Abstract: The instant disclosure generally relates to a multicomponent composition for coloring mammalian or synthetic substrate material and textiles, the composition comprising a first and second components and a third component. The first and second components comprise first and second silicone polymers respectively. Any one or more of the first, second and third components may also comprise pigment microparticles. The first, second and third compounds meld together on substrate material and textiles and especially on hair to form a highly remanent colored coating. The multicomponent composition formed and set in situ as a solid linked coating has a substantially permanent pigment lastingness and minimally alters the substrate material and textiles.

Abstract: A power injector system having a power injector for enabling delivery of fluid in an injection procedure to be performed on a patient may include one or more processors; a first user interface; and a second user interface. The first user interface and the second user interface may be configured to accept a plurality of user inputs associated with control of a plurality of operations of the power injector system and display information associated with the plurality of operations. One of the first user interface and the second user interface may be proximate to the power injector and the other may be remote from the power injector. The one or more processors may be programmed and/or configured to independently control the first user interface and the second user interface based on a first user input and a next user input received from the first user interface and/or the second user interface.

Abstract: A fluid injector system has a controller for operably controlling the injection of contrast and/or saline into a patient. The controller allows a user to program a diagnostic injection procedure having one or more phases according to which the contrast and/or saline will be injected into the patient so as to effect enhancement of a region thereof during an imaging procedure. It further allows the user to program a test injection procedure to be performed prior to the diagnostic injection procedure. The test injection procedure is implementable as: (a) a variable single phase test injection in which the rate at which the saline is to be delivered is selectable prior to and may be varied during performance thereof; and/or (b) a multi-phase test injection in which the rate at which the saline is to be delivered is selectable for each phase of the multi-phase test injection prior to performance thereof.

Abstract: A power injector system having a power injector for enabling delivery of fluid in an injection procedure to be performed on a patient may include one or more processors; a first user interface; and a second user interface. The first user interface and the second user interface may be configured to accept a plurality of user inputs associated with control of a plurality of operations of the power injector system and display information associated with the plurality of operations. One of the first user interface and the second user interface may be proximate to the power injector and the other may be remote from the power injector. The one or more processors may be programmed and/or configured to independently control the first user interface and the second user interface based on a first user input and a next user input received from the first user interface and/or the second user interface.

Abstract: The present application relates to polymers of Formula (I), (II) and (III) which, when combined with a silicone elastomer or a silicone pre-elastomer, modifies the properties of the elastomer, for example, by delivering to the elastomer surface enhanced hydrophilic (wettable) and/or antimicrobial properties. The present application also relates to polymers of Formula (I), (II) and/or (III), which have antimicrobial activities. Methods of using the polymers and silicone elastomers coated with the polymers are also included in the application.

Abstract: A fluid injector system includes a control device operably associated with at least one drive component for use in actuating a plurality of fluid containers in fluid communication with a patient through an administration line. The control device includes at least one processor programmed or configured to enable programming of a diagnostic injection protocol comprising one or more phases according to which at least one of the first and the second fluid containers are selectively actuatable by the at least one drive component to enable injection of at least one of a first fluid and a second fluid into the patient. The control device is further programmed or configured to enable selection and commencement of at least partial preloading into the administration line of at least one of the first fluid and the second fluid in accordance with the one or more phases of the diagnostic injection protocol.

Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.

Abstract: A heat transfer media that provides more complete and more even use of the media volume by enhancing the characteristics and/or directions of fluid flow across the media. The heat transfer media includes a heat transfer block having one or more layers that include longitudinal flow passages for enabling fluid flow in the longitudinal direction across each layer, and also include transverse flow passage for enabling lateral cross-flow between the longitudinal flow passages. The heat transfer block may include a plurality of stackable plates, with each plate having fins laterally spaced apart to define longitudinally extending channels, and at least one aperture extending transversely through at least one fin for enabling transverse cross-flow between the longitudinal channels. The aperture may be configured as a recessed groove in the fin, and the fin may have ridge portions longitudinally spaced apart to at least partially define the recessed groove.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.

Abstract: A disabling device includes an adhesive layer and/or a self-hardening material. The adhesive layer or self-hardening material contacts electrical contacts of an electrical interface.

Abstract: Spectrophotometric sensors for measuring the concentration of various solutions are disclosed. Methods for controlling the introduction of disinfectants using such sensors for water treatment are also disclosed. Hypochlorite strength is monitored in at least some embodiments.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.

Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.