Abstract: A control method for a nonvolatile storage device having a storage mode in which in a memory cell provided with a trapping dielectric layer 1-bit data is stored depending on the presence or absence of charge in a first trapping region. In a dynamic reference cell initialization operation, a charge accumulation operation is performed, as a preset operation in the initialization operation, on second trapping regions of first and second dynamic reference cells to a charge accumulation operation on a second trapping region of the memory cell. In addition, at the time of data rewrite, preprogram verification and preprogramming are performed on the first trapping regions. This makes it possible to shorten the time taken for initialization and data rewrite.

Abstract: The present invention provides a semiconductor device that includes: a memory cell array that includes non-volatile memory cells; a first selecting circuit that connects or disconnects a source and a drain of a transistor that forms one of the memory cells, to or from a data line DATAB connected to a first power supply; and a second selecting circuit that connects or disconnects the source and drain to or from a ground line ARVSS connected to a second power supply. In this semiconductor device, the first selecting circuit and the second selecting circuit are arranged on the opposite sides of the memory cell array. The present invention also provides a method of controlling the semiconductor device.

Abstract: The present invention provides a semiconductor device and a method for controlling a semiconductor device having a memory cell array having a plurality of nonvolatile memory cells, the method including detecting the number of bits to be written as division data that is divided from data to be programmed into the memory cell array, comparing the number of bits with a predetermined number of bits, inverting or not inverting the division data to produce inversion data in accordance with a result of comparing the number of bits with the predetermined number of bits, and programming the inversion data into the memory cell array. The method further includes detecting the number of bits to be written as next division data and comparing the number of bits of next division data with the predetermined number of bits, while concurrently programming the inversion data into the memory cell array.

Abstract: A semiconductor device includes: memory blocks each having groups of memory cells that are connected to word lines; select gates for selecting the groups of memory cells; and an apply circuit that applies, at the time of reading data, a back bias to the select gates of unselected memory blocks.

Abstract: A semiconductor device includes: a pump circuit that boosts an output node connected to a memory cell array; an oscillator that outputs a clock to the pump circuit; and a detection circuit that outputs an actuating signal to the oscillator. In this semiconductor device, the actuating signal actuates the oscillator when the voltage of the output node of the pump circuit is lower than a first reference voltage, and the actuating signal stops the oscillator when the voltage of the output node is higher than a second reference voltage. In accordance with the present invention, when the voltage of the output node of the pump circuit is higher than the target voltage, the oscillator is stopped, and so is the pump circuit. Thus, unnecessary charge flow to the ground can be prevented, and the power consumption of the booster circuit can be reduced.

Abstract: The precharge circuit is provided for precharging, before programming the data, the voltage of the source line ARVSS commonly connected to the memory cells provided in the same sector. The voltage of the source line ARVSS of the memory cell MC is precharged before programming the data, and the voltage of the source line ARVSS of the memory cell MC is not lowered at the time of programming the data, even if the data programming period is shortened. It is thus possible to prevent the leak current during the programming and program the data into the memory cell MC optimally.

Abstract: A SONOS memory cell, formed within a semiconductor substrate, includes a bottom dielectric disposed on the semiconductor substrate, a charge trapping material disposed on the bottom dielectric, and a top dielectric disposed on the charge trapping material. Furthermore, the SONOS memory cell includes a word-line gate structure disposed on the top dielectric and at least one bit-line gate for inducing at least one inversion bit-line within the semiconductor substrate.

Abstract: A semiconductor device includes: a memory cell array that has a plurality of non-volatile memory cells each having a first bit and a second bit in different regions in a charge storing layer; an SRAM array (first memory unit) that stores data to be written into the memory cell array; a WR sense amplifier block (second memory unit) that stores first divided data to be written into the first bit and second divided data to be written into the second bit, the first divided data being formed by dividing the data into predetermined units, the second divided data being formed by dividing the data into predetermined units; and a control circuit that writes the second divided data into the first bit of the memory cells of the memory cell array (step S28) after writing the first divided data into the second bit of the memory cells of the memory cell array (step S22).

Abstract: The present invention provides a semiconductor memory and a control method therefor, the semiconductor device including a first current-voltage conversion circuit (16) connected to a core cell (12) provided in a nonvolatile memory cell array (10), a second current-voltage conversion circuit (26) connected to a reference cell (22) through a reference cell data line (24), a sense amplifier (18) sensing an output from the first current-voltage conversion circuit and an output from the second current-voltage conversion circuit, a compare circuit (28) comparing a voltage level at the reference cell data line with a predefined voltage level, and a charging circuit (30) charging the reference cell data line, if the voltage level at the reference cell data line is lower than the predefined voltage level during pre-charging the reference cell data line. According to the present invention, the pre-charging period of the reference cell data line can be shortened, and the data read time can be shortened.

