Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may transmit, based at least in part on a transmit configuration, a first communication associated with a first group of logical channels associated with at least a portion of an ON duration of an uplink transmission interval configuration. The UE may transmit, based at least in part on the transmit configuration, a second communication during at least a portion of an OFF duration of the uplink transmission interval configuration, wherein the transmit configuration indicates a first amount of energy for the first communication based at least in part on the first communication being associated with the first group of logical channels and a second amount of energy for the second communication based at least in part on the second communication being associated with a second group of logical channels. Numerous other aspects are provided.

Abstract: An artificial intelligence (AI) calculation circuit is provided. The AI calculation circuit can support various integer and floating-point calculations through the adjustment of circuit configuration. Integer multiplication and floating-point mantissa multiplication share the multiplication unit, integer comparison and floating-point comparison share the same comparison unit, integer addition and floating-point addition share the same addition unit.

Abstract: A mixed-precision artificial intelligence (AI) processor and an operating method thereof are provided. The AI processor includes a first calculation module, a second calculation module and a control module. The first calculation module is configured to perform calculation based on the data with a first format. The second calculation module is configured to perform calculation based on the data with a second format different from the first format. The control module is coupled to the first calculation module and the second calculation module to select one of the first calculation module or the second calculation module to perform calculation based on an input data according to a calculation strategy.

Abstract: Provided is a package structure and a method of fabricating the same. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A processed wafer includes an outer surface, and a treated portion having a depth of 0 to 50 ?m measured from the outer surface. At least a part of the treated portion has an oxygen concentration of less than 13 wt %. A method for processing a wafer includes the steps of: applying a reducing medium on the wafer, the reducing medium is in powder form and including a reducing agent, and at least one of a catalyst and a releasing agent; subjecting the wafer to a reduction reaction at a temperature below Curie temperature of the and under a non-oxidizing atmosphere so as to obtain the aforesaid processed wafer.

Abstract: A package structure includes a first and a second conductive feature structures, a die, an insulator, an encapsulant, an adhesive layer, and a first through via. The die is located between the first conductive feature structure and the second conductive feature structure. The die is electrically connected to the second conductive feature structure. The insulator is disposed between the die and the first conductive feature structure. The insulator has a bottom surface in physical contact with a polymer layer of the first conductive feature structure. The encapsulant is located between the first conductive feature structure and the second conductive feature structure. The encapsulant is disposed on the insulator and laterally encapsulates the die and the insulator. The adhesive layer is disposed between the die and the insulator. The first through via extends through the encapsulant to connect to the first conductive feature structure and the second conductive feature structure.

Abstract: A package structure includes an insulating encapsulation, at least one semiconductor die, a redistribution circuit structure, and first reinforcement structures. The at least one semiconductor die is encapsulated in the insulating encapsulation. The redistribution circuit structure is located on the insulating encapsulation and electrically connected to the at least one semiconductor die. The first reinforcement structures are embedded in the redistribution circuit structure. A shape of the package structure includes a polygonal shape on a vertical projection along a stacking direction of the insulating encapsulation and the redistribution circuit structure, and the first reinforcement structures are located on and extended along diagonal lines of the package structure.

Abstract: An integrated fan-out package includes a first redistribution structure, a die, an insulation encapsulation, and at least one first through interlayer via. The first redistribution structure includes a dielectric layer, a feed line at least partially disposed on the dielectric layer and a signal enhancement layer covering the feed line, wherein the signal enhancement layer has a lower dissipation factor (DO and/or a lower permittivity (Dk) than the dielectric layer. The die is disposed on the first redistribution structure. The insulation encapsulation encapsulates the die. The at least one first TIV is embedded in the insulation encapsulation and the signal enhancement layer.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for determining a transmit power based on a pattern and/or future conditions for a transmission while maintaining radio frequency (RF) exposure compliance. An example method generally includes obtaining a pattern associated with one or more first transmissions, determining a transmit power for one or more second transmissions based at least in part on the pattern and an RF exposure limit, and transmitting the one or more second transmissions at the determined transmit power.

Abstract: A Bluetooth earphone includes an earbud portion and an earphone handle portion. A receiver module is disposed in the earbud portion. The earphone handle portion includes a connecting section connected to the earbud portion, and a top section and a bottom section located on both sides of the connecting section, a battery is disposed in the bottom section of the earphone handle portion. The Bluetooth earphone includes an antenna and a flexible circuit board. The antenna extends from the connecting section of the earphone handle portion to the top section of the earphone handle portion. The flexible circuit board includes a feeding part and a first extension part connected to the feeding part. The feeding part is located in the connecting section of the earphone handle portion, and is coupled to the antenna. The first extension part extends to the earbud portion.

