Patents by Inventor Kazuki Fujita

Kazuki Fujita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11059541
    Abstract: A bicycle hub assembly comprises a sprocket support body. The sprocket support body includes at least ten external spline teeth configured to engage with a bicycle rear sprocket assembly. Each of the at least ten external spline teeth has an external-spline driving surface and an external-spline non-driving surface.
    Type: Grant
    Filed: May 30, 2017
    Date of Patent: July 13, 2021
    Assignee: SHIMANO INC.
    Inventors: Hiroshi Fujita, Kazuki Koshiyama, Takashi Nakanishi
  • Publication number: 20210197420
    Abstract: The present invention provides a kneading method for a fiber-reinforced thermoplastic resin with which dispersibility of reinforcement fibers is enhanced and sufficient reinforcement fibers having a proper fiber length remain, and a fiber-reinforced thermoplastic resin plasticizing device and an extruding machine for carrying out the method. The kneading method comprises supplying a thermoplastic resin and reinforcement fibers into a cylinder of a plasticizing device, and rotating a screw to obtain a fiber-reinforced thermoplastic resin, wherein the size of a clearance between the bore of the cylinder and the screw is made different between an upstream side in the vicinity of a reinforcement fiber loading port and a downstream side, so that the clearance becomes larger from the vicinity of the reinforcement fiber loading port toward the downstream side compared with the upstream side.
    Type: Application
    Filed: September 26, 2018
    Publication date: July 1, 2021
    Applicant: THE JAPAN STEEL WORKS, LTD.
    Inventors: Akira YASUE, Hideki CHIBA, Daisuke KUNIHIRO, Shose NISHIDA, Kazuya TSUJI, Yasufumi FUJITA, Kazuki FUJITA, Yukihiro SUMIHIRO
  • Publication number: 20200298457
    Abstract: The present invention addresses the problem of providing a molding method capable of molding a molded article having excellent strength and reducing manufacturing costs by shortening a molding cycle when obtaining a molded article from a fiber-reinforced thermoplastic resin by compression molding. The present invention relates to a molding method which obtains a fiber-reinforced thermoplastic resin by kneading a thermoplastic resin and a reinforcing fiber (14), and a molded article from the fiber-reinforced thermoplastic resin by compression molding.
    Type: Application
    Filed: September 21, 2018
    Publication date: September 24, 2020
    Applicant: c/o THE JAPAN STREET WORKS, LTD.
    Inventors: Akira YASUE, Hideki CHIBA, Daisuke KUNIHIRO, Shoso NISHIDA, Kazuya TSUJI, Yasufumi FUJITA, Kazuki FUJITA
  • Patent number: 10695015
    Abstract: The present embodiment relates to a radiation imaging system and the like provided with a solid-state imaging device having a structure enabling reduction of linear noise appearing in an integrated image. The solid-state imaging device comprises: L pieces of imaging pixel region arranged along a direction crossing a moving direction of a relative position of the solid-state imaging device; and L pieces of A/D converter provided corresponding to the L pieces of imaging pixel region. Each imaging pixel region includes pixels arranged two-dimensionally to form an M-row by N-column matrix. Any one of the L pieces of A/D converter executes a dummy A/D conversion once or more times after an A/D conversion of an electric signal from a pixel of an m-th row, before an A/D conversion of an electric signal from a pixel of an (m+1)-th row.
    Type: Grant
    Filed: August 9, 2017
    Date of Patent: June 30, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Junichi Sawada, Ryuji Kyushima, Haruyoshi Okada, Kazuki Fujita, Harumichi Mori
  • Patent number: 10685991
    Abstract: A solid-state imaging device comprises a photodetecting section, an unnecessary carrier capture section, and a vertical shift register. The unnecessary carrier capture section has carrier capture regions arranged in a region between the photodetecting section and the vertical shift register for respective rows. Each of the carrier capture regions includes a transistor and a photodiode. The transistor has one terminal connected to the photodiode and the other terminal connected to a charge elimination line. The charge elimination line is short-circuited to a reference potential line.
    Type: Grant
    Filed: August 6, 2018
    Date of Patent: June 16, 2020
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Harumichi Mori
  • Publication number: 20200066715
    Abstract: The present embodiment relates to a photon detector which includes a preamplifier having a structure capable of preventing saturation of an amplifier. The preamplifier includes an amplifier, and further includes a capacitive element, an n-type MOSFET, and a p-type MOSFET disposed on a plurality of wirings electrically connecting the input end side and the output end side of the amplifier. A control electrode of the n-type MOSFET is set to a first fixed potential V1, while a control electrode of the p-type MOSFET is set to a second fixed potential V2.
    Type: Application
    Filed: November 16, 2017
    Publication date: February 27, 2020
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Minoru ICHIKAWA, Kazuki FUJITA
  • Patent number: 10498995
    Abstract: A solid-state imaging device includes a photodetecting section, a vertical shift register section, first row selection lines, and second row selection lines. The vertical shift register section provides the row selection lines of the m-th row with common row selection signals.
