Abstract: Provided is a system for detecting flame, which includes a light collecting module configured to collect light emitted from flame and sense location information and intensity information of the collected light, a memory configured to store a program for determining fire information on the basis of the sensed location information and intensity information of the light, and a processor configured to calculate intensity information and fluttering information of the flame from the intensity information of the light by executing the program stored in the memory, to calculate centroid spatial distribution information of the flame from the location information of the light, and to detect whether there is flame on the basis of at least one of the intensity information of the flame, the fluttering information of the flame, and the centroid spatial distribution information.

Abstract: An antenna apparatus includes first dipole antenna patterns, feed lines, a first ground plane, and a first blocking pattern. The feed lines are connected to corresponding ones of the first dipole antenna patterns. The first ground plane is disposed on a side of the first dipole antenna patterns and spaced apart from each of the first dipole antenna patterns. The first blocking pattern, connected to and extending from the first ground plane, is disposed between adjacent ones of the first dipole antenna patterns.

Abstract: A chip antenna module array includes a first chip antenna module including: a first solder layer disposed below a first dielectric layer; a first feed via disposed in the first dielectric layer; a first patch antenna pattern disposed above the first dielectric layer and having a first resonant frequency; and a first coupling pattern spaced apart from the first patch antenna pattern, and not vertically overlapping the first patch antenna pattern. The chip antenna module array includes a second chip antenna module including: a second solder layer disposed below a second dielectric layer; a second feed via disposed in the second dielectric layer; a second patch antenna pattern disposed above the second dielectric layer and having a second resonant frequency; and a second coupling pattern disposed above and vertically overlapping the second patch antenna pattern. The first and second chip antenna modules are disposed spaced apart on a connection member.

Abstract: A sterilizing device includes a pipe having an inlet and an outlet and allowing fluid to move therethrough and a light source provided on one side of the pipe and providing light to the fluid. At least a portion of the pipe is provided in a spiral shape and the inlet and/or the outlet are arranged in a light emitting region.

Abstract: A tunneling device includes a first semiconductor portion disposed on a first oxide substrate, a second semiconductor portion disposed on the first semiconductor portion, and an intermediate layer disposed between the first semiconductor portion and second semiconductor portion. The intermediate layer is a natural oxide film obtained by naturally oxidizing one surface of the second semiconductor portion for a predetermined time.

Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.

Abstract: A grain-oriented electrical steel sheet of an embodiment of the present invention comprises Si: 1.0% to 7.0% and Y: 0.005% to 0.5% by wt %, and the remainder comprising Fe and other inevitable impurities, and 10 pieces or less of inclusions comprising Y and having a diameter of 30 nm to 5 ?m per area of 1 mm2.

Abstract: An electronic device package includes: a substrate including a central region, and a first side region and a second side region at opposite sides of the central region; a first component in the first side region or the second side region, the first component having a first height above a surface of the substrate; a second component in the central region, the second component having a second height above the surface of the substrate that is lower than the first height; a reinforcement member in the central region and overlapping the second component, the reinforcement member having a third height above the surface of the substrate that is lower than the first height and higher than the second height; and an encapsulation member covering the first component and the second component.

Abstract: A sterilizing module includes a main body and a light source. The main body includes an inner surface, an outer surface and an internal space to treat a target substance in a fluid and connected an inlet and a outlet. The light source is configured to emit light toward the internal space to sterilize the target substance in the fluid. The light source includes a substrate and a plurality of light emitting structures disposed on the substrate. The plurality of light emitting structures is disposed to be spaced apart each other. A first distance between two light emitting structures is adjacent to each other varies depending on a second distance from each light emitting structure to the inner surface of the main body. The second distance has a maximum value and a minimum value of illuminance and a difference between the maximum and the minimum value thereof is about more than 75%.

Abstract: Disclosed are an adhesive layer forming apparatus and a display device manufacturing system including the same. The adhesive layer forming apparatus includes a first support chuck configured to move a first panel along a panel movement path in a first direction, a second support chuck provided side by side with the first support chuck in a second direction orthogonal to the first direction and configured to move a second panel along a panel movement path, and a first gantry configured to move a first head, which faces the first support chuck and the second support chuck, in the second direction on the first support chuck and the second support chuck and forms an adhesive layer on any one of the first panel and the second panel by jetting.

Abstract: A sterilization module including a main body including an ultraviolet outlet, a transparent member disposed on the ultraviolet outlet to transmit ultraviolet light, and a light source unit irradiating ultraviolet light toward the transparent member, and a sealing member, in which the light source unit includes a circuit board and a light emitting diode chip mounted thereon and including an epitaxial substrate, a conductive semiconductor layer electrically connected to the circuit board directly by an electrode, ultraviolet light is c irradiated toward the transparent member by passing through the epitaxial substrate, the sealing member is disposed between the transparent member and the circuit board, and a distance between the transparent member and the circuit board spaced apart from each other by the sealing member is greater than a height of the light emitting diode chip.

