Abstract: A phosphor material manufacturing method includes: prefabricating a LaPO4:Tm+ solution or a LaPO4:Eu+ solution in nitric acid; adding a carbon nano-sized material to the LaPO4:Tm+ solution or the LaPO4:Eu3+ solution for mixing to obtain a mixed solution precursors; precipitating the mixed solution and separating a precipitation substance from the mixed solution; drying and grinding the precipitation substance to obtain a powder material; the powder material with a predetermined temperature to form a sintered LaPO4:Tm+ phosphor material or a sintered LaPO4:Eu+ phosphor material. Advantageously, the sintered LaPO4:Tm+ phosphor material or the sintered LaPO4:Eu+ phosphor material is coated by the carbon nano-sized material for enhancing the efficiency of energy transfer and luminance of the phosphor material.

Abstract: A semiconductor substrate assembly is proposed. The semiconductor interposer comprises a substrate having a first surface and a second surface opposite to the first surface, a first conductive pad, a second conductive pad and a conductive pillar. The first conductive pad is formed at a predetermined location of the first surface of the substrate. The second conductive pad is formed at a predetermined location of the second surface of the substrate as compared with the position of the first conductive pad. The conductive pillar is formed in the substrate and contacts with one of the first conductive pad and the second conductive pad.

Abstract: A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.

Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

Abstract: A pressure sensor comprises a first substrate and a cap attached to the first substrate. The cap includes a processing circuit, a cavity and a deformable membrane separating the cavity and a port open to an outside of the pressure sensor. Sensing means are provided for converting a response of the deformable membrane to pressure at the port into a signal capable of being processed by the processing circuit. The cap is attached to the first substrate such that the deformable membrane faces the first substrate and such that a gap is provided between the deformable membrane and the first substrate which gap contributes to the port. The first substrate comprises a support portion the cap is attached to, a contact portion for electrically connecting the pressure sensor to an external device, and one or more suspension elements for suspending the support portion from the contact portion.

Abstract: This invention discloses an apparatus capable of controlling, tracking and measuring the tightening torque and the locking force and a method thereof. The device comprises a control device, a transducing device, and a sensing device. The transducing device comprises a second connector and a first signal transmitter. The control device communicates with the transducing device through a second signal transmitter and the first signal transmitter wiredly or wirelessly. The sensing device comprises a first connector and a sensor, and electrically connects to the transducing device through the second connector and the first connector. The sensing device senses the torque applied to a fastener to transmit real-time sensing data to the control device. The control device compares the real-time sensing data with a setting value so as to measure, control or track the locking force or tightening torque applied to the fastener in real time.

Abstract: A bump structure includes a substrate, a pad, an electrode and a protruding electrode. The pad is disposed on the substrate. The electrode is formed by a first metal material and disposed on the pad. The protruding electrode is formed by a second metal material and disposed on the electrode, wherein a cross-sectional area of the protruding electrode is less than a cross-sectional area of the electrode.

Abstract: The present invention relates to a titanium silicalite molecular sieve, wherein the crystal grain of the titanium silicalite molecular sieve has a ratio of (surface Si/Ti ratio):(bulk Si/Ti ratio) being larger than 1.1 and less than 5.

Abstract: The present invention relates to a full-Si molecular sieve, wherein the full-Si molecular sieve has a Q4/Q3 of (10-90):1.

Abstract: An embedded capacitor module includes an electrode lead-out portion and at least one solid electrolytic capacitor portion adjacently disposed with the electrode lead-out portion. The electrode lead-out portion comprises a first substrate, a second substrate, a first insulating material disposed between the first substrate and the second substrate, a first porous layer formed on at least one surface of the first substrate, and a first oxide layer disposed on the first porous layer. The solid electrolytic capacitor portion comprises the first substrate, the second substrate, the first porous layer, the first oxide layer, all of which are extended from the electrode lead-out portion, a first conductive polymer layer disposed on the first oxide layer, a first carbon layer disposed on the first conductive polymer layer, and a first conductive adhesive layer disposed on the first carbon layer.

Abstract: A semiconductor device includes a semiconductor substrate and a trench isolation. The trench isolation is located in the semiconductor substrate, and includes a first cushion layer, a second cushion layer and an insulating filler. The first cushion layer is peripherally enclosed by the semiconductor substrate, the second cushion layer is peripherally enclosed by the first cushion layer, and insulating filler is peripherally enclosed by the second cushion layer. A method for fabricating the semiconductor device is also provided herein.

Abstract: A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range.

Abstract: A selectable view angle optical sensor is disclosed. The selectable view angle optical sensor comprises a substrate, a photodiode array disposed on the substrate, a first optical shielding modulation layer disposed on a first plane and a second optical shielding modulation layer disposed on a second plane. The first plane is on the photodiode array, the second plane is on the first plane, and the first and second planes and a top surface of the photodiode array are substantially in parallel. The dimensions and configurations of the first and second optical shielding modulation layers limit a field of view of the photodiode array so that the photodiode array has selectable view angle function.

