Patents by Inventor Michael RIZZOLO

Michael RIZZOLO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9837485
    Abstract: Capacitors and methods of forming the same include forming a gap in a dielectric layer underneath one or more conducting lines, such that the one or more conducting lines are suspended over the gap. A capacitor stack is deposited in the gap and on the conducting lines. Respective contacts are deposited on the conducting lines and on the capacitor stack.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: December 5, 2017
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Patent number: 9837355
    Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parrallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
    Type: Grant
    Filed: March 22, 2016
    Date of Patent: December 5, 2017
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170344722
    Abstract: A cognitive health management method, system, and non-transitory computer readable medium, include analyzing user input data of a first user by comparing the user input data of the first user to medical data in the database, and providing both of: a recommendation to the first user based on the comparison of the user input data of the first user to the medical data of the database, and a result feedback including a conclusion of the analyzing to a result feedback section of the database.
    Type: Application
    Filed: May 27, 2016
    Publication date: November 30, 2017
    Inventors: Maryam Ashoori, Benjamin David Briggs, Lawrence A. Clevenger, Leigh Anne Hodges Clevenger, Jonathan Hudson Connell, II, Michael Rizzolo
  • Patent number: 9824982
    Abstract: Methods for enhancing mechanical strength of back-end-of-line (BEOL) dielectrics to prevent crack propagation within interconnect stacks are provided. After forming interconnect structures in a dielectric material layer, a pore filling material is introduced into pores of a portion of the dielectric material layer that is located in a crack stop region present around a periphery of a chip region. By filling the pores of the portion of the dielectric material layer located in the crack stop region, the mechanical strength of the dielectric material layer is selectively enhanced in the crack stop region.
    Type: Grant
    Filed: August 9, 2016
    Date of Patent: November 21, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170317025
    Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parrallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
    Type: Application
    Filed: July 14, 2017
    Publication date: November 2, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170301749
    Abstract: Capacitors and methods of forming the same include forming a gap in a dielectric layer underneath one or more conducting lines, such that the one or more conducting lines are suspended over the gap. A capacitor stack is deposited in the gap and on the conducting lines. Respective contacts are deposited on the conducting lines and on the capacitor stack.
    Type: Application
    Filed: June 30, 2017
    Publication date: October 19, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170301621
    Abstract: A method for via alignment includes forming first airgaps between interconnect structures and depositing a pinch off layer to close off openings to the first airgaps. A protection layer is formed in divots in the pinch off layer. The protection layer and the pinch off layer are planarized to form a surface where the protection layer remains in the divots. An interlevel dielectric layer (ILD) is deposited on the surface. The ILD and the pinch off layer are etched using the protection layer as an etch stop to align a via and expose the interconnect structure through the via.
    Type: Application
    Filed: October 28, 2016
    Publication date: October 19, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Patent number: 9793206
    Abstract: A method for forming trenches of an interconnect network in a substrate. The method includes forming a first trench in the substrate, which has a first width. The method also includes forming a second trench in the substrate, which has a second width that is greater than the first width. The method also includes depositing a metal layer into the trenches, applying a dielectric over the metal, and diffusing metal atoms from the trenches to the dielectric. The dielectric absorbs a majority of the metal atoms from the first trench while simultaneously absorbing only a minority of metal atoms from the second trench.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: October 17, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170288011
    Abstract: Capacitors and methods of forming the same include forming a gap in a dielectric layer underneath one or more conducting lines, such that the one or more conducting lines are suspended over the gap. A capacitor stack is deposited in the gap and on the conducting lines. Respective contacts are deposited on the conducting lines and on the capacitor stack.
    Type: Application
    Filed: April 5, 2016
    Publication date: October 5, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. Deprospo, Huai Huang, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170286632
    Abstract: Embodiments include method, systems and computer program products for providing medication-related feedback. Aspects include receiving medication information for a patient. Aspects also include receiving a biological, behavioral, or environmental output from a sensor. Aspects also include determining, based upon the biological, behavioral, or environmental output and the medication information for the patient, whether a medication dose is needed. Aspects also include, based on a determination that the medication dose is needed, generating an alert.
    Type: Application
    Filed: March 29, 2016
    Publication date: October 5, 2017
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo
  • Publication number: 20170286633
    Abstract: Embodiments include method, systems and computer program products for proximity feedback for medication identification. Aspects include accessing, via a user device, a profile data for the user; reading, via the user device, identification data from an identification tag on an object; obtaining information associated with the identification data, wherein the information is associated with contents of the object; and providing a feedback to the user via the user device, the feedback is based upon the information and an interaction between the user of the user device and the object.
    Type: Application
    Filed: March 30, 2016
    Publication date: October 5, 2017
    Inventors: Maryam Ashoori, Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo
  • Patent number: 9780035
    Abstract: A method for fabricating a metallization layer of a semiconductor device, in which copper is used for an interconnect material and cobalt is used to encapsulate the copper, includes introducing a material that will form an alloy with cobalt and resist a degradation of an effect of the cobalt on encapsulating the copper.
