Abstract: An apparatus includes a first substrate having a first land and a second substrate having a second land. A first molding compound is disposed between the first substrate and the second substrate. A first semiconductor chip is disposed on the first substrate and in contact with the first molding portion. A first connector contacts the first land and a second connector contacts the second land. The second connector is disposed on the first connector. A volume of the second connector is greater than a volume of the first connector. A surface of the first semiconductor chip is exposed. The first molding compound is in contact with the second connector, and at least a portion of the second connector is surrounded by the first molding compound.

Abstract: A semiconductor device having a printed circuit board and a semiconductor chip. The printed circuit board includes a chip region, a plurality of first ball lands adjacent to the chip region, and at least one second ball land adjacent to the first ball lands. The semiconductor chip is mounted on the chip region. The first ball lands are arranged to have a first pitch. One of the first ball lands which is nearest to the second ball land, and the second ball land have a second pitch greater than the first pitch.

Abstract: A stacked semiconductor package may include a wiring substrate. A first semiconductor chip may be disposed on the wiring substrate and wire-bonded to the wiring substrate. An interposer chip may be disposed on the wiring substrate and sire bonded to the wiring substrate. The interposer chip may include a circuit element and a bonding pad being electrically connected. A second semiconductor chip may be disposed on the interposer chip and wire-bonded to the interposer chip. The second semiconductor chip may be electrically connected to the wiring substrate through the interposer chip.

Abstract: A semiconductor package onto which a plurality of passive elements is mounted. A substrate includes a first surface and a second surface. A semiconductor chip is on one of the first surface and the second surface of the substrate. A plurality of passive elements are on the substrate. The plurality of passive elements include a plurality of first passive elements and a plurality of second passive elements that are taller than the plurality of first passive elements. The plurality of first passive elements are on at least one of the first surface and the second surface, and at least two of the plurality of second passive elements are on the second surface.

Abstract: A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit.

Abstract: Disclosed herein is a multi-functional traffic signal stick, which has a red signal LED part for providing a signal stick function and a white signal LED part for providing a flash light function, and which a police officer carries on the road. The multi-functional traffic signal stick can be carried conveniently as a flash light by telescoping each joint of a length-adjustable flashing tube manufactured in an antenna type into a larger tube, and used as a signal stick, which is well seen from a far distance, by stretching each joint of the length-adjustable flashing tube like an antenna. In addition, the present invention can serve to inform danger or accidents when being mounted uprightly on the road or a proper place such that three supporting rods mounted on a grip part at regular intervals are unfolded to support the signal stick.

Abstract: Provided are a high-power ball grid array (BGA) and a method for manufacturing the high-power BGA. The high-power BGA includes a printed circuit board which has a through hole at its center, connection pads which are formed on the bottom of the printed circuit board, matrix solder balls which surround the through hole and are adjacent to the connection pads on the bottom of the printed circuit board, a heat spreader which is formed on the top surface of the printed circuit board and includes an insulating layer of a high thermal conductivity, a semiconductor chip which is mounted downwardly on the bottom surface of the heat spreader, within the through hole, and includes a plurality of pads for bonding via gold wires with the connection pad, and a passive film which fills the through hole and is formed at the bottom of the semiconductor chip.

Abstract: A connector capable of being connected to a printed circuit board (PCB) is provided. A female connector according to an embodiment of the present invention includes a core conductor, a body, and a housing. The core conductor is formed of a single body including a contact terminal formed of two or more insertion panels forming an insertion space where a signal pin of a male connector is inserted and a signal transmission panel connected to a bottom of the contact terminal and electrically connected a signal line of the PCB. The body includes an insertion part electrically insulated from the core conductor and gaping when coupling with the male connector and is formed in a single body including a trunk surrounding the contact terminal and a plurality of supporters connected to a bottom of the trunk. The housing stores the core conductor and the bottom of the trunk of the body or more.

Abstract: A wiring substrate having variously sized ball pads, a semiconductor package including the wiring substrate, and a stack package using the semiconductor package, to improve board level reliability (BLR) of a semiconductor package or stack package mounted on a mother board are shown. Outer ball pads are formed to have relatively greater surface areas at the corners of the semiconductor package as compared to those at other areas and are formed to have the greatest surface area within a designable range. Additionally, occurrence of cracks may be inhibited at junctions of other solder balls by forming dummy solder pads at the outermost corners among the outer ball pads formed proximate to the corners of the wiring substrate. Stress arising during a board level reliability test is absorbed without product failure at junctions between the dummy solder pads and dummy solder balls.

Abstract: Embodiments of the invention provide a method for fabricating a system in package. In one embodiment, the method comprises preparing a printed circuit board (PCB) strip comprising a plurality of individual PCBs, stacking a plurality of first semiconductor chips and forming an encapsulant on a first surface of a first individual PCB of the plurality of individual PCBs to form a first semiconductor chip stack structure comprising a first semiconductor chip stack, and performing a first test adapted to test one of the first semiconductor chips in the first semiconductor chip stack. The method further comprises flip chip bonding a second semiconductor chip to a second surface of the first individual PCB if the first semiconductor chip stack structure meets a test standard based on a result of the first test, and dividing the first semiconductor chip stack structure to form a system in package.