Abstract: A SONOS memory cell, formed within a semiconductor substrate, includes a bottom dielectric disposed on the semiconductor substrate, a charge trapping material disposed on the bottom dielectric, and a top dielectric disposed on the charge trapping material. Furthermore, the SONOS memory cell includes a word-line gate structure disposed on the top dielectric and at least one bit-line gate for inducing at least one inversion bit-line within the semiconductor substrate.

Abstract: A semiconductor device includes a semiconductor substrate, word lines, global bit lines, and inversion gates that form inversion layers serving as local bit lines in the semiconductor substrate. The inversion layers are electrically connected to the global bit lines and a memory cell uses the inversion layers as a source and a drain.

Abstract: A semiconductor device (1) includes a non-volatile memory cell array (2), a write/read circuit (30) writing data into and reading data from the non-volatile memory cell array (2), a data input/output circuit (80), and a volatile memory cell array (40) including a first latch circuit (41) that is connected to the write/read circuit (30) and latches first data, and a second latch circuit (42) that is connected to the data input/output circuit (80) and latches second data. The device (1) may further include an inverter circuit (310) that inverts the first data in accordance with the number of bits to be actually written among the first data, and a control circuit (3) that causes the second data to be latched in the second latch circuit (42) while the first data is being written into the non-volatile memory cell array (2). This semiconductor device (1) has a shorter writing time and a smaller circuit area.

Abstract: A semiconductor device includes: memory blocks each having groups of memory cells that are connected to word lines; select gates for selecting the groups of memory cells; and an apply circuit that applies, at the time of reading data, a back bias to the select gates of unselected memory blocks.

Abstract: A semiconductor device includes: groups of memory cells that are connected to word lines; and select gates that are controlled by control word lines and are connected to the groups of memory cells, each of the select gates being capable of storing protection information for a respective one of the groups of memory cells.

Abstract: The present invention has an arrangement that includes a Y decoder that selects a main bit line MBL to which sub bit lines SBL connected to memory cells MC are connected and selects main bit lines MBL adjacent to the selected main bit line MBL, and a YRST transistor that connects the adjacent main bit lines MBL to a given interconnection line and set these main bit lines to a given voltage. With this structure, it is possible to restrain noise from the adjacent main bit lines MBL to the minimum and prevent degradation of the voltage margin.

Abstract: The precharge circuit is provided for precharging, before programming the data, the voltage of the source line ARVSS commonly connected to the memory cells provided in the same sector. The voltage of the source line ARVSS of the memory cell MC is precharged before programming the data, and the voltage of the source line ARVSS of the memory cell MC is not lowered at the time of programming the data, even if the data programming period is shortened. It is thus possible to prevent the leak current during the programming and program the data into the memory cell MC optimally.

Abstract: The present invention is a memory circuit, comprises: a memory cell array including a plurality of bit lines, a plurality of word lines, and a plurality of memory cells disposed in the positions of intersection between the bit lines and the word lines; and a page buffer, which is connected to the bit line and which detects memory cell data by judging with predetermined sense timing the potential of the bit line when a pre-charged bit line potential is discharged in accordance to a cell current of a selected memory cell. Further the sense timing differs in accordance with the position of the selected memory cell in the memory cell array.

Abstract: When data is programmed into nonvolatile memory cells, a programming voltage is applied, with increasing, to the memory cells a plurality of times. During this data programming, the increment of the programming voltage is set to a first voltage, which is maintained until the threshold voltages of all the memory cells to be programmed reach an initial value. Thereafter, the increment is set to a second voltage, which is maintained until the threshold voltages reach a target value. Increasing the programming voltage without varying the increment thereof allows the threshold voltages of the memory cells to approach the target value in a smaller number of times programmed. Additionally, setting the increment of the programming voltage to the second voltage after the threshold voltages exceed the initial value can minimize the deviation of the threshold voltages from the target value. Consequently, the programming time of the memory cells can be reduced.

Abstract: A nonvolatile semiconductor memory with a plurality of banks in which copy back is performed between banks. An input circuit accepts input of a copy back command which requests a data transfer in the memory. When the copy back command is input from the input circuit, a judgment circuit judges whether a source and a destination are in the same bank. If the judgment circuit judges that the source and the destination are in the same bank, a first transfer circuit transfers data in the same bank. If the judgment circuit judges that the source and the destination are in different banks, a second transfer circuit transfers data between the two different banks.

Abstract: A nonvolatile semiconductor memory device includes a memory core circuit which is nonvolatile and stores multi-values therein by setting different thresholds to memory cells, and a control circuit which controls data writing into the memory core circuit, wherein the control circuit programs first memory cells to be at one of the thresholds by setting the one of the thresholds not only to the first memory cells but also to second memory cells that are subsequently to be programmed to any one of the thresholds higher than the one of the thresholds, the control circuit successively performing programming in an ascending order of the thresholds.