Patents by Inventor Lin Lu

Lin Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240089862
    Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a user equipment (UE) may transmit a sounding reference signal (SRS) to a base station using an SRS antenna switch (SRS-AS) or an SRS carrier switch (SRS-CS) transmission technique and the UE may feature multiple antenna groups that have separate exposure budgets due to their spatial separation. The UE may employ one or more accounting procedures for tracking energy contributions associated with the SRS across the multiple antenna groups of the UE and may employ one or more power control procedures for setting a transmit power for an uplink signal in accordance with the energy contributions associated with the SRS.
    Type: Application
    Filed: November 16, 2023
    Publication date: March 14, 2024
    Inventors: Farhad MESHKATI, Alexei Yurievitch GOROKHOV, Sanghoon KIM, Troy CURTISS, Dinesh Kumar DEVINENI, Ashok MANTRAVADI, Lin LU
  • Publication number: 20240088053
    Abstract: A semiconductor structure includes a first dielectric layer, a first die, a second die, a first molding, and a second molding. The first die is disposed under the first dielectric layer, and has a first surface facing the first dielectric layer and a second surface opposite to the first surface. The second die is disposed over the first dielectric layer, and has a third surface facing the first dielectric layer and a fourth surface opposite to the third surface. The first molding encapsulates the first die. The second molding is disposed over the first die and the first dielectric layer. The first surface of the first die and the third surface of the second die are in contact with the first dielectric layer. The fourth surface of the second die is partially exposed through the second molding and partially covered by the second molding.
    Type: Application
    Filed: November 23, 2023
    Publication date: March 14, 2024
    Inventors: CHEN-HUA YU, KAI-CHIANG WU, CHUN-LIN LU
  • Patent number: 11924819
    Abstract: Methods and systems for determining transmission power levels according to signal types and RF exposure limits. An example method generally includes determining a first transmission power for transmitting a first type of uplink (UL) signal, determining a second transmission power for transmitting a second type of UL signal based on the first transmission power, and transmitting at least one of the first UL signal according to the first transmission power or the second UL signal according to the second transmission power.
    Type: Grant
    Filed: May 12, 2020
    Date of Patent: March 5, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Mingming Cai, Junsheng Han, Raghu Narayan Challa, Tienyow Liu, Jing Lin, Jagadish Nadakuduti, Lin Lu, Farhad Meshkati
  • Patent number: 11923919
    Abstract: Aspects of the present disclosure facilitate assessment of radio frequency (RF) exposure from a wireless device supporting multiple-input-multiple-output (MIMO) transmissions using multiple antennas. In certain aspects, MIMO RF exposure distributions for one or more MIMO transmissions are determined and stored in a memory. To assess RF exposure for a MIMO transmission, a processor may retrieve the corresponding MIMO RF exposure distributions from the memory, linearly combine the MIMO RF exposure distributions to obtain a combined MIMO RF exposure distribution, and assess RF exposure compliance based on the combined MIMO RF exposure distribution. In one example, the MIMO RF exposure distribution may include MIMO specific absorption rate (SAR) distributions.
    Type: Grant
    Filed: September 23, 2022
    Date of Patent: March 5, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Jagadish Nadakuduti, Lin Lu, Paul Guckian
  • Patent number: 11917559
    Abstract: Certain aspects of the present disclosure provide techniques for radio frequency (RF) exposure with antenna grouping. An example method for grouping antennas for RF exposure compliance by a processing system generally includes determining RF exposure distributions per transmit antenna configuration for a plurality of transmit antennas and assigning the plurality of transmit antennas to a plurality of antenna groups based on the RF exposure distributions.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: February 27, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Jagadish Nadakuduti, Lin Lu, Paul Guckian, Troy Curtiss, Akhil Deodhar
  • Patent number: 11917461
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may identify, while camped on a first cell associated with a first radio access technology (RAT), a power management level for a communication using a second RAT, wherein the power management level indicates an available power for the communication using the second RAT, and wherein the available power is based at least in part on an exposure rate or an absorption rate. The UE may delay a transmission of a measurement report on the first cell based at least in part on the identification of the power management level. Numerous other aspects are provided.
