Abstract: A method of making a semiconductor package includes bonding a carrier to a surface of the substrate, wherein the carrier is free of active devices, wherein the carrier includes a carrier bond pad on a surface of the carrier. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad, wherein the bonding of the wafer bond pad to the carrier bond pad comprises re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.

Abstract: A garden scissors of the present invention includes a chassis, a transmission mechanism, a driving line, and a cutter. The transmission mechanism is rotatably disposed to the chassis. The transmission mechanism includes a pulley portion, a gear portion, and a flywheel portion, which rotate simultaneously. The gear portion is located between the pulley portion and the flywheel portion. An end of the driving line is rolled on the pulley portion. The cutter has an engagement portion engaged with the gear portion. Thus, the pulley portion, the gear portion, and the cutter are rotated when the driving line is pulled away from the pulley portion, driving the cutter to pivot to cut branches. Therefore, the flywheel portion of the transmission mechanism laying on the chassis, supporting and balancing the force exerted on and the movements of the pulley portion and the gear portion. The structure of the garden scissors is then stabilized.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.

Abstract: A method of making a micro electromechanical system (MEMS) package includes patterning a substrate to form a MEMS section. The method further includes bonding a carrier to a surface of the substrate. The carrier is free of active devices. The carrier includes a carrier bond pad on a surface of the carrier opposite the MEMS section. The carrier bond pad is electrically connected to the MEMS section. The method further includes bonding a wafer bond pad of an active circuit wafer to the carrier bond pad. The bonding of the wafer bond pad to the carrier bond pad includes re-graining the wafer bond pad to form at least one grain boundary extending from the wafer bond pad to the carrier bond pad.

Abstract: Provided are a railway vehicle carriage structure and a railway vehicle. Doors (9) enabling passengers to board and alight are provided on two sides of a vehicle body of at least one end part of a carriage (1, 2), a region directly between the doors is a vestibule (12), and the space of the vestibule (12) is substantially circular. This type of carriage structure enlarges the passing space in the vestibule (12) for people, can effectively relieve the state of overcrowding when a large number of people are boarding and alighting, and increases the comfort of passengers of railway vehicles.

Abstract: Differing from the fact that the amount of register units and adder units arranged in conventional moving average filter must be increased for processing more number of reference input signals, the present invention particularly discloses a moving average low-pass filtering device. The moving average low-pass filtering device comprises a register unit and a filtering and processing unit, and is able to use identical circuit architecture to successfully treat reference input signals with a filtering process even if the number of the reference input signals is alternatively increased. Moreover, after finishing a verification experiment by a simulator, simulation results have proved that, this novel moving average low-pass filtering device still can use identical circuit architecture to complete the filtering process under nearly the same calculation efficiency even though the number of the reference input signals is alternatively increased.

Abstract: A double-track vehicle, comprising upper and lower carriages, which are respectively a passenger carriage (1) for providing passenger seats and a cargo carriage (2) for placing cargo, the passenger carriage (1) and the cargo carriage (2) being respectively provided with a passenger door (3) for passengers to get on and off and a cargo door (4) for loading and unloading cargo. The vehicle carries out simultaneous transport of passengers and cargo, allowing for the function of the rail vehicle to no longer be singular and largely reducing transport and maintenance costs. At the same time, passenger transport and cargo transport are divided into two layers, which completely separates cargo transport and passenger transport, thereby providing passengers with a comfortable seating environment and improving seating safety.

Abstract: Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

Abstract: A method of fabricating a semiconductor device includes providing a first substrate comprising a first conductive element exposed at a surface of the first substrate; forming a patterned photoresist layer atop the first conductive element, whereby the patterned photoresist layer provides openings exposing the first conductive element; forming a first metal layer in the openings and directly atop the first conductive element; forming a first insulator layer over the first metal layer and the first substrate; and polishing the first metal layer and the first insulator layer, resulting in a first interface surface over the first substrate wherein the first interface surface includes part of the first metal layer and the first insulator layer.

Abstract: An apparatus and a method for executing an automated analysis of analysis input data (e.g. social media data and/or On-Board-Diagnosis data) for product failure detection is proposed.

Abstract: A semiconductor device and a fabrication method thereof are provided. The semiconductor device includes a semiconductor structure, a dielectric layer, a metal-semiconductor compound film and a cover layer. The semiconductor structure has an upper surface and a lateral surface. The dielectric layer encloses the lateral surface of the semiconductor structure and exposes the upper surface of the semiconductor structure. The metal-semiconductor compound film is on the semiconductor structure, wherein the dielectric layer exposes a portion of a surface of the metal-semiconductor compound film. The cover layer encloses the portion of the surface of the metal-semiconductor compound film exposed by the dielectric layer, and exposes the dielectric layer.

