Abstract: A wafer structure and a manufacturing method thereof are provided. The wafer structure includes a substrate structure, a first dielectric layer, multiple test pads, a second dielectric layer, and multiple bond pads. The first dielectric layer is disposed on the substrate structure. The test pads are disposed in and exposed outside the first dielectric layer. Each test pad has a probe mark. The second dielectric layer is disposed on the first dielectric layer. The second dielectric layer has a top surface away from the test pads. Multiple bond pads are disposed in and exposed outside the second dielectric layer. Each bond pad is electrically connected to the corresponding test pad. The bond pads have bonding surfaces away from the test pads. The bonding surfaces are flush with the top surface. In the normal direction of the substrate structure, each bond pad does not overlap the probe mark of the corresponding test pad.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

Abstract: A semiconductor structure includes a semiconductor substrate; a first pad and a second pad on a first top surface of the semiconductor substrate; a circuit board including a second top surface, a recess indented from the second top surface into the circuit board, a polymeric pad disposed on the second top surface and corresponding to the first pad, and an active pad disposed within the recess and corresponding to the second pad; a first bump disposed between and contacting the polymeric pad and the first pad; and a second bump disposed between and contacting the active pad and the second pad, wherein a height of the first bump is substantially shorter than a height of the second bump.

Abstract: The invention provides a semiconductor bonding structure, the semiconductor bonding structure includes a first chip and a second chip which are bonded with each other, the first chip has a first bonding pad and the second bonding pad contacted and electrically connected to each other on a bonding interface, the first bonding pad and the second bonding pad are made of copper, and a heterogeneous contact combination in the first chip, the heterogeneous contact combination comprises a contact stack structure of a copper element, a tungsten element and an aluminum element, the tungsten element is located between the copper element and the aluminum element

Abstract: In certain aspects, a method implemented in a wireless device includes determining a specific absorption rate (SAR) distribution for a first wireless communication technology, determining a power density (PD) distribution for a second wireless communication technology, and combining the SAR distribution and the PD distribution to generate a combined RF exposure distribution. The method also includes determining at least one first maximum allowable power level and at least one second maximum allowable power level for a future time slot based on the combined RF exposure distribution, setting at least one transmission power limit for a first transmitter in the future time slot based on the at least one first maximum allowable power level, and setting at least one transmission power limit for a second transmitter in the future time slot based on the at least one second maximum allowable power level.

Abstract: In an image forming apparatus, a controller allows a sound output device to output a starting sound and an ending sound at a start and end of diagnostic image formation processing, respectively, determines whether abnormal noise has occurred by identifying data ranging from the starting sound to the ending sound in an diagnostic spectrogram as a comparison target for data ranging from the starting sound to the ending sound in a normal spectrogram to match both the spectrograms in terms of width in a time-axis direction, and identifies a source of the abnormal noise by identifying the data ranging from the starting sound to the ending sound in the diagnostic spectrogram as a comparison target for data in ranging from a timing of start to a timing of end in a timing chart to match the diagnostic spectrogram with the timing chart in terms of width in the time-axis direction.

Abstract: Various embodiments described herein illustrate a glove that includes an anterior portion and a posterior portion. The anterior portion is knitted seamlessly with the posterior portion to define a metacarpal region and a plurality of finger regions extending out from the metacarpal region. A first conductive pad is knitted on the anterior portion of the glove. The first conductive pad is knitted on a distal end portion of a first finger region. A second conductive pad knitted on the posterior portion of the glove. Further, the second conductive pad is knitted on a second finger region. An electronic device is removably attached to the posterior portion and is in electrical communication with the first conductive pad and the second conductive pad. The electronic device is triggered in an instance in which the first conductive pad contacts the second conductive pad.

Abstract: A modified hemofiltration method for clearing peripheral ?-synuclein aggregates in patients with neurodegenerative diseases is provided, which falls into the field of medicine. Specifically, a ratio S of synuclein dimers in blood is obtained; a blood flow velocity and an exchange membrane area for hemofiltration are determined through clinical trial data or historical literature data; hemofiltration is performed by the determined blood flow velocity and exchange membrane area, a calculation model of the ratio S of different synuclein dimers and an exchange membrane aperture D required for hemofiltration is constructed by linear regression; a clearance rate of synuclein dimers can be estimated by setting hemofiltration parameters with the calculation model. It is found that hemofiltration is beneficial to reducing the level of peripheral ?-synuclein aggregates in patients with neurodegenerative diseases.

Abstract: The present invention relates to a detection method for determining chloride ions content in sea sand, which is performed in the steps as follows: drying sea sand to a constant weight, adding the dried sea sand to boiling deionized water, and fully stirring, standing and filtering the deionized water to obtain washed sea sand and a washed filtrate; then grinding the washed sea sand into powder, adding the powder into deionized water, fully stirring and filtering the deionized water to obtain a powder filtrate; next, taking half of the washed filtrate and half of the powder filtrate, mixing and stirring the two to prepare a mixed filtrate; and measuring the chloride ions content in each of the washed filtrate, the powder filtrate and the mixed filtrate by using a silver nitrate titration method; finally, analyzing and correcting detection results to obtain the chloride ions content in the sea sand.

