Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Abstract: A method for manufacturing a semiconductor device including providing first and second semiconductor chips each having a main surface having a semiconductor element and a plurality of external terminals, and a lower surface respectively opposing the main surface. A first lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions, and a second lead frame is provided which has a frame body which supports outer portions and inner portions extending from the outer portions. After electrically connecting the external terminals to the inner portions of the lead frames and resin-sealing the first and second semiconductor chips so that the first and second lead frames are superimposed, the frame body of the second lead frame is removed and a first processing fluid is applied to the outer portions of the first lead frame and the second lead frame.

Abstract: Semiconductor chips (4), (5) are bonded and fixed to each other in a state where the rear surfaces of the respective semiconductor chips are faced to each other so that the other longer latus (4A2) of the semiconductor chip (4) and one longer latus (5A1) of the semiconductor chip (5) may confront the side of leads (10B), and supporting leads (8) are bonded and fixed onto the circuit forming surface (4A) of the semiconductor chip (4) or the circuit forming surface (5A) of the semiconductor chip (5). Owing to such a construction, the structure of a semiconductor device can be thinned.

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: Semiconductor chips (4), (5) are bonded and fixed to each other in a state where the rear surfaces of the respective semiconductor chips are faced to each other so that the other longer latus (4A2) of the semiconductor chip (4) and one longer latus (5A1) of the semiconductor chip (5) may confront the side of leads (10B), and supporting leads (8) are bonded and fixed onto the circuit forming surface (4A) of the semiconductor chip (4) or the circuit forming surface (5A) of the semiconductor chip (5). Owing to such a construction, the structure of a semiconductor device can be thinned.

Abstract: In the manufacture of a semiconductor device by adopting a block molding method wherein a semiconductor chip is fixed onto a wiring substrate through an adhesive, the occurrence of a defect caused by flowing-out of the adhesive is to be prevented. The semiconductor device according to the present invention comprises a wiring substrate, the wiring substrate having a main surface, an insulating film formed on the main surface, and electrodes formed on the main surface so as to be exposed from the insulating film, a semiconductor chip fixed through an adhesive onto the insulating film formed on the main surface of the wiring substrate, conductive wires for connecting the electrodes on the main surface of the wiring substrate and electrodes on the semiconductor chip with each other, and a seal member, i.e.

Abstract: A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by welding outside the resin body after sealing them with resin.

Abstract: A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.

Abstract: A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, comprises a wide part extending in the width direction of dam bars, the width of one dam bar being narrower than the width of another dam bar, and the two lead frames are joined by soldering outside the resin body after sealing them with resin.

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Abstract: A first semiconductor chip (2) is bonded and secured to a second semiconductor chip (3) with a back surface of the first semiconductor chip (2) and a circuit forming surface (3X) of the second semiconductor chip (3) facing each other, and an inner portion of a support lead (6) is bonded and secured to the circuit forming surface (3X) of the second semiconductor chip (3). Such a configuration makes it possible to provide a semiconductor with a reduced thickness.

Abstract: In a package of an LOC (Lead On Chip) structure in which inner lead portions are partially arranged over a major face of a semiconductor chip, there is disclosed a technique for thinning the package and speeding up signal transmission. Specifically, by partially reducing the thicknesses of the signal inner leads arranged over the major face of the semiconductor chip, the thickness of a sealing resin is reduced while ensuring the mechanical strength of the package. Moreover, the signal inner leads arranged over the major face of the semiconductor chip are arranged at predetermined spacings from the major face of the semiconductor chip. The power supplying inner leads are bonded to the major face of the semiconductor chip, thus providing a package having a reduced parasitic capacitance.

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.

Abstract: In a package of an LOC (Lead On Chip) structure in which inner lead portions are partially arranged over a major face of a semiconductor chip, there is disclosed a technique for thinning the package and speeding up signal transmission. Specifically, by partially reducing the thicknesses of the signal inner leads arranged over the major face of the semiconductor chip, the thickness of a sealing resin is reduced while ensuring the mechanical strength of the package. Moreover, the signal inner leads arranged over the major face of the semiconductor chip are arranged at predetermined spacings from the major face of the semiconductor chip. The power supplying inner leads are bonded to the major face of the semiconductor chip, thus providing a package having a reduced parasitic capacitance.

Abstract: A semiconductor device comprising a resin mold, two semiconductor chips positioned inside the resin mold and having front and back surfaces and external terminals formed on the front surfaces, and leads extending from the inside to the outside of the resin mold, wherein each of said leads is branched into two branch leads in at least the resin mold, the one branch lead is secured to the surface of the one semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, the other branch lead is secured to the surface of the other semiconductor chip and is electrically connected to an external terminal on the surface thereof through a wire, and the two semiconductor chips are stacked one upon the other, with their back surfaces opposed to each other.