Abstract: A system for data communications includes a port scan detector, a decoy port system, a data packet hash manager, an encapsulated artificial intelligence system and an offensive code system configured to implant offensive code in the sending device and to control operation of the sending device if the sending device is the hostile device, if the sending device is not operating the has increment system and if the data communications are not consistent with the levelling algorithm.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: The present invention provides methods and system of identifying and communicating optimal fantasy sports pick(s). The methods comprise receiving, from one or more individual user(s), requests for entry into a contest; accepting said requests for entry into said contest; initiating said contest; and awarding prizes based on said ranking of users at the end of the contest.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a system comprises a semiconductor component including an interposer substrate, a microelectronic die over the interposer substrate, and a connection structure composed of a volume of solder material between the interposer substrate and the microelectronic die. The connection structure can include at least one of (a) a single, unitary structure covering approximately all of the back side of the microelectronic die, and (b) a structure electrically isolated from internal active features of the microelectronic die. In some embodiments, the connection structure can be positioned to provide generally consistent stress distribution within the system.

Abstract: A disabling device includes an adhesive layer and/or a self-hardening material. The adhesive layer or self-hardening material contacts electrical contacts of an electrical interface.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.

Abstract: This invention provides the end-to-end control, networking, and data management for the 1.) identification of event signings, 2.) generation of push invitations to such events, 3.) personalization of ebooks via reader-author collaboration to embed Personalized Multimedia Autographs (PMAs) into the ebook or other media, 4.) event line control allowing readers to browse the bookstore or mingle while waiting for collaboration with the author during these events, 5.) capability for the readers and author to discuss the event on social media after the readers have registered for the event enabling the author to tailor his/her comments at the vent to the readers' interests; 6.) synchronization and archival of the PMA among all of the reader's devices, 7.) integration of special services such as reserved seating as well as food and beverage that may make invitations to such events in the future very exclusive.

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract: Spectrophotometric sensors for measuring the concentration of various solutions are disclosed. Methods for controlling the introduction of disinfectants using such sensors for water treatment are also disclosed. Hypochlorite strength is monitored in at least some embodiments.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: An apparatus is provided to display errors. The apparatus includes an error display module, a memory, and a processor. The error display module to provide a collection of error data. The collection of error data for at least one error from an electronic component. The memory to store a set of instructions. The processor coupled to the memory. The set of instructions instructing the processor to store the collection of error data and display the collection of error data without using power from the electronic component.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: In one embodiment, a printed circuit board has a hole. The hole has a longest extent on a surface of the printed circuit board. A clip is held in the hole by feet of prongs. The feet are extensions each having a length that is more than half the longest extent of the hole. A heat sink is held, in part, relative to the printed circuit board by the clip. A part of the heat sink contacts a loop of the clip and applies a force on the clip directed away from the printed circuit board. The feet of the clip on an opposite side of the printed circuit board than the heat sink hold the clip to the printed circuit board to counteract the force. The prongs are configured to offset the feet such that the extensions overlap with the lengths extending along the longest extent of the hole by less than a sum of the lengths of the feet and less than the longest extent for insertion through the hole.

Abstract: The present application relates to polymers of Formula (I) and (II) which, when combined with a silicone elastomer or a silicone pre-elastomer, modifies the surface properties of the elastomer, for example by making the elastomer surface more hydrophilic or reactive to other compounds resulting in the functionalization of the elastomer surface. Methods of using the polymers and silicone elastomers coated with the polymers are also included in the application.

Abstract: A system for data communications comprising a port scan detector configured to receive port access requests from a plurality of ports and to determine whether a port scan by a hostile device is in progress. A decoy port system configured to open a designated decoy port if the port scan detector determines that the port scan by a hostile device is in progress. A data packet hash manager configured to read a series of hash data fields in a corresponding series of data packets and to generate a flag if a sending device is not operating a hash increment system. An encapsulated artificial intelligence system configured to receive the flag and to monitor data communications from the sending device to determine whether the data communications are consistent with a levelling algorithm.

Abstract: Moisture curable RTV-1 silicone elastomers with hydrophilic surfaces are produced from crosslinkable compositions containing a polyoxyethylene ether glycol terminated with both a C6-22 hydrocarbon group and an alkoxysilyl group.

Abstract: Packaged semiconductor components having substantially rigid support member are disclosed. The packages can include a semiconductor die and a support member proximate to the semiconductor die. The support member is at least substantially rigid. The packages can further include an adhesive between the support member and the semiconductor die and adhesively attaching the support member to the semiconductor die. The packages can also include a substrate carrying the semiconductor die and the support member attached to the semiconductor die.

Abstract: Compounds of the formula where R1 each individually is identical or different and is a hydrocarbon radical, R2 each individually is hydrogen or a methyl radical, n is an integer from 6 to 11, and m is 0 or 1, with the proviso that the sum of the number of carbon atoms in the three radicals R1 in the compound of the formula (I) is 6 to 24, can be admixed with curable polymer compositions to form products with hydrophilic surfaces, or can be applied to surfaces to render them hydrophilic.

Abstract: Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices are disclosed. In one embodiment, a method for forming a microelectronic device includes attaching a microelectronic die to a support member by forming an attachment feature on at least one of a back side of the microelectronic die and the support member. The attachment feature includes a volume of solder material. The method also includes contacting the attachment feature with the other of the microelectronic die and the support member, and reflowing the solder material to join the back side of the die and the support member via the attachment feature. In several embodiments, the attachment feature is not electrically connected to internal active structures of the die.