Abstract: In an embodiment, a device includes: a sensor die having a first surface and a second surface opposite the first surface, the sensor die having an input/output region and a first sensing region at the first surface; an encapsulant at least laterally encapsulating the sensor die; a conductive via extending through the encapsulant; and a front-side redistribution structure on the first surface of the sensor die, the front-side redistribution structure being connected to the conductive via and the sensor die, the front-side redistribution structure covering the input/output region of the sensor die, the front-side redistribution structure having a first opening exposing the first sensing region of the sensor die.

Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: A method of manufacturing a semiconductor package includes depositing a first dielectric layer over a carrier substrate. A first metallization pattern is formed over the first dielectric layer. The first metallization pattern has a first opening exposing the first dielectric layer. A second dielectric layer is deposited over the first metallization pattern, forming a dielectric slot through the first metallization pattern by filling the first opening. A second metallization pattern and a third dielectric layer are formed over the second dielectric layer. A through via is formed over the third dielectric layer, so that the dielectric slot is laterally under the through via.

Abstract: A single-ended output circulator includes a three-core optical fiber head having first, second, and third optical fiber cores; a walk-off crystal having a first surface facing towards the second end of the three-core optical fiber head tube and a second surface facing away from the second end of the three-core optical fiber head tube; a plurality of half-wave plates each having a first surface coupled to the second surface of the walk-off crystal and a second surface facing away from the second surface of the walk-off crystal; a collimating lens having a first end and a second end; a reflection mirror configured to reflect light beams from the collimating lens; an optical prism between the collimating lens and the reflection mirror and configured to transmit a light beam along a propagation direction according to a polarization direction of the light beam; and a polarization rotator.

Abstract: A microwave separated field reconstructed device includes: a microwave field reconstructed cavity, a first short circuit plane, a third waveguide flange and coupling windows, wherein connection ports are provided on four ends of the microwave field reconstructed cavity; the microwave field reconstructed cavity is provided with a first waveguide flange, and a second waveguide flange is provided one end of the microwave field reconstructed cavity perpendicular to the first waveguide flange; the first short circuit plane is connected to one end of the first waveguide flange away from the microwave field reconstructed cavity; a second short circuit plane is connected to one end of the second waveguide flange away from the microwave field reconstructed cavity. The input ports are distributed at two ends of the microwave field reconstructed cavity to introduce electric and magnetic fields.

Abstract: Methods and systems for improved labeling and/or de-labeling a molecule or cell in the context of scientific experimentation, industrial applications, and clinical investigation, including the means to repeat the process of labeling and de-labeling in an efficient manner.

Abstract: A semiconductor package includes an integrated passive device (IPD) including one or more passive devices over a first substrate; and metallization layers over and electrically coupled to the one or more passive devices, where a topmost metallization layer of the metallization layers includes a first plurality of conductive patterns; and a second plurality of conductive patterns interleaved with the first plurality of conductive patterns. The IPD also includes a first under bump metallization (UBM) structure over the topmost metallization layer, where the first UBM structure includes a first plurality of conductive strips, each of the first plurality of conductive strips electrically coupled to a respective one of the first plurality of conductive patterns; and a second plurality of conductive strips interleaved with the first plurality of conductive strips, each of the second plurality of conductive strips electrically coupled to a respective one of the second plurality of conductive patterns.

Abstract: An angle-adjustable supporting mechanism that includes a knob-type locking mechanism and a rotatable holder is provided. The knob-type locking mechanism has a base, a knob, and a latch member. The base has a receiving space and a supporting portion. The knob is rotatably received in the receiving space. The latch member is movably received in the supporting portion in a linear direction. The latch member has a bolt, a first stressed part, and a second stressed part. The bolt is disposed at one side of the first stressed part. The first stressed part is disposed between the bolt and the second stressed part. When the knob is rotated in different directions, the bolt of the latch member is drove to lock or release.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: A device may include a housing with a plurality of top openings provided in a top portion of the housing and a plurality of bottom openings provided in a bottom portion of the housing. The device may include one or more internal components provided within the housing to provide a wireless service. The device may include a rotation extension connected to the bottom portion of the housing and configured to rotatably attach to a bracket that mounts the device to an object. The device may include a connector connected to the rotation extension and configured to receive a cable that provides communication signals to and from the device.