Abstract: A contribution identification method for noise at a boundary of an urban substation in the present disclosure includes the following steps: describing site elements and surrounding environmental elements of an urban substation; measuring and recording a background noise value at each boundary of the urban substation; determining an orientation of a specific sound source of the urban substation, and setting a corresponding measurement point at each boundary of the urban substation; obtaining a spectrum of each specific sound source; analyzing a contribution of each intra-substation sound source of the urban substation to noise at the boundary of the substation; analyzing a noise level of each sound source measurement point in the urban substation; recording measured data during noise measurement, and correcting a noise measurement result; and generating a test report.

Abstract: Embodiments of the present disclosure provide a solar cell string, a solar cell module, a manufacturing apparatus and a manufacturing method thereof. The solar cell string includes at least two solar cells including first and second solar cells adjacent to each other; front and back surfaces of each of the at least two solar cells are respectively provided with a grid line, and the grid line on the front surface is connected with the grid line on the back surface by a solder strip, the first and second solar cells have an overlapping region, and the overlapping region is provided with a buffer pad covering at least one side surface of the solder strip located in the overlapping region, and the buffer pad is formed by a pad which is pre-arranged in the overlapping region and melted at high temperature.

Abstract: A current sense short protection circuit includes a switch unit, a current sensing unit, a detection circuit and a short detection module. The first terminal of the switch unit receives a first voltage. The control terminal of the switch unit receives a control signal. The first terminal of the current sensing unit is coupled to the second terminal of the switch unit. The second terminal of the current sensing unit receives a second voltage. The detection unit receives the second voltage and a third voltage provided by the first terminal of the current sensing unit, and generates a detection signal according to the second voltage and the third voltage. The short detection module receives the first voltage, the second voltage and the detection signal, and generates a short detection signal according to the first voltage, the second voltage and the detection signal.

Abstract: A wafer stack structure includes an interlayer, a first wafer, and a second wafer. The interlayer has a first surface and a second surface opposite to the first surface. The intermediate layer includes a dielectric material layer and a redistribution layer embedded in the dielectric material layer. The first wafer is disposed on the first surface of the interlayer. The second wafer is disposed on the second surface of the interlayer. The second wafer is electrically connected to the first wafer through the redistribution layer of the interlayer.

Abstract: Described herein are specific CHO genomic sites for targeted insertion of exogenous genes. The sites are located within a sequence selected from SEQ ID NOs: 1-16.

Abstract: A device may generate, using a random telegraph signal (RTS) noise generator, a simulated RTS noise as input to a transistor included in an electronic circuit. The device may determine, based on the simulated RTS noise input to the transistor, a simulated output signal from the transistor.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes: patch antennas, encapsulated by a first encapsulant; a device die, vertically spaced apart from the patch antennas, and electrically coupled to the patch antennas; and at least one redistribution structure, disposed between the patch antennas and the device die, and including electromagnetic bandgap (EBG) structures laterally surrounding each of the patch antennas.

Abstract: Method and systems provide a tool to quantify sensory maps of the brain. Cortical surfaces are conformally mapped to a topological disk where local geometry structures are well preserved. Retinotopy data are smoothed on the disk domain to generate a curve that best fits the retinotopy data and eliminates noisy outliers. A Beltrami coefficient map is obtained, which provides an intrinsic conformality measure that is sensitive to local changes on the surface of interest. The Beltrami coefficient map represents a function where the input domain is locations in the visual field and the output is a complex distortion measure at these locations. This function is also invertible. Given the boundaries and the Beltrami map of a flattened cortical region, a corresponding visual field can be reconstructed. The Beltrami coefficient map allows visualization and comparison of retinotopic map properties across subjects in the common visual field space.

Abstract: A method includes detecting, based on sensor data from a sensor on a mobile device, an environmental brightness measurement, where the mobile device comprises a display screen configured to adjust display brightness based on environmental brightness. The method further includes determining, based on image data from a camera on the mobile device, an extent to which the detected environmental brightness measurement is caused by reflected light from the display screen. The method additionally includes setting a rate of exposure change for the camera based on the determined extent to which the detected environmental brightness measurement is caused by reflected light from the display screen.

Abstract: A BLUETOOTH earphone includes an antenna, the antenna comprises an antenna radiator, a first connecting portion, a second connecting portion, and a third connecting portion. The antenna radiator is located on a first portion of a flexible printed circuit (FPC) which is disposed in the earphone handle portion. The first connecting portion is a main ground of the BLUETOOTH earphone. The second connecting portion, is located on the earphone handle portion, and comprises a ground point. The third connecting portion is located on the earphone handle portion, and is connected to a first position on the second connecting portion other than the ground point, the third connecting portion and the antenna radiator are spaced apart with a first gap, and the third connecting portion is coupled to the antenna radiator through the first gap.

Abstract: A package includes a semiconductor package including a semiconductor die and a first insulating encapsulation, a substrate, and a second insulating encapsulation. The first insulating encapsulation encapsulates the semiconductor die. The substrate includes a redistribution circuitry, wherein the substrate is electrically coupled to the semiconductor package through the redistribution circuitry. The second insulating encapsulation is disposed on and partially covers the substrate, wherein the substrate is sandwiched between the semiconductor package and the second insulating encapsulation.