Abstract: A two-dimensional information code is provided. Inside the information code, specification Patten regions, a recording region, and an information addition region are arranged. In the specification pattern region, predetermined-shape specification patterns are arranged. Data expressed by a plurality of types of cells are recorded in the data recording region. Additional information, which is different from the data recorded in the data recording region, can be recorded in the information addition region.

Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

Abstract: An insulating gate semiconductor device includes an insulating gate semiconductor element, an insulating circuit board, and a main-current path member. A main-current of the insulating gate semiconductor element flows toward a first external terminal in the main-current path member; and a gate-current path member, being patterned so as to have a linearly extending portion arranged in parallel to a linearly extending portion of the main-current path member in a planar pattern on the insulating circuit board, being provided to connect between a second external terminal and a gate electrode of the insulating gate semiconductor element. A current which is induced in the gate-current path member by mutual induction caused by a change in magnetic field implemented by the main-current is used for increasing the gate-current in a turn-on period of the insulating gate semiconductor element.

Abstract: A thin-film capacitor includes electrode layers stacked in a stacking direction; dielectric layers stacked between the electrode layers; an opening portion that includes a side surface penetrating at least a part of the electrode layers and at least a part of the dielectric layers in the stacking direction from a top side and a bottom surface exposing one of the electrode layers; and a wiring portion disposed in the opening portion to be separated from the side surface of the opening portion, and electrically connected to the electrode layer exposed from the bottom surface of the opening portion. The dielectric layer that is stacked immediately on the electrode layer exposed from the bottom surface of the opening portion among the dielectric layers includes an extension portion extending in the opening portion from the side surface of the opening portion to the wiring portion side.

Abstract: A thin-film capacitor including a stacked body having a lower electrode layer, a plurality of dielectric layers stacked on the lower electrode layer, one or more internal electrode layers interposed between the dielectric layers, and an upper electrode layer that is stacked on the opposite side of the lower electrode layer with the dielectric layers and the internal electrode layers interposed between, and a cover layer that covers the stacked body. The stacked body includes opening portions that have the lower electrode layer, opens upward in a stacking direction, and has a side surface formed to include an inclined surface. The cover layer is stacked on the inclined surface of the stacked body. A curved surface with a predetermined shape is formed on the inclined surface for each pair of layers including the dielectric layer forming the inclined surface and the electrode layer, forming the inclined surface.

Abstract: A thin-film capacitor includes a capacitor section in which electrode layers and dielectric layers are alternately stacked and which includes a hole portion that extends to the electrode layer. In a cross-section which is perpendicular to a stacking surface of the capacitor section and which passes through the hole portion, a side surface of the hole portion extends along a reference line extending in a direction intersecting the stacking surface, the dielectric layer extends up to the reference line toward the hole portion, and a gap is formed between the side surface of the pair electrode layer and the reference line.

Abstract: A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.

Abstract: A management system includes: an information terminal that reads an information code attached to a management target, the information code storing code identification information that specifies the management target; and a server communicable with the information terminal. The information terminal includes: a reading portion that optically reads display information including the information code; a position information acquisition portion that acquires position information of the information terminal; a terminal-side transmission portion that transmits the position information as reading position information to the server; and a notification portion that notifies predetermined information.

Abstract: An electronic component embedded substrate 1 includes a substrate 10 having a wiring layer 11 and an insulating layer 12; an electronic component 20 built in the substrate 10, and having a pair of electrode layers 21A and 21B, and a dielectric layer 22; and a stress relieving layer 30 provided closer to the wiring layer 11 than the insulating layer 12 is in the lamination direction, wherein at least part of an end portion of the electronic component 20 on the wiring layer 11 side is in contact with the stress relieving layer 30, wherein at least part of an end portion of the electronic component 20 on the insulating layer 12 side is in contact with the insulating layer 12, and wherein the Young's modulus of the stress relieving layer 30 is lower than the Young's modulus of the electrode layer 21B.

Abstract: An electronic component includes a first electronic component and a second electronic component that is stacked on the first electronic component. A second electrode layer of the first electronic component includes a plurality of divided electrode layers, and a pair of electrodes of the second electronic component are electrically connected to different electrode layers included in the plurality of electrode layers of the second electrode layer, and a first electrode layer of the first electronic component is divided into a plurality of electrode layers to correspond to the electrode layers which are included in the second electrode layer and which are electrically connected to the pair of electrodes of the second electronic component.

