Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a user equipment (UE) may transmit a sounding reference signal (SRS) to a base station using an SRS antenna switch (SRS-AS) or an SRS carrier switch (SRS-CS) transmission technique and the UE may feature multiple antenna groups that have separate exposure budgets due to their spatial separation. The UE may employ one or more accounting procedures for tracking energy contributions associated with the SRS across the multiple antenna groups of the UE and may employ one or more power control procedures for setting a transmit power for an uplink signal in accordance with the energy contributions associated with the SRS.

Abstract: A circuit structure for testing through silicon vias (TSVs) in a 3D IC, including a TSV area with multiple TSVs formed therein, and a switch circuit with multiple column lines and row lines forming an addressable test array, wherein two ends of each TSV are connected respectively with a column line and a row line. The switch circuit applies test voltage signals through one of the row lines to the TSVs in the same row and receives current signals flowing through the TSVs in the row from the columns lines, or the switch circuit applies test voltage signals through one of the column lines to the TSVs in the same column and receives current signals flowing through the TSVs in the column from the row lines.

Abstract: In certain aspects, a method implemented in a wireless device includes determining a specific absorption rate (SAR) distribution for a first wireless communication technology, determining a power density (PD) distribution for a second wireless communication technology, and combining the SAR distribution and the PD distribution to generate a combined RF exposure distribution. The method also includes determining at least one first maximum allowable power level and at least one second maximum allowable power level for a future time slot based on the combined RF exposure distribution, setting at least one transmission power limit for a first transmitter in the future time slot based on the at least one first maximum allowable power level, and setting at least one transmission power limit for a second transmitter in the future time slot based on the at least one second maximum allowable power level.

Abstract: In an image forming apparatus, a controller allows a sound output device to output a starting sound and an ending sound at a start and end of diagnostic image formation processing, respectively, determines whether abnormal noise has occurred by identifying data ranging from the starting sound to the ending sound in an diagnostic spectrogram as a comparison target for data ranging from the starting sound to the ending sound in a normal spectrogram to match both the spectrograms in terms of width in a time-axis direction, and identifies a source of the abnormal noise by identifying the data ranging from the starting sound to the ending sound in the diagnostic spectrogram as a comparison target for data in ranging from a timing of start to a timing of end in a timing chart to match the diagnostic spectrogram with the timing chart in terms of width in the time-axis direction.

Abstract: This application provides a wireless headset, and relates to the field of TWS wireless headsets. The wireless headset includes a headset housing and a headset assembly accommodated in the headset housing. The headset assembly includes a microphone. The headset housing includes a bottom housing, the bottom housing includes a first bottom housing part and a second bottom housing part that are separated by using an insulating material, the first bottom housing part is a positive charging electrode, and the second bottom housing part is a negative charging electrode. A plurality of sound inlet holes are disposed on the bottom housing, and form microphone sound inlet channels communicating with each other. In the foregoing technical solutions, wind noise can be reduced, and call experience can be improved.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. A user equipment (UE) may configure a first initial set of maximum transmit powers for a first subscriber module. The UE may configure a second initial set of maximum transmit powers for a second subscriber module. The UE may configure a first maximum transmit power associated with a first connection for the first subscriber module. The UE may configure, independently of the configuration of the first maximum transmit power, a second maximum transmit power associated with the second connection. The UE may transmit based at least in part on at least one of the first maximum transmit power or the second maximum transmit power. Numerous other aspects are described.

Abstract: In certain aspects, a method implemented in a wireless device includes determining a specific absorption rate (SAR) distribution for a first wireless communication technology, determining a power density (PD) distribution for a second wireless communication technology, and combining the SAR distribution and the PD distribution to generate a combined RF exposure distribution. The method also includes determining at least one first maximum allowable power level and at least one second maximum allowable power level for a future time slot based on the combined RF exposure distribution, setting at least one transmission power limit for a first transmitter in the future time slot based on the at least one first maximum allowable power level, and setting at least one transmission power limit for a second transmitter in the future time slot based on the at least one second maximum allowable power level.

Abstract: Provided is a package structure and an antenna structure. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A package includes a semiconductor package including a semiconductor die and a first insulating encapsulation, a substrate, and a second insulating encapsulation. The first insulating encapsulation encapsulates the semiconductor die. The substrate includes a redistribution circuitry, wherein the substrate is electrically coupled to the semiconductor package through the redistribution circuitry. The second insulating encapsulation is disposed on and partially covers the substrate, wherein the substrate is sandwiched between the semiconductor package and the second insulating encapsulation.

Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Abstract: An image evaluation system includes an image forming apparatus and an information processing apparatus. The image forming apparatus prints a reference document including pattern images. The image forming apparatus prints, on the reference document, a check region including check items with respect to the image quality of the printed result. The image forming apparatus reads the printed reference document to generate reference document data. The image forming apparatus transmits the generated reference document data to the information processing apparatus. Based on the received reference document data, the information processing apparatus recognizes a check item selected in the check region.

Abstract: A light-emitting device includes a substrate including circuit pads and a resin portion. A frame disposed on the substrate to form a first space, first to third light sources, and first and second encapsulants. The frame includes an outer wall and a first partition in the first space to form the first space as independent second and third spaces. A first and second light sources are disposed at the second space and provide first and second light beams respectively. A third light source is disposed at the third space and provides a third light beam. A first encapsulant is filled at the second space to seal the first and second light sources. A second encapsulant is filled at the third space to seal the third light source. The second encapsulant includes a first wavelength conversion material converting the third light beam into a fourth light beam.

Abstract: A package structure including a redistribution circuit structure, a wiring substrate, an insulating encapsulation, a buffer layer, a semiconductor device and a stiffener ring is provided. The redistribution circuit structure includes a first surface and a second surface opposite to the first surface. The wiring substrate is disposed on the first surface of the redistribution circuit structure. The insulating encapsulation is disposed on the first surface of the redistribution circuit structure and laterally encapsulating the wiring substrate. The buffer layer is disposed over the second surface of the redistribution circuit structure. The semiconductor device is disposed on the buffer layer, and the semiconductor device is electrically connected to the wiring substrate through the redistribution circuit structure. The stiffener ring is adhered with the buffer layer by an adhesive.

Abstract: A wireless headset includes a housing and a power system disposed in a cavity enclosed by the housing and configured to supply power to the wireless headset. The wireless headset further includes a first electrical connector and a second electrical connector disposed on the housing of the wireless headset and are respectively electrically connected to two electrodes of the power system. The housing includes a rod body and an earbud connected to a top of the rod body, wherein the first electrical connector is located at a bottom end of the rod body, and the second electrical connector is located on an outer side wall of the earbud.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit, based at least in part on a transmit configuration, a first communication associated with a first group of logical channels associated with at least a portion of an ON duration of an uplink transmission interval configuration. The UE may transmit, based at least in part on the transmit configuration, a second communication during at least a portion of an OFF duration of the uplink transmission interval configuration, wherein the transmit configuration indicates a first amount of energy for the first communication based at least in part on the first communication being associated with the first group of logical channels and a second amount of energy for the second communication based at least in part on the second communication being associated with a second group of logical channels. Numerous other aspects are provided.

Abstract: An artificial intelligence (AI) calculation circuit is provided. The AI calculation circuit can support various integer and floating-point calculations through the adjustment of circuit configuration. Integer multiplication and floating-point mantissa multiplication share the multiplication unit, integer comparison and floating-point comparison share the same comparison unit, integer addition and floating-point addition share the same addition unit.

Abstract: A mixed-precision artificial intelligence (AI) processor and an operating method thereof are provided. The AI processor includes a first calculation module, a second calculation module and a control module. The first calculation module is configured to perform calculation based on the data with a first format. The second calculation module is configured to perform calculation based on the data with a second format different from the first format. The control module is coupled to the first calculation module and the second calculation module to select one of the first calculation module or the second calculation module to perform calculation based on an input data according to a calculation strategy.

Abstract: Provided is a package structure and a method of fabricating the same. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A processed wafer includes an outer surface, and a treated portion having a depth of 0 to 50 ?m measured from the outer surface. At least a part of the treated portion has an oxygen concentration of less than 13 wt %. A method for processing a wafer includes the steps of: applying a reducing medium on the wafer, the reducing medium is in powder form and including a reducing agent, and at least one of a catalyst and a releasing agent; subjecting the wafer to a reduction reaction at a temperature below Curie temperature of the and under a non-oxidizing atmosphere so as to obtain the aforesaid processed wafer.

Abstract: A package structure includes a first and a second conductive feature structures, a die, an insulator, an encapsulant, an adhesive layer, and a first through via. The die is located between the first conductive feature structure and the second conductive feature structure. The die is electrically connected to the second conductive feature structure. The insulator is disposed between the die and the first conductive feature structure. The insulator has a bottom surface in physical contact with a polymer layer of the first conductive feature structure. The encapsulant is located between the first conductive feature structure and the second conductive feature structure. The encapsulant is disposed on the insulator and laterally encapsulates the die and the insulator. The adhesive layer is disposed between the die and the insulator. The first through via extends through the encapsulant to connect to the first conductive feature structure and the second conductive feature structure.