Patents by Inventor Keith A. Miller

Keith A. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20160172168
    Abstract: Apparatus for physical vapor deposition of dielectric material is provided herein. In some embodiments, a chamber lid of a physical vapor deposition chamber includes an inner magnetron assembly coupled to an inner target assembly, and an outer magnet assembly coupled to an outer target assembly, wherein the inner magnetron assembly and the inner target assembly are electrically isolated from the outer magnet assembly and the outer target assembly.
    Type: Application
    Filed: February 9, 2015
    Publication date: June 16, 2016
    Inventors: Keith A. Miller, THANH X. NGUYEN, ILYA LAVITSKY, RANDY SCHMIEDING, PRASHANTH KOTHNUR
  • Publication number: 20160172227
    Abstract: An electrostatic chuck includes a puck having a support surface to support a substrate when disposed thereon and an opposing second surface, wherein one or more chucking electrodes are embedded in the puck, a body having a support surface coupled to the second surface of the puck to support the puck, a DC voltage sensing circuit disposed on support surface of the puck, and an inductor disposed in the body and proximate the support surface of the body, wherein the inductor is electrically coupled to DC voltage sensing circuit, and wherein the inductor is configured to filter high frequency current flow in order to accurately measure DC potential on the substrate.
    Type: Application
    Filed: December 8, 2015
    Publication date: June 16, 2016
    Inventors: Ryan HANSON, Manjunatha KOPPA, Vijay D. PARKHE, John C. FORSTER, Keith A. MILLER
  • Patent number: 9356381
    Abstract: Protective cover including a mating cap having a cap body. The cap body includes a connector cavity that opens in a loading direction. The connector cavity is configured to receive an electrical connector of a communication system when the mating cap is moved in a loading direction onto the electrical connector. The cap body is configured to surround a mating interface of the electrical connector. The protective cover also includes a movable latch that is coupled to the mating cap and extends in a rearward direction that is generally opposite the loading direction. The movable latch has a side surface and a latch projection that extends laterally from the side surface. The movable latch is configured to flex relative to the mating cap to move the latch projection. The latch projection is configured to engage the communication system to block the protective cover from being inadvertently removed.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: May 31, 2016
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: Chong Hun Yi, Kevin Michael Thackston, Keith Miller
  • Patent number: 9315891
    Abstract: In some embodiments, a method for processing a substrate in a process chamber having a substrate support configured to move in a direction perpendicular to a top surface of a cover ring of a process kit may include positioning the substrate support in a first position such that a top surface of the substrate is positioned about 3 mm above to about 10 mm below a top surface of a cover ring of a process kit disposed about the periphery of the substrate support; performing a plasma deposition process while the substrate support is in the first position; moving the substrate support to a second position such that the top surface of the substrate is disposed about 3 mm below to about 15 mm above the top surface of the cover ring; and performing a plasma etch process while the substrate support is in the second position.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: April 19, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Joung Joo Lee, William Johanson, Keith A. Miller, Alan A. Ritchie
  • Patent number: 9303311
    Abstract: Substrate processing systems are provided herein. In some embodiments, a substrate processing system may include a target assembly having a target comprising a source material to be deposited on a substrate; a grounding assembly disposed about the target assembly and having a first surface that is generally parallel to and opposite a backside of the target assembly; a support member coupled to the grounding assembly to support the target assembly within the grounding assembly; one or more insulators disposed between the backside of the target assembly and the first surface of the grounding assembly; and one or more biasing elements disposed between the first surface of the grounding assembly and the backside of the target assembly to bias the target assembly toward the support member.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: April 5, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Donny Young, Alan Ritchie, Uday Pai, Muhammad Rasheed, Keith A. Miller
  • Publication number: 20160095166
    Abstract: Embodiments of methods and apparatus for thermally treating a substrate are provided herein. In some embodiments, a thermal treatment apparatus includes a chamber body including an interior volume; a plurality of substrate supports disposed within the interior volume, wherein each of the plurality of substrate supports includes a heating element; a selectively sealable opening in the chamber body sized to allow substrates to be inserted into or removed from the interior volume; a robotic arm disposed in the interior volume to move substrates onto and off of the plurality of substrate supports; and a heating assembly configured to heat substrates disposed on the robotic arm.
