Abstract: A processing system may include a target having a central axis normal thereto; a source distribution plate having a target facing side opposing a backside of the target, wherein the source distribution plate includes a plurality of first features such that a first distance of a first radial RF distribution path along a given first diameter is about equal to a second distance of an opposing second radial RF distribution path along the given first diameter; and a ground plate opposing a target opposing side of the source distribution plate and having a plurality of second features disposed about the central axis and corresponding to the plurality of first features, wherein a third distance of a first radial RF return path along a given second diameter is about equal to a fourth distance of an opposing second radial RF return path along the given second diameter.

Abstract: Methods and apparatus for a magnetron assembly are provided herein. In some embodiments, a magnetron assembly includes a first plate having a first central axis, the first plate rotatable about the first central axis, a first open loop magnetic pole coupled to the first plate, a second plate having a second central axis, the second plate rotatable about the second central axis, and a second open loop magnetic pole coupled to the second plate, wherein the first open loop magnetic pole and the second open loop magnetic pole form a closed loop magnetic pole when the first and second open loop magnetic poles are aligned.

Abstract: Embodiments of cooled process tool adapters for use in substrate processing chambers are provided herein. In some embodiments, a cooled process tool adapter includes: an annular body surrounding a central opening; a coolant channel disposed in the annular body; one or more features to facilitate supporting a process tool within the central opening; an inlet and an outlet disposed in the annular body and fluidly coupled to the coolant channel; and a power connection coupled to the annular body having a terminal to couple the annular body to a bias power source.

Abstract: A configurable connector system may include a connector assembly including a housing, and at least one wafer retained within the housing. The wafer(s) may include at least one active device in communication with at least one programmable memory component. The active device(s) may be configured to operate based on programming instructions or settings stored within the programmable memory component. The housing of the connector assembly may include an open programmer-receiving channel configured to receive at least a portion of an external programmer that is configured to send the programming instructions or settings to the at least one programmable memory component.

Abstract: A method and apparatus for physical vapor deposition are provided herein. In some embodiments, an apparatus for measuring pressure of a substrate processing chamber may include a shield having an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, a gas injection adapter disposed about an outer wall of the shield, a pressure measuring conduit formed within the gas injection adapter, wherein the pressure measuring conduit is fluidly coupled the inner volume via a gap formed between an outer wall of the shield and substrate processing chamber components disposed proximate the shield, and wherein the gap has substantially the same pressure as the inner volume, and a pressure detector coupled to the pressure measuring conduit.

Abstract: A configurable connector system may include a connector assembly including a housing, and at least one wafer retained within the housing. The wafer(s) may include at least one active device in communication with at least one programmable memory component. The active device(s) may be configured to operate based on programming instructions or settings stored within the programmable memory component. The housing of the connector assembly may include an open programmer-receiving channel configured to receive at least a portion of an external programmer that is configured to send the programming instructions or settings to the at least one programmable memory component.

Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.

Abstract: Embodiments of target assemblies for use in substrate processing chambers are provided herein. In some embodiments, a target assembly includes a plate comprising a first side including a central portion and a support portion; a target disposed on the central portion; a plurality of recesses formed in the support portion; and a plurality of pads partially disposed in the plurality of recesses.

Abstract: Embodiments described herein generally relate to components for a semiconductor processing chamber, a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a process kit. In one embodiment a lower shield for encircling a sputtering target and a substrate support is provided. The lower shield comprises a cylindrical outer band having a first diameter dimensioned to encircle the sputtering surface of the sputtering target and the substrate support, the cylindrical band comprising a top wall that surrounds a sputtering surface of a sputtering target and a bottom wall that surrounds the substrate support, a support ledge comprising a resting surface and extending radially outward from the cylindrical outer band, a base plate extending radially inward from the bottom wall of the cylindrical band, and a cylindrical inner band coupled with the base plate and partially surrounding a peripheral edge of the substrate support.

Abstract: Apparatus for providing a magnetic field within a process chamber are provided herein. In some embodiments, an apparatus for providing a magnetic field within a process chamber includes: an inner rotating mechanism including a first plate having a central axis, wherein the first plate includes and a first plurality of magnets and is rotatable about the central axis; and an outer lifting mechanism including a ring disposed proximate the first plate, the ring having a second plurality of magnets coupled to a bottom surface of the ring proximate the peripheral edge of the ring, wherein the ring is movable in a direction perpendicular to the first plate.

Abstract: A travel check-in method with improved travel document information capture and handling. An example method includes connecting to a travel check-in website by the computer, operating an image capture device by the computer to capture an image of an identification document of a passenger checking in, obtaining machine readable information from the image by the computer, and sending the machine readable information and the image to the travel check-in website by the computer. The method may be in lieu of the passenger providing the identification document to an agent at an airport or other departure point.

