposed on a substrate layer, and the buffer layer includes a first buffer layer and a second buffer layer. By doping a transition metal in the first buffer layer, a deep level trap may be formed to capture background electrons, and diffusion of free electrons toward the substrate may also be avoided. By decreasing a doping concentration of the transition metal in the second buffer layer, a tailing effect is avoided and current collapse is prevented. By doping periodically the impurity in the buffer layer, the impurity may be as an acceptor impurity to compensate the background electrons, and then a concentration of the background electrons is reduced. By using the periodic doping method, dislocations, caused by doping, in the buffer layer may be effectively reduced.

Abstract: A display device is provided in an embodiment in the disclosure, including a subpixel region, a spacer, a light-emitting element, and a driving circuit. The spacer separates the subpixel region into a first region and a second region. The light-emitting element is located in at least one of the first region or the second region. The driving circuit is electrically connected to the first region and the second region, so as to drive the light-emitting element. A manufacturing method of the display device is also disclosed.

Abstract: A single-shot metrology for direct inspection of an entirety of the interior of an EUV vessel is provided. An EUV vessel including an inspection tool integrated with the EUV vessel is provided. During an inspection process, the inspection tool is moved into a primary focus region of the EUV vessel. While the inspection tool is disposed at the primary focus region and while providing a substantially uniform and constant light level to an interior of the EUV vessel by way of an illuminator, a panoramic image of an interior of the EUV vessel is captured by way of a single-shot of the inspection tool. Thereafter, a level of tin contamination on a plurality of components of the EUV vessel is quantified based on the panoramic image of the interior of the EUV vessel. The quantified level of contamination is compared to a KPI, and an OCAP may be implemented.