Abstract: Provided is a multilayer composite interior component, in which boundary protrusions (20b) aligned in a row on both sides of a parting line (L) are arranged in a staggered manner so as to bend toward the boundary protrusions (20b) in the row opposite thereto. In this way, even when the boundary protrusions (20b) are separated from the parting line (L) by a predetermined distance (g1, g2) in order to maintain the strength of a divided mold, the boundary protrusions (20b ) bend and deform so as to fill in an empty part in the vicinity of the parting line (L) when a surface layer member (16) is pressed by fingers or a hand. As a result, a feeling of unevenness resulting from decreases in reaction force in the vicinity of the parting line (L) is minimized, thus making it possible to obtain a more uniform texture.

Abstract: A laminated composite interior part includes a first member made of synthetic resin and having a mating surface; and a second member made of elastically deformable synthetic resin and having a plate portion substantially parallel to the mating surface. The plate portion has integrally-formed and interspersed protrusions protruding toward the mating surface. The second member is placed on the first member with distal end portions of the protrusions being in contact with the mating surface. Cushioning properties are provided by elastic deformation of the protrusions, caused as the protrusions' distal end portions are relatively pressed against the mating surface. Flexural rigidity of each of the protrusions against a compressive load is anisotropic about its axis, so that the protrusion is flexurally deformed in one direction about its axis with the distal end portion thereof sliding on the mating surface. Surface roughness of the mating surface is less than 0.20.

Abstract: A vehicle interior part includes a structure in which a soft upholstery material covers a front surface of a base material which is located on an interior side of a vehicle. The soft upholstery material is disposed in a stretched state on the front surface of the base material which is located on the interior side of the vehicle.

Abstract: Numerous fine projections (20) are formed interspersed on a plate-shape member (18), and the neutral plane (S) of each fine projection (20) is inclined at an inclination angle ? to the normal line (O) such that the contact center (Q) does not overlap with the base part in the plane direction of the surface (22), so when a pressing load (F) is applied, the moment acting on the fine projections (20) is large, and the fine projections (20) easily deform to bend in the respective inclination direction. By this means, the tactile softness (cushion properties) are improved by preventing the fine projections (20) from undergoing simple compression deformation in the axial direction, and stick-slip due to friction between the fine projections (20) and the surface (22) is avoided, making it possible to obtain a smooth and stable tactile softness.

Abstract: A through wiring substrate comprises a substrate having a pair of principal surfaces and a through hole penetrating between the pair of principal surfaces, the pair of principal surfaces and an inner surface of the through hole being electrically insulative; a through electrode provided on the inner surface of the through hole; a first wiring layer provided on one of the principal surfaces and connected to the through electrode; a second wiring layer provided on the other of the principal surfaces and connected to the through electrode; an underlying metal layer provided between the one of the principal surfaces and the first wiring layer; and catalyst metal particles existing between the underlying metal layer and the first wiring layer and between the through electrode and the inner surface of the through hole.

Abstract: A laminated composite interior component, having cushioning property, including a first member having a predetermined mating surface, and a second member made of an elastically deformable resin material, having a plate portion on and parallel to the mating surface and multiple solid protrusions formed integrally with the plate portion and having tip ends that protrude toward and contact the mating surface, and flexural rigidity of each protrusion against a compressive load having anisotropy around an axis perpendicular to the plate portion. Each of the protrusions have a longitudinal shape in a transverse section parallel to the plate portion and have one or more stepped portions, with a smaller section at its tip end side, in one of a pair of sidewalls located in a lateral direction perpendicular to a longitudinal direction of the longitudinal shape. Each protrusion is tilted toward a sidewall opposite the stepped portion.

Abstract: An information code producing apparatus produces a free space inside the code region of an information code arranged on a medium such as sheets of paper. The free space is arranged at a position other than specification pattern regions. Data being interpreted, which are expressed by cells, are not recorded in the free space. The free space has a preset size which is larger than that of a single cell. The information code producing apparatus detects the size of this free space by, at least, either selection from a plurality of candidate shapes prepared in advance or input of shape designating information provided from the outside.

Abstract: An information code producing apparatus produces a free space inside the code region of an information code arranged on a medium such as sheets of paper. The free space is arranged at a position other than specification pattern regions. Data being interpreted, which are expressed by cells, are not recorded in the free space. The free space has a preset size which is larger than that of a single cell. The information code producing apparatus detects the size of this free space by, at least, either selection from a plurality of candidate shapes prepared in advance or input of shape designating information provided from the outside.