Abstract: Hybrid bonding systems and methods for semiconductor wafers are disclosed. In one embodiment, a hybrid bonding system for semiconductor wafers includes a chamber and a plurality of sub-chambers disposed within the chamber. A robotics handler is disposed within the chamber that is adapted to move a plurality of semiconductor wafers within the chamber between the plurality of sub-chambers. The plurality of sub-chambers includes a first sub-chamber adapted to remove a protection layer from the plurality of semiconductor wafers, and a second sub-chamber adapted to activate top surfaces of the plurality of semiconductor wafers prior to hybrid bonding the plurality of semiconductor wafers together. The plurality of sub-chambers also includes a third sub-chamber adapted to align the plurality of semiconductor wafers and hybrid bond the plurality of semiconductor wafers together.

Abstract: The present invention mainly discloses a laser spot detecting and locating system for use in a computer projection system, mainly comprising: a video recorder and a detecting module. The video recorder is used to capture a projected image provided on a projection screen by a projector and a laser spot provided on the projection screen by a laser pointer. Thus, during commercial presentation or classroom teaching, presentation processes and contents of a presenter and moving traces of the laser spot would be simultaneously recorded by the video recorder. Furthermore, by immediately converting the coordinate of the laser spot to a screen coordinate in a displayed image of a host computer, a mouse cursor can be simultaneously moved to the corresponding screen coordinate with the motion of the laser spot.

Abstract: An integrated circuit structure includes a package component, which further includes a non-porous dielectric layer having a first porosity, and a porous dielectric layer over and contacting the non-porous dielectric layer, wherein the porous dielectric layer has a second porosity higher than the first porosity. A bond pad penetrates through the non-porous dielectric layer and the porous dielectric layer. A dielectric barrier layer is overlying, and in contact with, the porous dielectric layer. The bond pad is exposed through the dielectric barrier layer. The dielectric barrier layer has a planar top surface. The bond pad has a planar top surface higher than a bottom surface of the dielectric barrier layer.

Abstract: A semiconductor structure may include a first device having first surface with a first bonding layer formed thereon and a second device having a first surface with a second bonding layer formed thereon. The first bonding layer may provide an electrically conductive path to at least one electrical device in the first device. The second bonding layer may provide an electrically conductive path to at least one electrical device in the second device. One of the first or the second devices may include MEMS electrical devices. The first and/or the second bonding layers may be formed of a getter material, which may provide absorption for outgassing.

Abstract: An automatic backlight control system and a method thereof, for receiving and analyzing an image dataset to control the backlight module of a display device are provided. Firstly, a first backlight intensity value generated by using the analysis and control module to analyze a first frame data is stored in the storage module. Then, the analysis and control module generates a translation vector value according to a first vector component and a second vector component of an equivalent translation vector corresponding to a second frame data of the image dataset. When the translation vector value is smaller than the threshold value, the selection module transmits the first backlight intensity value to the backlight control module for controlling the backlight module according to first backlight intensity value. When the translation vector value is greater than the threshold value, the backlight control module controls the backlight module according to the second backlight intensity value.

Abstract: Differing from the fact that the amount of register units and adder units arranged in conventional moving average filter must be increased for processing more number of reference input signals, the present invention particularly discloses a moving average low-pass filtering device. The moving average low-pass filtering device comprises a register unit and a filtering and processing unit, and is able to use identical circuit architecture to successfully treat reference input signals with a filtering process even if the number of the reference input signals is alternatively increased. Moreover, after finishing a verification experiment by a simulator, simulation results have proved that, this novel moving average low-pass filtering device still can use identical circuit architecture to complete the filtering process under nearly the same calculation efficiency even though the number of the reference input signals is alternatively increased.

Abstract: A semiconductor device and a method of fabricating the same are introduced. In an embodiment, one or more passivation layers are formed over a first substrate. Recesses are formed in the passivation layers and one or more conductive pads are formed in the recesses. One or more barrier layers are formed between the passivation layers and the conductive pads. The conductive pads of the first substrate are aligned to the conductive pads of a second substrate and are bonded using a direct bonding method.

Abstract: A biological sensing structure includes a mesa integrally connected a portion of a substrate, wherein the mesa has a top surface and a sidewall surface adjacent to the top surface. The biological sensing structure includes a first light reflecting layer over the top surface and the sidewall surface of the mesa. The biological sensing structure includes a filling material surrounding the mesa, wherein the mesa protrudes from the filling material. The biological sensing structure includes a stop layer over the filling material and a portion of the first light reflecting layer. The biological sensing structure includes a second light reflecting layer over a portion of the stop layer and a portion of the top surface of the mesa. The biological sensing structure includes an opening in the second light reflecting layer to partially expose the top surface of the mesa.

Abstract: An automatic backlight control system and a method thereof, for receiving and analyzing an image dataset to control the backlight module of a display device are provided. Firstly, a first backlight intensity value generated by using the analysis and control module to analyze a first frame data is stored in the storage module. Then, the analysis and control module generates a translation vector value according to a first vector component and a second vector component of an equivalent translation vector corresponding to a second frame data of the image dataset. When the translation vector value is smaller than the threshold value, the selection module transmits the first backlight intensity value to the backlight control module for controlling the backlight module according to first backlight intensity value. When the translation vector value is greater than the threshold value, the backlight control module controls the backlight module according to the second backlight intensity value.