Patents by Inventor Li Wu

Li Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11742254
    Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.
    Type: Grant
    Filed: November 9, 2020
    Date of Patent: August 29, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng, Chi-Hui Lai, Chiahung Liu, Hao-Yi Tsai, Chung-Shi Liu, Chen-Hua Yu
  • Publication number: 20230251258
    Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.
    Type: Application
    Filed: April 20, 2023
    Publication date: August 10, 2023
    Applicant: University of Washington
    Inventors: Daniel T. Chiu, Chun-Ting Kuo, Li Wu
  • Publication number: 20230253384
    Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.
    Type: Application
    Filed: April 17, 2023
    Publication date: August 10, 2023
    Inventors: Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai, Hao-Yi Tsai, Chuei-Tang Wang, Chung-Shi Liu, Chen-Hua Yu, Chiahung Liu
  • Publication number: 20230223357
    Abstract: A method of manufacturing a semiconductor package includes depositing a first dielectric layer over a carrier substrate. A first metallization pattern is formed over the first dielectric layer. The first metallization pattern has a first opening exposing the first dielectric layer. A second dielectric layer is deposited over the first metallization pattern, forming a dielectric slot through the first metallization pattern by filling the first opening. A second metallization pattern and a third dielectric layer are formed over the second dielectric layer. A through via is formed over the third dielectric layer, so that the dielectric slot is laterally under the through via.
    Type: Application
    Filed: May 24, 2022
    Publication date: July 13, 2023
    Inventors: Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh, Tsung-Hsien Chiang, Chao-Hsien Huang, Tzu-Sung Huang, Ming Hung Tseng, Wei-Chih Chen, Ban-Li Wu, Hao-Yi Tsai, Yu-Hsiang Hu, Chung-Shi Liu
  • Patent number: 11698493
    Abstract: A single-ended output circulator includes a three-core optical fiber head having first, second, and third optical fiber cores; a walk-off crystal having a first surface facing towards the second end of the three-core optical fiber head tube and a second surface facing away from the second end of the three-core optical fiber head tube; a plurality of half-wave plates each having a first surface coupled to the second surface of the walk-off crystal and a second surface facing away from the second surface of the walk-off crystal; a collimating lens having a first end and a second end; a reflection mirror configured to reflect light beams from the collimating lens; an optical prism between the collimating lens and the reflection mirror and configured to transmit a light beam along a propagation direction according to a polarization direction of the light beam; and a polarization rotator.
    Type: Grant
    Filed: March 17, 2021
    Date of Patent: July 11, 2023
    Assignee: II-VI DELAWARE, INC.
    Inventors: Li Wu, Yunbing Xu, Weimin Chen, Yuping Wu, Danping Wei, Peng Xiao, Yang Li, Hongming Cai
  • Patent number: 11690146
    Abstract: A microwave separated field reconstructed device includes: a microwave field reconstructed cavity, a first short circuit plane, a third waveguide flange and coupling windows, wherein connection ports are provided on four ends of the microwave field reconstructed cavity; the microwave field reconstructed cavity is provided with a first waveguide flange, and a second waveguide flange is provided one end of the microwave field reconstructed cavity perpendicular to the first waveguide flange; the first short circuit plane is connected to one end of the first waveguide flange away from the microwave field reconstructed cavity; a second short circuit plane is connected to one end of the second waveguide flange away from the microwave field reconstructed cavity. The input ports are distributed at two ends of the microwave field reconstructed cavity to introduce electric and magnetic fields.
    Type: Grant
    Filed: March 4, 2020
    Date of Patent: June 27, 2023
    Assignee: Sichuan University
    Inventors: Kama Huang, Yi Zhang, Yang Yang, Huacheng Zhu, Li Wu, Bing Zhang
  • Patent number: 11668713
    Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: June 6, 2023
    Assignee: UNIVERSITY OF WASHINGTON
    Inventors: Daniel T. Chiu, Chun-Ting Kuo, Li Wu
  • Patent number: 11631658
    Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: April 18, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Ting-Ting Kuo, Chih-Hsuan Tai, Hao-Yi Tsai, Chuei-Tang Wang, Chung-Shi Liu, Chen-Hua Yu, Chiahung Liu
  • Patent number: 11629814
    Abstract: An angle-adjustable supporting mechanism that includes a knob-type locking mechanism and a rotatable holder is provided. The knob-type locking mechanism has a base, a knob, and a latch member. The base has a receiving space and a supporting portion. The knob is rotatably received in the receiving space. The latch member is movably received in the supporting portion in a linear direction. The latch member has a bolt, a first stressed part, and a second stressed part. The bolt is disposed at one side of the first stressed part. The first stressed part is disposed between the bolt and the second stressed part. When the knob is rotated in different directions, the bolt of the latch member is drove to lock or release.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: April 18, 2023
    Assignee: WISTRON NEWEB CORPORATION
    Inventor: Jhan-Li Wu
  • Publication number: 20230110420
    Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.
    Type: Application
    Filed: December 12, 2022
    Publication date: April 13, 2023
    Inventors: Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu, Chiahung Liu, Hao-Yi Tsai
  • Patent number: 11611139
    Abstract: A device may include a housing with a plurality of top openings provided in a top portion of the housing and a plurality of bottom openings provided in a bottom portion of the housing. The device may include one or more internal components provided within the housing to provide a wireless service. The device may include a rotation extension connected to the bottom portion of the housing and configured to rotatably attach to a bracket that mounts the device to an object. The device may include a connector connected to the rotation extension and configured to receive a cable that provides communication signals to and from the device.