    Type: Grant
    Filed: October 21, 2021
    Date of Patent: February 27, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Arvind Vardarajan Santhanam, Raghu Narayan Challa, Brian Clarke Banister, Troy Curtiss, Bhupesh Manoharlal Umatt, Ramesh Chandra Chirala, Lin Lu
  • Patent number: 11908787
    Abstract: A package structure includes a first and a second conductive feature structures, a die, an insulator, an encapsulant, an adhesive layer, and a first through via. The die is located between the first conductive feature structure and the second conductive feature structure. The die is electrically connected to the second conductive feature structure. The insulator is disposed between the die and the first conductive feature structure. The insulator has a bottom surface in physical contact with a polymer layer of the first conductive feature structure. The encapsulant is located between the first conductive feature structure and the second conductive feature structure. The encapsulant is disposed on the insulator and laterally encapsulates the die and the insulator. The adhesive layer is disposed between the die and the insulator. The first through via extends through the encapsulant to connect to the first conductive feature structure and the second conductive feature structure.
    Type: Grant
    Filed: February 22, 2022
    Date of Patent: February 20, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chuei-Tang Wang, Chun-Lin Lu, Kai-Chiang Wu
  • Publication number: 20240049763
    Abstract: Provided is a method for producing a biomimetic nutrient mixture via biomimicry, comprising: Step (1) providing a mineral nutrient element precursor solution, and Step (2) reacting the mineral nutrient element precursor solution with a natural bio-reactor to obtain the biomimetic nutrient mixture, wherein the biomimetic nutrient mixture comprises a mineral nutrient element and a nutrient solution. The method can produce high biologically active mineral nutrient by an auto-synthesizing natural antioxidant through photosynthesis in the natural bio-reactor containing chlorophyll, which can provide mineral nutrient element without additional extraction procedure or extra component for manufacturing a nutritional supplement.
    Type: Application
    Filed: November 9, 2022
    Publication date: February 15, 2024
    Inventors: Lin LU, Chun-Lun CHIU, Ching-Cheng CHEN, Tai-Jung LAI, Tsu-Jun LU, Chung-Jung HUNG
  • Patent number: 11896407
    Abstract: Techniques measuring post contrast phase include collecting 3D medical imagery of a subject after injection with a contrast agent. A first set of slices is obtained in which each includes a first anatomical feature selected from a portal vein, aorta, inferior vena cava, liver, spleen or renal cortex. A second set of slices is obtained in which each includes a different second anatomical feature. A first image region is obtained from the first set and a different second image region from the second set. A trained convolutional neural network is configured to input the first image region to a first plurality of convolutional hidden layers and the second image region to a second plurality of convolutional hidden layers and output from both to a fully connected hidden layer that outputs a post contrast phase. Output data is presented based on the post contrast phase.
    Type: Grant
    Filed: May 21, 2021
    Date of Patent: February 13, 2024
    Assignee: The Trustees of Columbia University in the City of New York
    Inventors: Jingchen Ma, Laurent Dercle, Binsheng Zhao, Lin Lu, Lawrence H. Schwartz
  • Patent number: 11894330
    Abstract: A method of manufacturing a semiconductor device includes providing a carrier, disposing a first pad on the carrier, forming a post on the first pad, and disposing a joint adjacent to the post and the first pad to form a first entire contact interface between the first pad and the joint and a second entire contact interface between the first pad and the post. The first entire contact interface and the second entire contact interface are flat surfaces.