    Type: Application
    Filed: September 29, 2014
    Publication date: March 31, 2016
    Inventor: KEITH A. MILLER
  • Patent number: 9299203
    Abstract: Access level management techniques which require less manual intervention. In one example, a registration system registers an individual for an access level and receives a mobile device identifier from the individual. The registration system generates an electronic pass, which may include a mobile barcode, granting the individual access at the requested access level, and provides the electronic pass to a mobile communication device of the individual using the mobile device identifier. In one application, an individual with a mobile barcode associated with priority access level privileges may be allowed to bypass a queue by using a priority lane.
    Type: Grant
    Filed: January 30, 2013
    Date of Patent: March 29, 2016
    Assignee: NCR Corporation
    Inventors: Robert Thomas Borucki, Jared Keith Miller
  • Publication number: 20160087367
    Abstract: Protective cover including a mating cap having a cap body. The cap body includes a connector cavity that opens in a loading direction. The connector cavity is configured to receive an electrical connector of a communication system when the mating cap is moved in a loading direction onto the electrical connector. The cap body is configured to surround a mating interface of the electrical connector. The protective cover also includes a movable latch that is coupled to the mating cap and extends in a rearward direction that is generally opposite the loading direction. The movable latch has a side surface and a latch projection that extends laterally from the side surface. The movable latch is configured to flex relative to the mating cap to move the latch projection. The latch projection is configured to engage the communication system to block the protective cover from being inadvertently removed.
    Type: Application
    Filed: September 19, 2014
    Publication date: March 24, 2016
    Inventors: Chong Hun Yi, Kevin Michael Thackston, Keith Miller
  • Patent number: 9255322
    Abstract: A processing system may include a target having a central axis normal thereto; a source distribution plate having a target facing side opposing a backside of the target, wherein the source distribution plate includes a plurality of first features such that a first distance of a first radial RF distribution path along a given first diameter is about equal to a second distance of an opposing second radial RF distribution path along the given first diameter; and a ground plate opposing a target opposing side of the source distribution plate and having a plurality of second features disposed about the central axis and corresponding to the plurality of first features, wherein a third distance of a first radial RF return path along a given second diameter is about equal to a fourth distance of an opposing second radial RF return path along the given second diameter.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: February 9, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Donny Young, Alan Ritchie, Muhammad Rasheed, Keith A. Miller
  • Patent number: 9249500
    Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first plate having a first central axis, the first plate rotatable about the first central axis, a first open loop magnetic pole coupled to the first plate, a second plate having a second central axis, the second plate rotatable about the second central axis, and a second open loop magnetic pole coupled to the second plate, wherein the first open loop magnetic pole and the second open loop magnetic pole form a closed loop magnetic pole when the first and second open loop magnetic poles are aligned.
    Type: Grant
    Filed: February 7, 2013
    Date of Patent: February 2, 2016
    Assignee: APPLIED MATERIALS, INC.
    Inventor: Keith A. Miller
  • Publication number: 20150354054
    Abstract: Embodiments of cooled process tool adapters for use in substrate processing chambers are provided herein. In some embodiments, a cooled process tool adapter includes: an annular body surrounding a central opening; a coolant channel disposed in the annular body; one or more features to facilitate supporting a process tool within the central opening; an inlet and an outlet disposed in the annular body and fluidly coupled to the coolant channel; and a power connection coupled to the annular body having a terminal to couple the annular body to a bias power source.