Abstract: A roller microcontact printing device and a printing method of the device are revealed. The roller microcontact printing device includes a transfer module with a transfer roller and a supply module. The supply module provides an isolating solution and a thin film material to the transfer module to form an isolation layer and a thin film layer in turn on the surface of the transfer roller. Then the thin film is transferred to a substrate by the transfer roller. The microcontact print device and method are used in a roll-to-roll printing process. Thus the production efficiency of the thin film layer on the substrate is improved and the cost is reduced.

Abstract: A composite drill bit with a bit body configured at its upper extend for connection into a drillstring, comprising: a bit body (1) with at least one bit leg (3), at least one scraping-wheel (2) set with a cutter-row (4), and a set of cutters fixed thereon. The scraping-wheel (2) is mounted for rotation on the corresponding bit leg (3) with a large angular deflection ? in the range of 20°?|?|?90°. The cutters on the scraping-wheel break rock by means of successive scraping, forming a cross-cutting area on the bottomhole accompanied by the cutters on the fixed cutting unit, thus achieving high rock-breaking efficiency, even wear, high cooling performance, and a longer service life for the cutters, bearings and the drill bit.

Abstract: The invention includes a heating assembly, a heating device and an auxiliary cooling module for a battery. The heating assembly is connected to a battery and includes a heat-conducting element and a heating element. The heat-conducting element has at least one heat-absorbing portion and at least one heat-conducting portion. The heat-conducting portion is provided to correspond to the battery. The heating element has at least one first heating portion located to correspond to the heat-absorbing portion for heating the heat-absorbing portion. The other side of the heat-conducting element opposite to the battery is provided with a heat-insulating portion. The auxiliary cooling module is further provided with at least one cooling pipe in the heat-conducting element, thereby cooling the battery.

Abstract: A fixed-outline floorplanning approach for mixed-size modules is disclosed. Firstly, evenly distribute mixed-size circuit modules to whole chip area based on different requirements such as wire-length, routability, or thermal in the global distribution stage. To maintain the global distribution result and satisfy the fixed-outline constraint, generate a slicing tree by recursively applying partition algorithm to divide modules distributed in a given region into several sub-regions. Then, to remove overlap between circuit modules and find a best solution, use bottom-up shape curve merging and top-down back tracing procedure to generate a slicing tree. The shape curve for each leaf in the tree is built first by enumerated packing. Then, the curves in the tree are merged iteratively from bottom to top, and feasible solutions in the shape curve of the root node are identified according to the fixed-outline constraint. Finally, the best solution is determined by a top-down back tracing procedure.

Abstract: An embedded capacitor substrate module includes a substrate, a metal substrate and a solid electrolytic capacitor material. The solid electrolytic capacitor material is formed on the metal substrate, so as to form a solid electrolytic capacitor with the substrate. The embedded capacitor substrate module further includes an electrode lead-out region formed by extending the substrate and the metal substrate. The metal substrate serves as a first electrode, and the substrate serves as a second electrode. An insulating material is formed between the substrate and the metal substrate. Therefore, the embedded capacitor substrate module is not only advantageous in having a large capacitance as the conventional solid capacitor, but also capable of being drilled or plated and electrically connected to other circuits after being embedded in a printed circuit board.

Abstract: In a cyclic code decoding method, a decoder analyzes a received codeword to identify unreliable symbols in the codeword, and sets candidate syndrome patterns accordingly. Then, a syndrome calculator calculates evaluated syndrome values associated with one of the candidate syndrome patterns, and an error location polynomial (ELP) generator generates an ELP according to the syndrome values. An error correction device corrects the errors in the codeword according to the ELP when a degree of the ELP is not more than a threshold value, and the syndrome calculator adjusts the syndrome values and the ELP generator generates another ELP according to the adjusted syndrome values when otherwise.

Abstract: A process of oxidizing cyclohexane, comprising feeding cyclohexane, an aqueous hydrogen peroxide solution and optionally an organic solvent into a reaction zone through a feed inlet thereof under the oxidation reaction conditions for contact, and providing all or most of the oxidation product at the reaction zone bottom, wherein a part or all of the packing in the reaction zone is a titanium silicate molecular sieve-containing catalyst. The process of oxidizing cyclohexane according to the present invention carries out the oxidation in the reaction zone, which, firstly, utilizes the latent heat from reaction sufficiently so as to achieve energy-saving; secondly, increases the yield of target product and the availability of oxidizer; and thirdly, allows the separation of the oxidation product from the raw material cyclohexane as the reaction proceeds, such that the cost for subsequent separations can be saved.