Patents by Inventor Keith A. Miller

Keith A. Miller has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8911601
    Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: December 16, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Muhammad Rasheed, Keith A. Miller, Rongjun Wang
  • Patent number: 8907222
    Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes one or more leg sections for covering a portion of the electrical conductor. The cover apparatus includes a cover section coupled to the one or more leg sections and covering a portion of the electrical insulator. The cover section includes a body portion and an adjustable portion coupled to the body portion at a coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. An example method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 9, 2014
    Assignee: Preformed Line Products Co.
    Inventors: Mark Stransky, Keith Miller, Mark Burns, Robert Peterson, Bryan Casenhiser
  • Patent number: 8901428
    Abstract: A cover apparatus is provided for covering an electrical insulator and a conductor. The cover apparatus includes a first cover portion extending along a first axis. The first cover portion includes a first segment covering a first portion of the electrical insulator and a second segment coupled to the first segment and covering a first portion of the conductor. The cover apparatus includes a second cover portion extending along a second axis. The second cover portion includes a third segment movably attached to the first segment and a fourth segment coupled to the third segment and covering a portion of the conductor. An example method of forming a cover apparatus for covering an electrical insulator and a conductor is also provided.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 2, 2014
    Assignee: Preformed Line Products Co.
    Inventors: Keith Miller, Mark Stransky, Mark Burns, Robert Peterson, Randy Cloud, Thomas Martin Haic
  • Patent number: 8901429
    Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes a leg section that covers a portion of the electrical conductor. A cover section covers a portion of the electrical insulator. The cover section can include a body portion that is coupled to the leg section at a first coupling location. The cover section includes an adjustable portion coupled to the body portion at a second coupling location located on an opposite side of the body portion relative to the first coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. A method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: December 2, 2014
    Assignee: Preformed Line Products Co.
    Inventors: Keith Miller, Mark Burns, Robert Peterson, Tom Haic, Randy Cloud
  • Patent number: 8900427
    Abstract: A magnetron actuator for moving a magnetron in a nearly arbitrary radial and azimuthal path in the back of a target in a plasma sputter reactor. The magnetron includes two coaxial rotary shafts extending along the chamber central axis and coupled to two independently controllable rotary actuators. An epicyclic gear mechanism or a frog-leg structure mechanically couple the shafts to the magnetron to control its radial and azimuthal position. A vertical actuator moves the shafts vertically in tandem to vary the magnetron's separation from the target's back surface and compensate for erosion of the front surface. The rotary actuators may be separately coupled to the shafts or a rotatable ring gear may be coupled to the shafts through respectively fixed and orbiting idler gears. Two radially spaced sensors detect reflectors attached to the inner and outer arms of the epicyclic gear mechanism for homing of the controller.
    Type: Grant
    Filed: August 19, 2011
    Date of Patent: December 2, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Keith A. Miller, Michael Allen Flanigan, Hari Ponnekanti
  • Patent number: 8864446
    Abstract: A wear indication system for use in turbine engines to measure the rate of gap closure between a seal holder and a rotor disk in a compressor blade assembly is disclosed. The wear indication system may include a support system capable of supporting a wear indicator formed from a relatively soft wear material without enabling the wear indicator to shift position or to fall out. One or more wear pins may be releasably attached to a compression plate with a seal holder. The seal holder may restrain the wear pin in position in an interference fit. During turbine engine operation, the wear pin is used to determine the rate of gap closing between a rotor disk and a seal holder precisely so that gas turbine engine repair can be scheduled and proper actions be taken to prevent rubbing between rotating and stationary parts of a compressor.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: October 21, 2014
    Assignee: Siemens Energy, Inc.