    Type: Grant
    Filed: October 27, 2017
    Date of Patent: December 3, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Junichi Sawada, Harumichi Mori
  • Publication number: 20190167214
    Abstract: The present embodiment relates to a radiation imaging system and the like provided with a solid-state imaging device having a structure enabling reduction of linear noise appearing in an integrated image. The solid-state imaging device comprises: L pieces of imaging pixel region arranged along a direction crossing a moving direction of a relative position of the solid-state imaging device; and L pieces of A/D converter provided corresponding to the L pieces of imaging pixel region. Each imaging pixel region includes pixels arranged two-dimensionally to form an M-row by N-column matrix. Any one of the L pieces of A/D converter executes a dummy A/D conversion once or more times after an A/D conversion of an electric signal from a pixel of an m-th row, before an A/D conversion of an electric signal from a pixel of an (m+1)-th row.
    Type: Application
    Filed: August 9, 2017
    Publication date: June 6, 2019
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Junichi SAWADA, Ryuji KYUSHIMA, Haruyoshi OKADA, Kazuki FUJITA, Harumichi MORI
  • Patent number: 10225491
    Abstract: A solid-state imaging device includes a photodetecting unit including MN pixels arrayed two-dimensionally in M rows and N columns, an output unit outputting a digital value generated on the basis of the amount of charge input from the pixels, and a control unit. The control unit divides the MN pixels in the photodetecting unit into unit regions each including pixels in Q rows and R columns, divides the unit regions arrayed two-dimensionally in (M/Q) rows and (N/R) columns into binning regions each including unit regions in K rows and one column, and repeatedly outputs the digital value according to the sum of amounts of the charges output from KQR pixels included in each binning region from the output unit K times in a column order for each row sequentially for the binning regions arrayed two-dimensionally in (M/KQ) rows and (N/R) columns.
    Type: Grant
    Filed: July 9, 2015
    Date of Patent: March 5, 2019
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji Kyushima, Kazuki Fujita, Haruyoshi Okada, Junichi Sawada, Harumichi Mori
  • Publication number: 20180374882
    Abstract: A solid-state imaging device comprises a photodetecting section, an unnecessary carrier capture section, and a vertical shift register. The unnecessary carrier capture section has carrier capture regions arranged in a region between the photodetecting section and the vertical shift register for respective rows. Each of the carrier capture regions includes a transistor and a photodiode. The transistor has one terminal connected to the photodiode and the other terminal connected to a charge elimination line. The charge elimination line is short-circuited to a reference potential line.
    Type: Application
    Filed: August 6, 2018
    Publication date: December 27, 2018
    Inventors: Kazuki FUJITA, Ryuji KYUSHIMA, Harumichi MORI
  • Patent number: 10090341
    Abstract: A solid-state imaging device comprises a photodetecting section, an unnecessary carrier capture section, and a vertical shift register. The unnecessary carrier capture section has carrier capture regions arranged in a region between the photodetecting section and the vertical shift register for respective rows. Each of the carrier capture regions includes a transistor and a photodiode. The transistor has one terminal connected to the photodiode and the other terminal connected to a charge elimination line. The charge elimination line is short-circuited to a reference potential line.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: October 2, 2018
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Harumichi Mori
  • Publication number: 20180070037
    Abstract: A solid-state imaging device includes a photodetecting section, a vertical shift register section, first row selection lines, and second row selection lines. The vertical shift register section provides the row selection lines of the m-th row with common row selection signals.
    Type: Application
    Filed: October 27, 2017
    Publication date: March 8, 2018
    Inventors: Kazuki FUJITA, Ryuji KYUSHIMA, Junichi SAWADA, Harumichi MORI
  • Patent number: 9909921
    Abstract: An adding unit adds an input signal generated in a signal generating unit connected to a specific pixel electrode portion out of pixel electrode portions arranged around a certain pixel electrode portion to an input signal generated in a signal generating unit connected to the certain pixel electrode portion. A discriminating unit discriminates whether a carrier input pattern coincides with any one of a plurality of discrimination patterns, and the carrier input pattern indicates, per the pixel electrode portion, presence of any carrier received in the certain pixel electrode portion and the pixel electrode portions arranged around the certain pixel electrode portion. The counting unit increments the number of photons in the case where the discriminating unit discriminates that the carrier input pattern coincides with any one of the discrimination patterns and further the input signal output from the adding unit after addition has a value exceeding a predetermined threshold.
    Type: Grant
    Filed: November 18, 2014
    Date of Patent: March 6, 2018
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Minoru Ichikawa, Kazuki Fujita, Harumichi Mori
  • Patent number: 9848151
    Abstract: A solid-state imaging device includes a photodetecting section, a vertical shift register section, first row selection lines, and second row selection lines. The vertical shift register section provides the row selection lines of the m-th row with common row selection signals.