Abstract: Certain aspects of the present disclosure provide techniques and apparatus for determining a transmit power based on a pattern and/or future conditions for a transmission while maintaining radio frequency (RF) exposure compliance. An example method generally includes obtaining a pattern associated with one or more first transmissions, determining a transmit power for one or more second transmissions based at least in part on the pattern and an RF exposure limit, and transmitting the one or more second transmissions at the determined transmit power.

Abstract: Provided is a package structure and a method of fabricating the same. The package structure includes a die; a first encapsulant, laterally encapsulating the die; a first redistribution structure, disposed on the first encapsulant and the die; a second encapsulant, disposed on the first redistribution structure; an antenna pattern, embedded in the second encapsulant and electrically connected to the first redistribution structure; and a dielectric layer, covering the antenna pattern, wherein an upper surface of the second encapsulant is exposed by the dielectric layer, and a laser mark is formed within the upper surface of the second encapsulant.

Abstract: A computing device for floating-point mathematic operation using look-up table is provided. The computing device includes: a bit arrangement unit used for receiving a floating-point input data and performing a bit arrangement or a format conversion on the floating-point input data to generate multiple index blocks; a first look-up table unit group used for receiving the index blocks and performing look-up operation using the index blocks as index to generate a plurality of look-up table results; and an operation unit used for performing operation on the look-up table results of the first look-up table unit group to generate an operation output.

Abstract: A hardware accelerator is provided. The hardware accelerator includes a first memory; a source address generation unit coupled to the first memory; a data collection unit coupled to the first memory; a first data queue coupled to the data collection unit; a data dispersion unit coupled to the first data queue; a destination address generation unit coupled to the data dispersion unit; an address queue coupled to the destination address generation unit; a second data queue coupled to the data dispersion unit; and a second memory coupled to the second data queue. The hardware accelerator can perform anyone or any combination of tensor stride, tensor reshape and tensor transpose to achieve tensorflow depth-to-space permutation or tensorflow space-to-depth permutation.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may identify, while camped on a first cell associated with a first radio access technology (RAT), a power management level for a communication using a second RAT, wherein the power management level indicates an available power for the communication using the second RAT, and wherein the available power is based at least in part on an exposure rate or an absorption rate. The UE may delay a transmission of a measurement report on the first cell based at least in part on the identification of the power management level. Numerous other aspects are provided.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, a user equipment (UE) may allocate a first amount of power to one or more radios for a time window based on radio frequency (RF) exposure information and one or more other criteria. The UE may allocate a second amount of power to a selected channel or communication utilized by at least one radio of the one or more radios for one or more time frames within the time window based on the first amount of power allocated to the at least one radio for the time window. The UE may transmit the selected channel or communication based on the first amount of power or the second amount of power. Numerous other aspects are described.

Abstract: An electronic apparatus includes a sound collecting device, a storage device, a display device, and a control device. The storage device contains a normal spectrogram representing the operation sound of each of functional units, acquired when low-speed operation is normally performed, and a timing chart indicating a timing that each functional unit operates when the electronic apparatus performs the low-speed operation. The control device analyzes frequency of the sound data collected by the sound collecting device when the electronic apparatus performs the low-speed operation, and outputs the spectrogram, decides whether abnormal noise has occurred, by comparison between the outputted spectrogram and the normal spectrogram, identifies, upon deciding that abnormal noise has occurred, the functional unit that is a source of the abnormal noise, by comparison between the timing chart and the outputted spectrogram, and causes the display device to display a first screen indicating the identified functional unit.

Abstract: Various aspects of the present disclosure generally relate to wireless communication. In some aspects, an apparatus may determine a time-averaged power limit of a set of antennas. The apparatus may modify an antenna switching configuration based at least in part on the time-averaged power limit. The apparatus may transmit a signal using an antenna, from the set of antennas, associated with the modified antenna switching configuration, wherein the antenna is associated with a higher power limit than one or more other antennas. Numerous other aspects are described.

Abstract: A package structure includes a redistribution circuit structure, at least one semiconductor die, an insulating encapsulation, insulators, and metallic patterns. The at least one semiconductor die is located on and electrically connected to the redistribution circuit structure. The insulating encapsulation encapsulates the at least one semiconductor die and located on the redistribution circuit structure. The insulators are located on the redistribution circuit structure, wherein the insulators are separated and spaced apart from each other, wherein edges of each of the insulators are distant from edges of the at least one semiconductor die by an offset in a stacking direction of the redistribution circuit structure and the insulating encapsulation. Each of the metallic patterns is located on a respective one of the insulators.

Abstract: Techniques and apparatus for configurable radio frequency (RF) exposure compliance based on region. An example method of wireless communication by a user equipment (UE) generally includes identifying a region in which the UE is located, selecting at least one of a mode or one or more parameters for RF exposure compliance based on the identified region, and transmitting a signal at a transmission power level based at least in part on the at least one of the selected mode or the selected one or more parameters.