    Type: Grant
    Filed: March 22, 2021
    Date of Patent: February 6, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang, Chia-Chun Miao, Hao-Yi Tsai
  • Publication number: 20240014352
    Abstract: A light-emitting device includes a substrate including a top surface, a first side surface and a second side surface, wherein the first side surface and the second side surface of the substrate are respectively connected to two opposite sides of the top surface of the substrate; a semiconductor stack formed on the top surface of the substrate, the semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first electrode pad formed adjacent to a first edge of the light-emitting device; and a second electrode pad formed adjacent to a second edge of the light-emitting device, wherein in a top view of the light-emitting device, the first edge and the second edge are formed on different sides or opposite sides of the light-emitting device, the first semiconductor layer adjacent to the first edge includes a first sidewall directly connected to the first side surface of the substrate,
    Type: Application
    Filed: September 20, 2023
    Publication date: January 11, 2024
    Inventors: Chao-Hsing CHEN, Cheng-Lin LU, Chih-Hao CHEN, Chi-Shiang HSU, I-Lun MA, Meng-Hsiang HONG, Hsin-Ying WANG, Kuo-Ching HUNG, Yi-Hung LIN
  • Patent number: 11871355
    Abstract: Methods, systems, and devices for wireless communications are described. In some systems, a user equipment (UE) may transmit a sounding reference signal (SRS) to a base station using an SRS antenna switch (SRS-AS) or an SRS carrier switch (SRS-CS) transmission technique and the UE may feature multiple antenna groups that have separate exposure budgets due to their spatial separation. The UE may employ one or more accounting procedures for tracking energy contributions associated with the SRS across the multiple antenna groups of the UE and may employ one or more power control procedures for setting a transmit power for an uplink signal in accordance with the energy contributions associated with the SRS.
    Type: Grant
    Filed: April 13, 2021
    Date of Patent: January 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Farhad Meshkati, Alexei Yurievitch Gorokhov, Sanghoon Kim, Troy Curtiss, Dinesh Kumar Devineni, Ashok Mantravadi, Lin Lu
  • Patent number: 11871359
    Abstract: Techniques and apparatus for configurable radio frequency (RF) exposure compliance based on region. An example method of wireless communication by a user equipment (UE) generally includes identifying a region in which the UE is located, selecting at least one of a mode or one or more parameters for RF exposure compliance based on the identified region, and transmitting a signal at a transmission power level based at least in part on the at least one of the selected mode or the selected one or more parameters.
    Type: Grant
    Filed: September 9, 2021
    Date of Patent: January 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Lin Lu, Jagadish Nadakuduti, Akhil Deodhar, Troy Curtiss, Paul Guckian
  • Patent number: 11870478
    Abstract: An apparatus including a housing; sensors configured to sense one or more locations upon which a user is gripping the housing; sensors including antenna modules configured to transmit a signal based on the one or more locations upon which the user is gripping the housing. Another aspect relates to an apparatus including a housing; a set of antenna modules situated proximate at different surface locations along the housing; and a controller configured to operate the set of antenna modules to determine at least one or more electromagnetic leakage coupling between at least one pair of antenna modules of the set. In this aspect, the controller may be configured to select one or more of the set of antenna modules for transmitting a signal based on the one or more electromagnetic leakage coupling associated with one or more of the different locations where a user grips the housing, respectively.
    Type: Grant
    Filed: July 23, 2021
    Date of Patent: January 9, 2024
    Assignee: QUALCOMM Incorporated
    Inventors: Udara Fernando, Lin Lu
  • Patent number: 11854992
    Abstract: A method of manufacturing a semiconductor structure includes following operations. A first die is provided. A first molding is formed to encapsulate the first die. A second die is disposed over the first molding. A mold chase is disposed over the second die and the first molding. The mold chase includes a protrusion protruded from the mold chase towards the first molding. A molding material is disposed between the mold chase and the first molding. A second molding is formed to surround the second die. The second die is at least partially covered by the second molding. The disposing of the mold chase includes surrounding the protrusion of the mold chase by the molding material.