    Type: Grant
    Filed: June 29, 2021
    Date of Patent: March 21, 2023
    Assignee: Verizon Patent and Licensing Inc.
    Inventors: Andrew Nicholas Toth, Robert Stewart, Serge Van Steenkiste, Christopher Emmons, Walid Nabhane, Ming-Hung Hung, Jhan-Li Wu, Reid Schlegel
  • Patent number: 11604503
    Abstract: A virtual image display system, including a handheld electronic device having a first battery and a virtual image display having a second battery, is provided. The handheld electronic device and the virtual image display are coupled to each other. The handheld electronic device is used to calculate a power supply time of the first battery; calculate an expected discharge time of the second battery under a discharge condition; compare the power supply time and the expected discharge time to generate a comparison result; and adjust a supply current provided by the first battery to the virtual image display according to the comparison result.
    Type: Grant
    Filed: April 11, 2022
    Date of Patent: March 14, 2023
    Assignee: HTC Corporation
    Inventors: Chuan-Li Wu, LungTing Chin, Shang Ze Lin, Yu Chang Lin
  • Publication number: 20230074637
    Abstract: The present invention relates to a recombinant antigen and an isolated polynucleotide of porcine reproductive and respiratory syndrome virus (PRRSV), a composition including the same and a method of making the same. The recombinant antigen is a chimeric protein of PRRSV dual structural proteins and T-cell epitope. The polynucleotide encodes an amino acid sequence of the recombinant antigen. The recombinant protein expressed by the polynucleotide in an eukaryotic expression system can be beneficial for mass production and purification. An immunogenic composition including the recombinant antigen can promote pro-inflammatory M1-phenotype polarization of porcine alveolar macrophages (PAMs), reduce receptor CD163 expression that is mediated for viral entry and activate T helper (Th1) immune responses, thereby being applied to a vaccine composition against PRRSV.
    Type: Application
    Filed: September 7, 2022
    Publication date: March 9, 2023
    Inventors: Hso-Chi Chaung, Ko-Tung Chang, Mei-Li Wu, Wen-Bin Chung
  • Publication number: 20230066968
    Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.
    Type: Application
    Filed: August 30, 2021
    Publication date: March 2, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Sung Huang, Ming-Hung Tseng, Yen-Liang Lin, Ban-Li Wu, Hsiu-Jen Lin, Teng-Yuan Lo, Hao-Yi Tsai
  • Patent number: 11579099
    Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes.
    Type: Grant
    Filed: September 29, 2020
    Date of Patent: February 14, 2023
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chun-Ting Liu, Wen-Li Wu, Bo-Ching He, Guo-Dung Chen, Sheng-Hsun Wu, Wei-En Fu
  • Publication number: 20230023879
    Abstract: A virtual image display system, including a handheld electronic device having a first battery and a virtual image display having a second battery, is provided. The handheld electronic device and the virtual image display are coupled to each other. The handheld electronic device is used to calculate a power supply time of the first battery; calculate an expected discharge time of the second battery under a discharge condition; compare the power supply time and the expected discharge time to generate a comparison result; and adjust a supply current provided by the first battery to the virtual image display according to the comparison result.
    Type: Application
    Filed: April 11, 2022
    Publication date: January 26, 2023
    Applicant: HTC Corporation
    Inventors: Chuan-Li Wu, LungTing Chin, Shang Ze Lin, Yu Chang LIN
  • Publication number: 20220416398
    Abstract: A device may include a housing with a plurality of top openings provided in a top portion of the housing and a plurality of bottom openings provided in a bottom portion of the housing. The device may include one or more internal components provided within the housing to provide a wireless service. The device may include a rotation extension connected to the bottom portion of the housing and configured to rotatably attach to a bracket that mounts the device to an object. The device may include a connector connected to the rotation extension and configured to receive a cable that provides communication signals to and from the device.
    Type: Application
    Filed: June 29, 2021
    Publication date: December 29, 2022
    Applicant: Verizon Patent and Licensing Inc.
    Inventors: Andrew Nicholas TOTH, Robert STEWART, Serge VAN STEENKISTE, Christopher EMMONS, Walid NABHANE, Ming-Hung HUNG, Jhan-Li WU, Reid SCHLEGEL
  • Patent number: 11527525
    Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.
    Type: Grant
    Filed: December 7, 2020
    Date of Patent: December 13, 2022
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu, Chiahung Liu, Hao-Yi Tsai
  • Publication number: 20220367610
    Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a MIM dual capacitor structure with an increased capacitance per unit area in a semiconductor structure. Without using additional mask layers, a second parallel plate capacitor can be formed over a first parallel plate capacitor, and both capacitors share a common capacitor plate. The two parallel plate capacitors can be connected in parallel to increase the capacitance per unit area.
    Type: Application
    Filed: July 27, 2022
    Publication date: November 17, 2022
    Applicant: Taiwan Semiconductor Manfacturing Co., Ltd.
    Inventors: Chen-Yin HSU, Chun Li WU, Ching-Hung KAO
  • Patent number: D981382
    Type: Grant
    Filed: June 25, 2021
    Date of Patent: March 21, 2023
    Assignee: WISTRON NEWEB CORP.
    Inventors: Ming-Hung Hung, Jhan-Li Wu, Guang-Ling Zhou