Abstract: A non-axisymmetric electromagnet coil used in plasma processing in which at least one electromagnet coil is not symmetric with the central axis of the plasma processing chamber with which it is used but is symmetric with an axis offset from the central axis. When placed radially outside of an RF coil, it may reduce the azimuthal asymmetry in the plasma produced by the RF coil. Axisymmetric magnet arrays may include additional axisymmetric electromagnet coils. One axisymmetric coil is advantageously placed radially inside of the non-axisymmetric coil to carry opposed currents. The multiple electromagnet coils may be embedded in a molded encapsulant having a central bore about a central axis providing the axisymmetry of the coils.

Abstract: Embodiments of the invention generally relate to a process kit for a semiconductor processing chamber, and a semiconductor processing chamber having a kit. More specifically, embodiments described herein relate to a process kit including a deposition ring and a pedestal assembly. The components of the process kit work alone, and in combination, to significantly reduce their effects on the electric fields around a substrate during processing.

Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes one or more leg sections for covering a portion of the electrical conductor. The cover apparatus includes a cover section coupled to the one or more leg sections and covering a portion of the electrical insulator. The cover section includes a body portion and an adjustable portion coupled to the body portion at a coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. An example method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.

Abstract: A magnetron actuator for moving a magnetron in a nearly arbitrary radial and azimuthal path in the back of a target in a plasma sputter reactor. The magnetron includes two coaxial rotary shafts extending along the chamber central axis and coupled to two independently controllable rotary actuators. An epicyclic gear mechanism or a frog-leg structure mechanically couple the shafts to the magnetron to control its radial and azimuthal position. A vertical actuator moves the shafts vertically in tandem to vary the magnetron's separation from the target's back surface and compensate for erosion of the front surface. The rotary actuators may be separately coupled to the shafts or a rotatable ring gear may be coupled to the shafts through respectively fixed and orbiting idler gears. Two radially spaced sensors detect reflectors attached to the inner and outer arms of the epicyclic gear mechanism for homing of the controller.

Abstract: A cover apparatus can cover an electrical insulator and an electrical conductor. The cover apparatus includes a leg section that covers a portion of the electrical conductor. A cover section covers a portion of the electrical insulator. The cover section can include a body portion that is coupled to the leg section at a first coupling location. The cover section includes an adjustable portion coupled to the body portion at a second coupling location located on an opposite side of the body portion relative to the first coupling location. The adjustable portion can be adjusted such that a dimension of the adjustable portion is adjusted according to a dimension of the electrical insulator. A method of forming a cover apparatus for covering an electrical insulator and an electrical conductor is also provided.

Abstract: A cover apparatus is provided for covering an electrical insulator and a conductor. The cover apparatus includes a first cover portion extending along a first axis. The first cover portion includes a first segment covering a first portion of the electrical insulator and a second segment coupled to the first segment and covering a first portion of the conductor. The cover apparatus includes a second cover portion extending along a second axis. The second cover portion includes a third segment movably attached to the first segment and a fourth segment coupled to the third segment and covering a portion of the conductor. An example method of forming a cover apparatus for covering an electrical insulator and a conductor is also provided.

Abstract: A wear indication system for use in turbine engines to measure the rate of gap closure between a seal holder and a rotor disk in a compressor blade assembly is disclosed. The wear indication system may include a support system capable of supporting a wear indicator formed from a relatively soft wear material without enabling the wear indicator to shift position or to fall out. One or more wear pins may be releasably attached to a compression plate with a seal holder. The seal holder may restrain the wear pin in position in an interference fit. During turbine engine operation, the wear pin is used to determine the rate of gap closing between a rotor disk and a seal holder precisely so that gas turbine engine repair can be scheduled and proper actions be taken to prevent rubbing between rotating and stationary parts of a compressor.

Abstract: Apparatus for physical vapor deposition are provided herein. In some embodiments, a shield for use in a physical vapor deposition chamber, comprises an annular one-piece body having an inner volume, a top opening and a bottom opening, wherein a bottom of the annular one-piece body includes an inner upwardly extending u-shaped portion, an annular groove formed in an inner wall of the one-piece body, and a plurality of gas distribution vents disposed along the annular feature and formed through the one-piece body, wherein the plurality of gas distribution vents are spaced apart from each other to distribute gases into the inner volume in a desired pattern.

Abstract: Processing chamber shutter blade and robot blade assemblies are constructed to eliminate thermal effects on the placement of elements in processing chambers. Such blade assemblies may contain at least two parts, which may include a positioning member including a low CTE material and a thermal compensating member including a high CTE material. The positioning member includes a coupling point and a reference point on a reference axis separated by a first distance. The thermal compensating member includes a connection point and a controlled point separated by another distance that is less than the first distance. A distance ratio of the first distance to the other distance is substantially equal to a CTE ratio of the high CTE material to the low CTE material, and the positioning member is joined to the thermal compensating member through the coupling point and the connection point.