    Type: Grant
    Filed: November 19, 2021
    Date of Patent: December 26, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Chen-Hua Yu, Kai-Chiang Wu, Chun-Lin Lu
  • Publication number: 20230403946
    Abstract: A method for fabricating semiconductor device includes first forming a first magnetic tunneling junction (MTJ) and a second MTJ on a substrate, performing an atomic layer deposition (ALD) process or a high-density plasma (HDP) process to form a passivation layer on the first MTJ and the second MTJ, performing an etching process to remove the passivation layer adjacent to the first MTJ and the second MTJ, and then forming an ultra low-k (ULK) dielectric layer on the passivation layer.
    Type: Application
    Filed: August 28, 2023
    Publication date: December 14, 2023
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Hui-Lin Wang, Tai-Cheng Hou, Wei-Xin Gao, Fu-Yu Tsai, Chin-Yang Hsieh, Chen-Yi Weng, Jing-Yin Jhang, Bin-Siang Tsai, Kun-Ju Li, Chih-Yueh Li, Chia-Lin Lu, Chun-Lung Chen, Kun-Yuan Laio, Yu-Tsung Lai, Wei-Hao Huang
  • Publication number: 20230403053
    Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an apparatus may determine a time-averaged power limit of a set of antennas. The apparatus may modify an antenna switching configuration based at least in part on the time-averaged power limit. The apparatus may transmit a signal using an antenna, from the set of antennas, associated with the modified antenna switching configuration, wherein the antenna is associated with a higher power limit than one or more other antennas. Numerous other aspects are described.
    Type: Application
    Filed: August 24, 2023
    Publication date: December 14, 2023
    Inventors: Thawatt GOPAL, Sridhar BANDARU, Brian Clarke BANISTER, Reza SHAHIDI, Troy CURTISS, Akhil DEODHAR, Lin LU, Jagadish NADAKUDUTI
  • Publication number: 20230397123
    Abstract: Certain aspects of the present disclosure provide techniques for transmit energy allocation. A method that may be performed by a wireless device includes obtaining reserve information associated with an antenna group associated with a plurality of radios including a first radio and second radios, the first radio communicating via a first type of radio access technology and the second radios communicating via a second type of radio access technology, different from the first type of radio access technology; determining a reserve for each of the radios based at least in part on the reserve information and an active state associated with each of the radios; and transmitting one or more signals using at least one of the radios at a transmit power determined based at least in part on a radio frequency exposure limit associated with each of the radios and the reserve for each of the radios.
    Type: Application
    Filed: May 30, 2023
    Publication date: December 7, 2023
    Inventors: Huang LOU, Arnaud MEYLAN, Farhad MESHKATI, Reza SHAHIDI, Lin LU, Jagadish NADAKUDUTI
  • Publication number: 20230397130
    Abstract: Certain aspects of the present disclosure provide techniques and apparatus for multi-radio transmission scaling. A method that may be performed by a wireless device includes obtaining scaling information indicative of a relationship between a first radio frequency (RF) exposure associated with a plurality of first radios and a second RF exposure associated with a single second radio, and transmitting signals using a plurality of radios at one or more transmit powers determined based at least in part on a time-averaged RF exposure limit and the scaling information.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 7, 2023
    Inventors: Jagadish NADAKUDUTI, Lin LU, Paul GUCKIAN
  • Publication number: 20230396279
    Abstract: Certain aspects of the present disclosure provide techniques for operating a wireless communication device pursuant to radio frequency (RF) exposure across tissues and/or body locations. An example method of wireless communication by a wireless device generally includes tracking a plurality of RF exposures across a plurality of locations associated with a human body over time. The method further includes transmitting a signal at a transmit power determined based at least in part on a time-averaged RF exposure limit and the tracked RF exposures.
    Type: Application
    Filed: May 31, 2023
    Publication date: December 7, 2023
    Inventors: Lin LU, Jagadish NADAKUDUTI, Paul GUCKIAN