    Type: Application
    Filed: May 15, 2015
    Publication date: December 10, 2015
    Inventors: WILLIAM R. FRUCHTERMAN, MARTIN LEE RIKER, KEITH A. MILLER, ANTHONY INFANTE
  • Patent number: 9196985
    Abstract: A configurable connector system may include a connector assembly including a housing, and at least one wafer retained within the housing. The wafer(s) may include at least one active device in communication with at least one programmable memory component. The active device(s) may be configured to operate based on programming instructions or settings stored within the programmable memory component. The housing of the connector assembly may include an open programmer-receiving channel configured to receive at least a portion of an external programmer that is configured to send the programming instructions or settings to the at least one programmable memory component.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: November 24, 2015
    Assignee: TYCO ELECTRONICS CORPORATION
    Inventors: Keith Miller, Hung Thai Nguyen
  • Patent number: 9177763
    Abstract: A method and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for measuring pressure of a substrate processing chamber may include a shield having an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, a gas injection adapter disposed about an outer wall of the shield, a pressure measuring conduit formed within the gas injection adapter, wherein the pressure measuring conduit is fluidly coupled the inner volume via a gap formed between an outer wall of the shield and substrate processing chamber components disposed proximate the shield, and wherein the gap has substantially the same pressure as the inner volume, and a pressure detector coupled to the pressure measuring conduit.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: November 3, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Muhammad Rasheed, Alan A. Ritchie, Isaac Porras, Keith A. Miller
  • Publication number: 20150194754
    Abstract: A configurable connector system may include a connector assembly including a housing, and at least one wafer retained within the housing. The wafer(s) may include at least one active device in communication with at least one programmable memory component. The active device(s) may be configured to operate based on programming instructions or settings stored within the programmable memory component. The housing of the connector assembly may include an open programmer-receiving channel configured to receive at least a portion of an external programmer that is configured to send the programming instructions or settings to the at least one programmable memory component.
    Type: Application
    Filed: January 9, 2014
    Publication date: July 9, 2015
    Applicant: Tyco Electronics Corporation
    Inventors: Keith Miller, Hung Thai Nguyen
  • Patent number: 9062379
    Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.
    Type: Grant
    Filed: June 15, 2012
    Date of Patent: June 23, 2015
    Assignee: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
  • Publication number: 20150170888
    Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.
    Type: Application
    Filed: February 18, 2014
    Publication date: June 18, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MARTIN LEE RIKER, UDAY PAI, WILLIAM FRUCHTERMAN, KEITH A. MILLER, MUHAMMAD M. RASHEED, THANH X. NGUYEN, KIRANKUMAR SAVANDAIAH
  • Publication number: 20150162171
    Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.
    Type: Application
    Filed: June 15, 2012
    Publication date: June 11, 2015
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Martin Lee Riker, Keith A. Miller, Anantha Subramani
  • Publication number: 20150075970
    Abstract: Apparatus for providing a magnetic field within a process chamber are provided herein. In some embodiments, an apparatus for providing a magnetic field within a process chamber includes: an inner rotating mechanism including a first plate having a central axis, wherein the first plate includes and a first plurality of magnets and is rotatable about the central axis; and an outer lifting mechanism including a ring disposed proximate the first plate, the ring having a second plurality of magnets coupled to a bottom surface of the ring proximate the peripheral edge of the ring, wherein the ring is movable in a direction perpendicular to the first plate.
    Type: Application
    Filed: August 13, 2014
    Publication date: March 19, 2015
    Inventor: KEITH A. MILLER
  • Publication number: 20150036892
    Abstract: A travel check-in method with improved travel document information capture and handling. An example method includes connecting to a travel check-in website by the computer, operating an image capture device by the computer to capture an image of an identification document of a passenger checking in, obtaining machine readable information from the image by the computer, and sending the machine readable information and the image to the travel check-in website by the computer. The method may be in lieu of the passenger providing the identification document to an agent at an airport or other departure point.
    Type: Application
    Filed: July 30, 2013
    Publication date: February 5, 2015
    Applicant: NCR CORPORATION
    Inventor: Jared Keith Miller
  • Patent number: 8920613
    Abstract: A non-axisymmetric electromagnet coil used in plasma processing in which at least one electromagnet coil is not symmetric with the central axis of the plasma processing chamber with which it is used but is symmetric with an axis offset from the central axis. When placed radially outside of an RF coil, it may reduce the azimuthal asymmetry in the plasma produced by the RF coil. Axisymmetric magnet arrays may include additional axisymmetric electromagnet coils. One axisymmetric coil is advantageously placed radially inside of the non-axisymmetric coil to carry opposed currents. The multiple electromagnet coils may be embedded in a molded encapsulant having a central bore about a central axis providing the axisymmetry of the coils.
    Type: Grant
    Filed: January 31, 2007
    Date of Patent: December 30, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Christopher Boitnott, Keith A. Miller