Abstract: The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle.

Abstract: An anti-fingerprint treatment reagent has an organic polydimethlysiloxane, a solvent and an additive. A surface of a metal base material is treated by the organic polydimethlysiloxane. The surface treated with the anti-fingerprint reagent is fingerprint-resistant for being hydro-oleophobic. The coating of thanti-fingerprint treatment reagent is too thin to be seen, and will not affect the optical properties and function of the surface of the base material. The anti-fingerprint treatment reagent is inexpensive, simple in treatment process, reusable and practical. Especially, the anti-fingerprint reagent fits to avoid a product surface having pollution likes water spot, sweat, fingerprint and the like.

Abstract: An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

Abstract: Some embodiments relate to multiple MEMS devices that are integrated together on a single substrate. A device substrate comprising first and second micro-electro mechanical system (MEMS) devices is bonded to a capping structure. The capping structure comprises a first cavity arranged over the first MEMS device and a second cavity arranged over the second MEMS device. The first cavity is filled with a first gas at a first gas pressure. The second cavity is filled with a second gas at a second gas pressure, which is different from the first gas pressure. A recess is arranged within a lower surface of the capping structure. The recess abuts the second cavity. A vent is arranged within the capping structure. The vent extends from a top of the recess to the upper surface of the capping structure. A lid is arranged within the vent and configured to seal the second cavity.

Abstract: A chip package includes a semiconductor chip, an interposer, a polymer adhesive supporting layer, a redistribution layer and a packaging layer. The semiconductor chip has a sensor device and a conductive pad electrically connected to the sensing device, and the interposer is disposed on the semiconductor chip. The interposer has a trench and a through hole, which the trench exposes a portion of the sensing device, and the through hole exposes the conductive pad. The polymer adhesive supporting layer is interposed between the semiconductor chip and the interposer, and the redistribution layer is disposed on the interposer and in the through hole to be electrically connected to the conductive pad. The packaging layer covers the interposer and the redistribution layer, which the packaging layer has an opening exposing the trench.

Abstract: An apparatus and method for detecting a status of at least one of a plurality of light emitting diodes (LEDs), is disclosed in embodiments of the invention. The apparatus includes a first node, a second node, a voltage generator, a current source and a first comparator. The voltage generator generates an output voltage to the first external circuit via the second node. The current source provides a current to the first external circuit via the first node to generate a first node voltage. The first comparator generates a first comparison result according to the first node voltage and a reference voltage, wherein the first comparison result indicates whether the status of at least one of the LEDs is short or not.

Abstract: The present invention relates to an industrial server system, comprising a housing, a backplane, at least one rear board, at least one front board, and a power supply, wherein the backplane and the power supply are disposed in the housing, and the rear board, the first front board are coupled and configured to the backplane. Four connected blocks are disposed on the backplane, which makes that at least one rear board and at least one front board are able to communicate to each other by a plurality of data connecting units disposed on the backplane. The rear board and the first front board of the present invention can achieve a great transmission efficiency by a specific configuration of connected block on the backplane.

Abstract: The present invention relates to an industrial server system, comprising a housing, a backplane, at least one rear board, at least one front board, and a power supply, wherein the backplane and the power supply are disposed in the housing, and the rear board, the first front board are coupled and configured to the backplane. Four connected blocks are disposed on the backplane, which makes that at least one rear board and at least one front board are able to communicate to each other by a plurality of data connecting units disposed on the backplane. The rear board and the first front board of the present invention can achieve a great transmission efficiency by a specific configuration of connected block on the backplane.

Abstract: This invention relates to a multi-rotor aircraft frame structure, which is mainly the use of stainless steel tubes and engineering plastics has the rigidity and toughness, directly to the stainless steel tubes symmetrical inserted nailed in plastic sheet to constitute the main frame structure, and by connecting plurality support blocks and plurality support rods to construct a kind of peripheral support structure to obtain sufficient structural strength, thereby to constructing a light weight and low cost and practicality high-performance multi-rotor aircraft frame.

Abstract: A dual-function wafer handling apparatus for handling a wafer includes an aligner for rotating the wafer, an ID reader disposed corresponding to an edge of the wafer for reading an ID of the wafer, and an optical defect inspection unit for capturing images to analysis.