    Inventors: Ram Bahadur Singh, David L. Wasdell, Keith A Miller
  • Publication number: 20140260544
    Abstract: A method and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for measuring pressure of a substrate processing chamber may include a shield having an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, a gas injection adapter disposed about an outer wall of the shield, a pressure measuring conduit formed within the gas injection adapter, wherein the pressure measuring conduit is fluidly coupled the inner volume via a gap formed between an outer wall of the shield and substrate processing chamber components disposed proximate the shield, and wherein the gap has substantially the same pressure as the inner volume, and a pressure detector coupled to the pressure measuring conduit.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: MUHAMMAD RASHEED, ALAN A. RITCHIE, ISAAC PORRAS, KEITH A. MILLER
  • Publication number: 20140262485
    Abstract: A cover apparatus is provided for covering an electrical insulator and a conductor. The cover apparatus includes a first cover portion extending along a first axis. The first cover portion comprises a first segment covering a first portion of the electrical insulator and a second segment coupled to the first segment and covering a first portion of the conductor. The cover apparatus includes a second cover portion extending along a second axis. The second cover portion comprises a third segment movably attached to the first segment and a fourth segment coupled to the third segment and covering a portion of the conductor. An example method of forming a cover apparatus for covering an electrical insulator and a conductor is also provided.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: PREFORMED LINE PRODUCTS
    Inventors: Keith Miller, Mark Stransky, Mark Burns, Robert Peterson, Randy Cloud
  • Publication number: 20140261180
    Abstract: In some embodiments, a target assembly, for use in a substrate processing chamber having a process shield, may include a backing plate having a first side and an opposing second side, wherein the second side comprises a first surface having a first diameter bounded by a first edge; a target material having a first side bonded to the first surface of the backing plate; wherein the first edge is an interface between the backing plate and the target material; a plurality of slots disposed along an outer periphery of the backing plate extending from the first side of the backing plate toward the second side of the backing plate, wherein the plurality of slots are configured to align the target assembly with respect to the process shield.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: GOICHI YOSHIDOME, RYAN HANSON, DONNY YOUNG, MUHAMMAD RASHEED, KEITH A. MILLER
  • Publication number: 20140263169
    Abstract: In some embodiments, a method for processing a substrate in a process chamber having a substrate support configured to move in a direction perpendicular to a top surface of a cover ring of a process kit may include positioning the substrate support in a first position such that a top surface of the substrate is positioned about 3 mm above to about 10 mm below a top surface of a cover ring of a process kit disposed about the periphery of the substrate support; performing a plasma deposition process while the substrate support is in the first position; moving the substrate support to a second position such that the top surface of the substrate is disposed about 3 mm below to about 15 mm above the top surface of the cover ring; and performing a plasma etch process while the substrate support is in the second position.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: JOUNG JOO LEE, WILLIAM JOHANSON, KEITH A. MILLER, ALAN A. RITCHIE
  • Publication number: 20140271081
    Abstract: Processing chamber shutter blade and robot blade assemblies are constructed to eliminate thermal effects on the placement of elements in processing chambers. Such blade assemblies may contain at least two parts, which may include a positioning member including a low CTE material and a thermal compensating member including a high CTE material. The positioning member includes a coupling point and a reference point on a reference axis separated by a first distance. The thermal compensating member includes a connection point and a controlled point separated by another distance that is less than the first distance. A distance ratio of the first distance to the other distance is substantially equal to a CTE ratio of the high CTE material to the low CTE material, and the positioning member is joined to the thermal compensating member through the coupling point and the connection point.
    Type: Application
    Filed: March 17, 2014
    Publication date: September 18, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Ilya LAVITSKY, Keith A. MILLER
  • Publication number: 20140262434
    Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes one or more leg sections for covering a portion of the electrical conductor. The cover apparatus includes a cover section coupled to the one or more leg sections and covering a portion of the electrical insulator. The cover section includes a body portion and an adjustable portion coupled to the body portion at a coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. An example method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Preformed Line Products
    Inventors: Mark Stransky, Keith Miller, Mark Burns, Robert Peterson, Bryan Casenhiser
  • Publication number: 20140261177
    Abstract: Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Inventors: MUHAMMAD RASHEED, KIRANKUMAR SAVANDAIAH, ALAN A. RITCHIE, ISAAC PORRAS, KEITH A. MILLER
  • Publication number: 20140262435
    Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes a leg section that covers a portion of the electrical conductor. A cover section covers a portion of the electrical insulator. The cover section can include a body portion that is coupled to the leg section at a first coupling location. The cover section includes an adjustable portion coupled to the body portion at a second coupling location located on an opposite side of the body portion relative to the first coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. A method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.