Abstract: A chip stack structure having a shielding capability may comprise a wiring substrate, the wiring substrate including a ground layer. The structure may also comprise a first chip attached on an upper surface of the wiring substrate and electrically connected to the ground layer. The structure may also comprise a plurality of first bonding wires which electrically connect the first chip to the wiring substrate. The structure may also comprise a shield plate attached to the first chip and detached from at least one of the plurality of first bonding wires, the shield plate being configured to cover the first chip and at least one of the plurality of first bonding wires. The structure may also comprise a grounding wire which connects the shield plate to the ground layer of the wiring substrate. The structure may also comprise a second chip attached to and supported by the shield plate.

Abstract: A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit.

Abstract: Provided is an early rehabilitation training system that increase the intensity of patient rehabilitation training to shorten the time it takes for patients to progress to a secondary rehabilitation training stage by allowing patients incapable of self-ambulation to be artificially rehabilitated in a prone, bed-ridden position. The system includes a treatment bed (2) configured with a mattress (2a), a base (2b) disposed below the mattress (2a) and coupled through a hinge to one end of the mattress (2a), and a tilting unit (2c) provided between the mattress (2a) and the base (2b) to adjust an upright angle of the mattress (2a); and a rotating unit (10) provided below the mattress (2a) of the treatment bed (2) to secure a patient's feet and provide artificial exercising of the patient's feet through gravity when the upright angle of the mattress (2a) is changed by the tilting unit (2c).

Abstract: Provided is an exercise fitness machine that can be varied in weight in a minute unit in accordance with a body condition of a user and easily transformed in accordance with a developing portion of the body, thereby maximizing convenience in use and efficiency of exercise. The exercise/fitness machine includes a base frame, a muscular strength member that is provided on an upper end of the base frame to develop muscular strength of an upper or lower body of a user, and a weight varying unit provided between the base frame and the muscular developing member and including a damper containing magnetorheological fluid to vary a weight sense in accordance with a user's selection.

Abstract: An apparatus for adjusting a height of a suction brush for use in a vacuum cleaner includes a height adjusting knob rotatably disposed in an inserting recess formed in the suction brush, and having an inclined part formed thereon, so that a height of the suction brush from a surface to be cleaned is varied as a position of the height adjusting knob rotated, a supporting member to support the suction brush in contact with the inclined part thus to allow the suction brush to be ascended and descended by the inclined part, and a passage disposed between an inner circumferential surface of the inserting recess and an outer circumferential surface of the height adjusting knob to pass fine dirt therethrough. With the passage, the fine dirt is not tied up between the inner circumferential surface of the inserting recess and the outer circumferential surface of the height adjusting knob. Accordingly, the rotation of the height adjusting knob is not restricted or obstructed due to the fine dirt.

Abstract: A semiconductor package may include a heat sink. The heat sink may be disposed above and spaced apart from a substrate, which may support a semiconductor chip. The heat sink may have a hole. A liquid molding compound may be provided through the hole of the heat sink to form an encapsulant. The encapsulant may seal the semiconductor chip, leaving an upper portion of the heat sink exposed. A tape supporting the heat sink may be provided on the substrate. The tape may be removed after the encapsulant is provided.

Abstract: A hybrid electronic device according some embodiments disclosed herein can be generally characterized as including a semiconductor chip and a fuel cell. The semiconductor chip may be in electrical communication with the fuel cell, in thermal communication with the fuel cell, or a combination thereof. The hybrid electronic device may further include a voltage converter is electrically connected to the first semiconductor chip and the first fuel cell.

Abstract: A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from moisture penetration into a lower semiconductor chip. The vertical stack type multi-chip package comprises an organic substrate having a printed circuit pattern on which a semiconductor chip is mounted. A first semiconductor chip is mounted on a die bonding region of the organic substrate and is electrically connected to the organic substrate through a first wire. A metal stiffener is formed on the first semiconductor chip and connected to the organic substrate by a first ground unit around the first semiconductor chip. An encapsulant is used to seal the first semiconductor chip below the metal stiffener. A second semiconductor chip, which is larger in size than that the first semiconductor chip, is mounted on the metal stiffener and connected by a second ground unit.

Abstract: Disclosed herein is a multi-functional traffic signal stick, which has a red signal LED part for providing a signal stick function and a white signal LED part for providing a flash light function, and which a police officer carries on the road. The multi-functional traffic signal stick can be carried conveniently as a flash light by telescoping each joint of a length-adjustable flashing tube manufactured in an antenna type into a larger tube, and used as a signal stick, which is well seen from a far distance, by stretching each joint of the length-adjustable flashing tube like an antenna. In addition, the present invention can serve to inform danger or accidents when being mounted uprightly on the road or a proper place such that three supporting rods mounted on a grip part at regular intervals are unfolded to support the signal stick.

Abstract: Disclosed are an apparatus and method for outputting digital video data in a display appliance. The digital video data outputting apparatus includes data converting units for converting various kinds of analog video signals into digital video data, an output signal selector for receiving outputs of the data converting units and selecting any one of the received outputs, and an encoding unit for encoding the output of the output signal selector.