    Type: Grant
    Filed: June 30, 2016
    Date of Patent: October 3, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin David Briggs, James J. Kelly, Koichi Motoyama, Roger Allan Quon, Michael Rizzolo, Theodorus Eduardus Standaert
  • Patent number: 9778007
    Abstract: Disclosed is a novel system, and method for matching a spent firearm cartridge. The method starts with applying a directed self-assembly (DSA) process to produce a nano-scale pattern on a tip of a firing pin for a firearm. The DSA process including: a) disposing a neutral substrate on the firing pin; b) lithographically placing two or more base polymer chains on the neutral substrate, at least two of the two or more base polymer chains being different lengths, so that the two or more base polymer chains align end-to-end in an alternating structure, and c) extracting at least one of the two or more base polymer chains leaving at least one of the base polymer chains remaining thereby forming a randomly oriented pattern. Next, the randomly oriented pattern is used as blocking mask to form a randomly oriented metallization pattern.
    Type: Grant
    Filed: June 20, 2016
    Date of Patent: October 3, 2017
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo
  • Publication number: 20170278788
    Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
    Type: Application
    Filed: April 5, 2017
    Publication date: September 28, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170278796
    Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parrallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
    Type: Application
    Filed: March 22, 2016
    Publication date: September 28, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Publication number: 20170278740
    Abstract: A method of forming an interconnect to an electrical device is provided. The structure produced by the method may include a plurality of metal lines in a region of a substrate positioned in an array of metal lines all having parallel lengths; and a plurality of air gaps between the metal lines in a same level as the metal lines, wherein an air gap is present between each set of adjacent metal lines. A plurality of interconnects may be present in electrical communication with said plurality of metal lines, wherein an exclusion zone for said plurality of interconnects is not present in said array of metal lines.
    Type: Application
    Filed: April 5, 2017
    Publication date: September 28, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Christopher J. Penny, Michael Rizzolo
  • Patent number: 9758095
    Abstract: Techniques are provided for alerting drivers of hazardous driving conditions using the sensing capabilities of wearable mobile technology. In one aspect, a method for alerting drivers of hazardous driving conditions includes the steps of: collecting real-time data from a driver of a vehicle, wherein the data is collected via a mobile device worn by the driver; determining whether the real-time data indicates that a hazardous driving condition exists; providing feedback to the driver if the real-time data indicates that a hazardous driving condition exists, and continuing to collect data from the driver in real-time if the real-time data indicates that a hazardous driving condition does not exist. The real-time data may also be collected and used to learn characteristics of the driver. These characteristics can be compared with the data being collected to help determine, in real-time, whether the driving behavior is normal and whether a hazardous driving condition exists.
    Type: Grant
    Filed: January 25, 2016
    Date of Patent: September 12, 2017
    Assignee: International Business Machines Corporation
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Leigh Anne H. Clevenger, Jonathan H. Connell, II, Nalini K. Ratha, Michael Rizzolo
  • Patent number: 9760817
    Abstract: An aspect of the disclosure includes a security system and method having a key with nanoscale features. The key includes a body. At least one pattern member disposed on the body, the pattern member formed using a directed self-assembly polymer to define a pattern of random feature structures thereon, the feature structures having a width of less than 100 nanometers.
    Type: Grant
    Filed: July 18, 2016
    Date of Patent: September 12, 2017
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Bartlet H. DeProspo, Michael Rizzolo
  • Publication number: 20170256494
    Abstract: A method of forming an interconnect with a bamboo grain microstructure. The method includes forming a conductive filler layer in a trench of an insulating layer to a predetermined depth such that an aspect ratio of a top portion of the trench is reduced to a threshold level, depositing a metal layer over the conductive filler layer in the top portion of the trench, the metal layer having a plurality of small grains, and annealing the metal layer to provide a bamboo grain microstructure having larger grains than grain boundaries of the plurality of small grains.
    Type: Application
    Filed: March 4, 2016
    Publication date: September 7, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang
  • Publication number: 20170256495
    Abstract: A method of forming an interconnect with a bamboo grain microstructure. The method includes forming a conductive filler layer in a trench of an insulating layer to a predetermined depth such that an aspect ratio of a top portion of the trench is reduced to a threshold level, depositing a metal layer over the conductive filler layer in the top potion of the trench, the metal layer having a plurality of small grains, and annealing the metal layer to provide a bamboo grain microstructure having larger grains than grain boundaries of the plurality of small grains.
    Type: Application
    Filed: August 24, 2016
    Publication date: September 7, 2017
    Inventors: Benjamin D. Briggs, Lawrence A. Clevenger, Michael Rizzolo, Chih-Chao Yang