    Type: Grant
    Filed: May 28, 2014
    Date of Patent: December 19, 2017
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Junichi Sawada, Harumichi Mori
  • Patent number: 9761631
    Abstract: A radiation image sensor includes a charge generation section and, a circuit board accumulating and transferring charge generated in the charge generation section. The circuit board includes a semiconductor substrate, a capacitive section accumulating the charge generated in the charge generation section, and a MOS transistor in the semiconductor substrate. The MOS transistor includes one end connected to the capacitive section and another end connected to a wire transferring the charge. The capacitive section includes a partial region of the semiconductor substrate, a conductor layer disposed on the partial region and electrically connected to the charge generation section, and an insulating layer interposed between the partial region and the conductor layer.
    Type: Grant
    Filed: November 28, 2014
    Date of Patent: September 12, 2017
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Minoru Ichikawa, Harumichi Mori
  • Publication number: 20170187967
    Abstract: A solid-state imaging device includes a photodetecting unit including MN pixels arrayed two-dimensionally in M rows and N columns, an output unit outputting a digital value generated on the basis of the amount of charge input from the pixels, and a control unit. The control unit divides the MN pixels in the photodetecting unit into unit regions each including pixels in Q rows and R columns, divides the unit regions arrayed two-dimensionally in (M/Q) rows and (N/R) columns into binning regions each including unit regions in K rows and one column, and repeatedly outputs the digital value according to the sum of amounts of the charges output from KQR pixels included in each binning region from the output unit K times in a column order for each row sequentially for the binning regions arrayed two-dimensionally in (M/KQ) rows and (N/R) columns.
    Type: Application
    Filed: July 9, 2015
    Publication date: June 29, 2017
    Applicant: HAMAMATSU PHOTONICS K.K.
    Inventors: Ryuji KYUSHIMA, Kazuki FUJITA, Haruyoshi OKADA, Junichi SAWADA, Harumichi MORI
  • Patent number: 9571766
    Abstract: A solid-state imaging device includes a sensor panel section and a readout circuit section. The sensor panel section is disposed on a glass substrate and has a photodetecting section including pixels arrayed in M rows and N columns, row selection lines, and readout lines. The readout circuit section is disposed on a substrate and has N integration circuits. Rectifier circuits are connected between nodes, between N panel-side connection points and the integration circuits, and a constant potential line. Circuit elements having resistance components are connected between the nodes and readout lines.
    Type: Grant
    Filed: May 29, 2014
    Date of Patent: February 14, 2017
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Harumichi Mori
  • Publication number: 20160315108
    Abstract: A radiation image sensor includes a charge generation section and, a circuit board accumulating and transferring charge generated in the charge generation section. The circuit board includes a semiconductor substrate, a capacitive section accumulating the charge generated in the charge generation section, and a MOS transistor in the semiconductor substrate. The MOS transistor includes one end connected to the capacitive section and another end connected to a wire transferring the charge. The capacitive section includes a partial region of the semiconductor substrate, a conductor layer disposed on the partial region and electrically connected to the charge generation section, and an insulating layer interposed between the partial region and the conductor layer.
    Type: Application
    Filed: November 28, 2014
    Publication date: October 27, 2016
    Inventors: Kazuki FUJITA, Minoru ICHIKAWA, Harumichi MORI
  • Patent number: 9478683
    Abstract: A sensor unit includes a metallic base member, a solid-state imaging element, and amplifier chips. The base member has a first placement surface and a second placement surface. The solid-state imaging element has a photodetecting surface, and is disposed on the first placement surface such that a rear surface and the first placement surface face each other. The amplifier chips are mounted on a substrate disposed on the second placement surface. The base member further has side wall portions facing side surfaces of the solid-state imaging element. The chips and the solid-state imaging element are electrically connected to one another via a bonding wire. The chips are thermally coupled to the base member via a thermal via of the substrate.
    Type: Grant
    Filed: December 4, 2012
    Date of Patent: October 25, 2016
    Assignee: HAMAMATSU PHOTONICS K.K.
    Inventors: Kazuki Fujita, Ryuji Kyushima, Harumichi Mori, Haruyoshi Okada, Junichi Sawada
  • Publication number: 20160305818
    Abstract: An adding unit adds an input signal generated in a signal generating unit connected to a specific pixel electrode portion out of pixel electrode portions arranged around a certain pixel electrode portion to an input signal generated in a signal generating unit connected to the certain pixel electrode portion. A discriminating unit discriminates whether a carrier input pattern coincides with any one of a plurality of discrimination patterns, and the carrier input pattern indicates, per the pixel electrode portion, presence of any carrier received in the certain pixel electrode portion and the pixel electrode portions arranged around the certain pixel electrode portion. The counting unit increments the number of photons in the case where the discriminating unit discriminates that the carrier input pattern coincides with any one of the discrimination patterns and further the input signal output from the adding unit after addition has a value exceeding a predetermined threshold.
    Type: Application
    Filed: November 18, 2014
    Publication date: October 20, 2016
    Inventors: Minoru ICHIKAWA, Kazuki FUJITA, Harumichi MORI