Abstract: A virtual image display system, including a handheld electronic device having a first battery and a virtual image display having a second battery, is provided. The handheld electronic device and the virtual image display are coupled to each other. The handheld electronic device is used to calculate a power supply time of the first battery; calculate an expected discharge time of the second battery under a discharge condition; compare the power supply time and the expected discharge time to generate a comparison result; and adjust a supply current provided by the first battery to the virtual image display according to the comparison result.

Abstract: The present invention relates to a recombinant antigen and an isolated polynucleotide of porcine reproductive and respiratory syndrome virus (PRRSV), a composition including the same and a method of making the same. The recombinant antigen is a chimeric protein of PRRSV dual structural proteins and T-cell epitope. The polynucleotide encodes an amino acid sequence of the recombinant antigen. The recombinant protein expressed by the polynucleotide in an eukaryotic expression system can be beneficial for mass production and purification. An immunogenic composition including the recombinant antigen can promote pro-inflammatory M1-phenotype polarization of porcine alveolar macrophages (PAMs), reduce receptor CD163 expression that is mediated for viral entry and activate T helper (Th1) immune responses, thereby being applied to a vaccine composition against PRRSV.

Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.

Abstract: This disclosure relates to an apparatus and methods for applying X-ray reflectometry (XRR) in characterizing three dimensional nanostructures supported on a flat substrate with a miniscule sampling area and a thickness in nanometers. In particular, this disclosure is targeted for addressing the difficulties encountered when XRR is applied to samples with intricate nanostructures along all three directions, e.g. arrays of nanostructured poles or shafts. Convergent X-ray with long wavelength, greater than that from a copper anode of 0.154 nm and less than twice of the characteristic dimensions along the film thickness direction, is preferably used with appropriate collimations on both incident and detection arms to enable the XRR for measurements of samples with limited sample area and scattering volumes.

Abstract: A virtual image display system, including a handheld electronic device having a first battery and a virtual image display having a second battery, is provided. The handheld electronic device and the virtual image display are coupled to each other. The handheld electronic device is used to calculate a power supply time of the first battery; calculate an expected discharge time of the second battery under a discharge condition; compare the power supply time and the expected discharge time to generate a comparison result; and adjust a supply current provided by the first battery to the virtual image display according to the comparison result.

Abstract: A device may include a housing with a plurality of top openings provided in a top portion of the housing and a plurality of bottom openings provided in a bottom portion of the housing. The device may include one or more internal components provided within the housing to provide a wireless service. The device may include a rotation extension connected to the bottom portion of the housing and configured to rotatably attach to a bracket that mounts the device to an object. The device may include a connector connected to the rotation extension and configured to receive a cable that provides communication signals to and from the device.

Abstract: A semiconductor device includes passive electrical components in a substrate; and an interconnect structure over the passive electrical components, conductive features of the interconnect structure being electrically coupled to the passive electrical components. The conductive features of the interconnect structure includes a first conductive line over the substrate; a conductive bump over the first conductive line, where in a plan view, the conductive bumps has a first elongated shape and is entirely disposed within boundaries of the first conductive line; and a first via between the first conductive line and the conductive bump, the first via electrically connected to the first conductive line and the conductive bump, where in the plan view, the first via has a second elongated shape and is entirely disposed within boundaries of the conductive bump.

Abstract: The present disclosure relates to a semiconductor device and a manufacturing method, and more particularly to a MIM dual capacitor structure with an increased capacitance per unit area in a semiconductor structure. Without using additional mask layers, a second parallel plate capacitor can be formed over a first parallel plate capacitor, and both capacitors share a common capacitor plate. The two parallel plate capacitors can be connected in parallel to increase the capacitance per unit area.