Abstract: A self-refresh device, adopted in a memory array including a plurality of memory cells, includes a first word-line selecting module, which is enabled according to a first main-word-line signal, and a self-refresh controller. The first word-line selecting module includes a first selecting device, which selects a first word line according to a first word-line driving signal, and a second selecting device, which selects a second word line according to a second word-line driving signal. The self-refresh controller generates the first word-line driving signal, the second word-line driving signal, and the first main word-line signal to select one of the memory cells corresponding to the selected one of the first word line and the second word line for self-refreshing. When the first word line switches to the second word line, the self-refresh controller maintains the first main word-line signal at the same logic level.

Abstract: A power adapter between an alternating current (AC) source and an external direct current (DC) consumer device consumes no electrical power until the DC device is connected to the power adapter. The power adapter includes a first magnet, a second magnet which is repelled by the first magnet, and a movable conductive member arranged on the second magnet. The insertion of the external DC device pushes the second magnet towards the first magnet and establishes a connection between the AC power source and the power adaptor. When the external device is removed, the movable conductive member is driven away by a repulsive force between the magnets to disconnect the external AC power source from the power adapter.

Abstract: A self-refresh device, adopted in a memory array including a plurality of memory cells, includes a first word-line selecting module, which is enabled according to a first main-word-line signal, and a self-refresh controller. The first word-line selecting module includes a first selecting device, which selects a first word line according to a first word-line driving signal, and a second selecting device, which selects a second word line according to a second word-line driving signal. The self-refresh controller generates the first word-line driving signal, the second word-line driving signal, and the first main word-line signal to select one of the memory cells corresponding to the selected one of the first word line and the second word line for self-refreshing. When the first word line switches to the second word line, the self-refresh controller maintains the first main word-line signal at the same logic level.

Abstract: The present invention is an electrical signal computing module capable of accommodating printed circuit board, able to lead the exterior air into the main case body, exchange heat with the printed circuit boards, without accumulation of heat and damage of the printed circuit board. The present invention has a main case body with a bottom case and an internal board set, and four accommodating areas are formed by the internal board set and a transmission circuit board, in addition, numerous flow holes disposed at specific position are designed for air flowing in, exchanging heat produced by printed circuit boards as well.

Abstract: Disclosed is a method for preparing a granulated inorganic adsorbent for radionuclides including slurry forming, solidification, drying and hardening, granulation, and washing steps: blending a dihydrogen phosphate, a powdered inorganic adsorbent raw material and a setting time regulator in water to form a slurry; adding sintered magnesia into the slurry, and blending the mixture to form a solidified slurry; setting the solidified slurry on a disk member, and naturally drying to hardening in a specific temperature range to form a hardened solid material; smashing the hardened solid material and performing vibration sieving by using a screen to obtain a granulated inorganic adsorbent for radionuclides containing residual reagents; washing the granulated inorganic adsorbent for radionuclides containing residual reagents with water, to remove the residual reagents to complete preparation, where the adsorption capacity of the granulated inorganic adsorbent for radionuclides thus prepared is in the range of 0.

Abstract: A method for breaking up Chemical Mechanical Polishing (CMP) slurry particles includes receiving a CMP slurry comprising particles suspended in a solution, placing the slurry into a first agitation tank, and agitating the slurry at a first frequency. The first frequency is selected to break up particles having a size within a specified range.

Abstract: An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a first recess extending from the first surface towards the second surface; a second recess extending from a bottom of the first recess towards the second surface, wherein a sidewall and the bottom of the first recess and a second sidewall and a second bottom of the second recess together form an exterior side surface of the semiconductor substrate; a wire layer disposed over the first surface and extending into the first recess and/or the second recess; an insulating layer positioned between the wire layer and the semiconductor substrate; and a metal light shielding layer disposed over the first surface and having at least one hole, wherein a shape of the at least one hole is a quadrangle.

Abstract: A touch display device including a touch module, a display module, a tape, and an optical clear resin is provided. The display module has a polarizer. The tape is installed between the touch module and the display module, wherein a thickness of the tape is larger than a thickness of the polarizer. The tape surrounds a margin of the display module to form an accommodating space with the polarizer. The optical clear resin is disposed in the accommodating space. The touch module and the display module are adhered to each other by the optical clear resin.

Abstract: The present invention relates to an industrial server system, comprising a housing, a backplane, at least one rear board, a first front board, a second front board, and a power supply, wherein the backplane and the power supply are disposed in the housing, and the rear board, the first front board, and the second front board are coupled and configured to the backplane. Four connected blocks are disposed on the backplane, which makes that at least one rear board, the first front board, and the second front board are able to communicate to each other by a plurality of data connecting units disposed on the backplane. The rear board, the first front board, and the second front board of the present invention can achieve a great transmission efficiency by a specific configuration of connected block on the backplane.