Abstract: A semiconductor device includes a substrate including an active pattern, a first interlayer dielectric layer on the substrate, the first interlayer dielectric layer including a recess on an upper portion thereof, and a lower connection line in the first interlayer dielectric layer, the lower connection line being electrically connected to the active pattern, and the lower connection line including a conductive pattern, the recess of the first interlayer dielectric layer selectively exposing a top surface of the conductive pattern, and a barrier pattern between the conductive pattern and the first interlayer dielectric layer, the first interlayer dielectric layer covering a top surface of the barrier pattern.

Abstract: An exemplary embodiment in the present disclosure provides a grain-oriented electrical steel sheet containing, by wt %: 3.0 to 4.5% of Si; 0.05 to 0.2% of Mn; 0.015 to 0.035% of Al; 0.0015% or less (excluding 0%) of C; 0.0015% or less (excluding 0%) of N; 0.0015% or less (excluding 0%) of S; and a balance of Fe and other unavoidable impurities, wherein the grain-oriented electrical steel sheet satisfies the following Relational Expressions 1 and 2: (W13/50/W17/50)?0.57??[Relational Expression 1] (W15/50/W17/50)?0.76??[Relational Expression 2] where Wx/y represents a core loss value under conditions in which a magnitude of an applied magnetic field is x/10 T and a frequency is y Hz.

Abstract: A two-dimensional semiconductor transistor includes a gate electrode, a gate insulating layer disposed on the gate electrode, an organic dopant layer disposed on the gate insulating layer and comprising an organic material including electrons, a two-dimensional semiconductor layer disposed on the organic dopant layer, a source electrode disposed on the two-dimensional semiconductor layer, and a drain electrode disposed on the two-dimensional semiconductor layer and spaced apart from the source electrode. A hysteresis of the two-dimensional semiconductor transistor is reduced due to the two-dimensional semiconductor transistor including the organic dopant layer.

Abstract: Provided herein is an infrared spectroscopy technique capable of performing spectroscopic analysis on infrared rays in a broad infrared range (including a near infrared range, a short infrared range, a mid-infrared range, a far infrared range, and an extreme infrared range). An apparatus and a method for spectroscopic analysis on infrared rays are provided, without using an image sensor having a limited response range, to generate a signal in which transmitted light for each wavelength passes through a plurality of filters having different transmittances for each wavelength and is spatially pattern-coded, restore the signal into an infrared transmittance image, discriminate a wavelength according to a transmittance of the filter from the infrared transmittance image, calculate an intensity of the light for each wavelength, and output infrared spectrum information.

Abstract: A plasma generator, a cleaning liquid processing apparatus including the same, a semiconductor cleaning apparatus, and a cleaning liquid processing method are provided. The cleaning liquid processing apparatus comprising a bubble formation section configured to lower a pressure of a mixed liquid obtained by mixing a liquid and a gas to form bubbles in the mixed liquid, a plasma generator connected to the bubble formation section and configured to apply a voltage to the mixed liquid to form plasma in the bubbles formed in the mixed liquid, a mixing section connected to the plasma generator and configured to dissolve radicals included in the plasma into the mixed liquid, and a discharge nozzle connected to the mixing section and configured to discharge the mixed liquid to a wafer.

Abstract: A sterilizing device includes a pipe having an inlet and an outlet and allowing fluid to move therethrough and a light source provided on one side of the pipe and providing light to the fluid. At least a portion of the pipe is provided in a spiral shape and the inlet and/or the outlet are arranged in a light emitting region.

Abstract: The present disclosure describes a system, method, and computer program for predicting sentiment labels for audio speech utterances using an audio speech sentiment classifier pretrained with pseudo sentiment labels. A speech sentiment classifier for audio speech (“a speech sentiment classifier”) is pretrained in an unsupervised manner by leveraging a pseudo labeler previously trained to predict sentiments for text. Specifically, a text-trained pseudo labeler is used to autogenerate pseudo sentiment labels for the audio speech utterances using transcriptions of the utterances, and the speech sentiment classifier is trained to predict the pseudo sentiment labels given corresponding embeddings of the audio speech utterances. The speech sentiment classifier is then subsequently fine tuned using a sentiment-annotated dataset of audio speech utterances, which may be significantly smaller than the unannotated dataset used in the unsupervised pretraining phase.

Abstract: For any application that processes speech, improving the quality of the feature vectors may improve the quality of the speech application. The quality of feature vectors may be improved by modifying a neural network architecture for computing feature vectors to allocate computational resources where they are more effective for learning and computing the feature vectors. Contextual feature vectors may be computed from feature vectors by using a parameterized downsampling operation that decreases a vector sequence rate, processing the downsampled vectors with a neural network, and using a parameterized upsampling operation that increases a vector sequence rate. For example, parameterized downsampling may decrease a vector sequence rate by a factor of two, a neural may require fewer computational resources since it operates with a lower vector sequence rate, and parameterized upsampling may then increase the vector sequence rate by a factor of two.

Abstract: A lighting device including at least one first light source configured to emit a visible light through a first light emitting surface, at least one second light source spaced apart from the first light source and configured to emit light having a wavelength for sterilization through a second light emitting surface, and a hosing having a bottom portion, on which the first and second light sources are disposed, and at least one sidewall portion connected to the bottom portion to enclose the first light source and the second light source in one common area, in which the first and second light emitting surfaces face substantially the same direction, and the first light emitting surface and the second light emitting surface are disposed at a different elevation from the bottom portion of the housing.