    Type: Application
    Filed: March 15, 2013
    Publication date: September 18, 2014
    Applicant: Preformed Line Products
    Inventors: Keith Miller, Mark Burns, Robert Peterson, Tom Haic, Randy Cloud
  • Publication number: 20140251800
    Abstract: In some embodiments, a sputter source for a process chamber may include: a first enclosure having a top, sides and an open bottom; a target coupled to the open bottom; an electrical feed coupled to the top of the first enclosure proximate a central axis of the first enclosure to provide power to the target via the first enclosure; a magnet assembly having a shaft, a support arm coupled to the shaft, and a magnet coupled to the support arm disposed within the first enclosure; a first rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about the central axis of the first enclosure; and a second rotational actuator disposed off-axis to the central axis of the first enclosure and rotatably coupled to the magnet to rotate the magnet about a central axis of the magnet assembly.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventors: Keith A. MILLER, Martin LEE RIKER
  • Publication number: 20140250658
    Abstract: Embodiments of methods for fabricating a vacuum chamber for semiconductor substrate processing are provided herein. In some embodiments, a method for fabricating a vacuum chamber for semiconductor substrate processing may include: providing one or more plates of material that together form a desired shape of a body of the vacuum chamber; performing a friction stir weld on outer surfaces of adjacent ends of the one or more plates to form the body of the vacuum chamber; and coupling at least one of a top or bottom to a respective top or bottom of the body to form the vacuum chamber.
    Type: Application
    Filed: March 5, 2013
    Publication date: September 11, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventor: KEITH A. MILLER
  • Publication number: 20140251789
    Abstract: Methods and apparatus for processing a substrate in a physical vapor deposition (PVD) chamber are provided herein. In some embodiments, a process kit shield used in a substrate processing chamber may include a shield body having an inner surface and an outer surface, a process kit shield impedance match device coupled between the shield body and ground, wherein the process kit shield impedance match device is configured to adjust a bias voltage of the process kit shield, a cavity formed on the outer surface of the shield body, and one or more magnets disposed within the cavity.
    Type: Application
    Filed: March 6, 2013
    Publication date: September 11, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventor: KEITH A. MILLER
  • Publication number: 20140216923
    Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first plate having a first central axis, the first plate rotatable about the first central axis, a first open loop magnetic pole coupled to the first plate, a second plate having a second central axis, the second plate rotatable about the second central axis, and a second open loop magnetic pole coupled the second plate, wherein the first open loop magnetic pole and the second open loop magnetic pole form a closed loop magnetic pole when the first and second open loop magnetic poles are aligned.
    Type: Application
    Filed: February 7, 2013
    Publication date: August 7, 2014
    Applicant: APPLIED MATERIALS, INC.
    Inventor: KEITH A. MILLER
  • Publication number: 20140216703
    Abstract: A heat sink includes a frame having a non-metallic body that includes a window. The non-metallic body includes at least one peripheral wall that defines a boundary of the window. The non-metallic body includes a non-metallic material. The heat sink also includes a heat exchanger having a base and cooling fins. The base has a structure side and an opposite environmental side. The structure side of the base is configured to thermally communicate with a structure for absorbing heat from the structure. The cooling fins extend from the environmental side of the base. The heat exchanger is held by the frame such that the cooling fins extend within the window of the frame.
    Type: Application
    Filed: February 6, 2013
    Publication date: August 7, 2014
    Applicant: Tyco Electronics Corporation
    Inventors: CHONG HUN YI, Andrew Dewitt Balthaser, Brian Klinger, Matt Richard McAlonis, Keith Miller
  • Patent number: 8795487
    Abstract: Embodiments of the present invention provide improved methods and apparatus for physical vapor deposition (PVD) processing of substrates. In some embodiments, an apparatus for physical vapor deposition (PVD) may include a target assembly having a target comprising a source material to be deposited on a substrate, an opposing source distribution plate disposed opposite a backside of the target and electrically coupled to the target along a peripheral edge of the target, and a cavity disposed between the backside of the target and the source distribution plate; an electrode coupled to the source distribution plate at a point coincident with a central axis of the target; and a magnetron assembly comprising a rotatable magnet disposed within the cavity and having an axis of rotation that is aligned with a central axis of the target assembly, wherein the magnetron assembly is not driven through the electrode.
    Type: Grant
    Filed: March 30, 2011
    Date of Patent: August 5, 2014
    Assignee: Applied Materials, Inc.
    Inventors: Alan Ritchie, Keith Miller