Abstract: A fixed-outline floorplanning approach for mixed-size modules is disclosed. Firstly, evenly distribute mixed-size circuit modules to whole chip area based on different requirements such as wire-length, routability, or thermal in the global distribution stage. To maintain the global distribution result and satisfy the fixed-outline constraint, generate a slicing tree by recursively applying partition algorithm to divide modules distributed in a given region into several sub-regions. Then, to remove overlap between circuit modules and find a best solution, use bottom-up shape curve merging and top-down back tracing procedure to generate a slicing tree. The shape curve for each leaf in the tree is built first by enumerated packing. Then, the curves in the tree are merged iteratively from bottom to top, and feasible solutions in the shape curve of the root node are identified according to the fixed-outline constraint. Finally, the best solution is determined by a top-down back tracing procedure.

Abstract: A cord guiding device for a window blind includes a wheel holder, a guiding wheel and a cord-blocking unit. The guiding wheel is rotatably mounted on the wheel holder, and includes two protruding flanges that are spaced apart from each other, and has a wheel surface that is defined and disposed between the protruding flanges and that is adapted for a cord of the window blind to wind thereon. The cord-blocking unit is mounted on the wheel holder, and has a blocking surface that faces and is disposed proximate to the wheel surface of the guiding wheel for preventing the cord from slipping off the wheel surface and out from the protruding flanges.

Abstract: The present disclosure provides an integrated circuit device comprising a substrate having a back surface and a sensing region disposed in the substrate and being operable to sense radiation projected towards the back surface of the substrate. The device further includes a waveguide disposed over the back surface of the substrate. The waveguide is aligned with the sensing region such that the waveguide is operable to transmit the radiation towards the aligned sensing region. The waveguide includes a waveguide wall, and an inner region disposed adjacent to the waveguide wall. A diffractive index of the waveguide wall is less than a diffractive index of the inner region.

Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Abstract: A family of phase change materials GewSbxTeyNz having a crystallization temperature greater than 410° C., wherein a Ge atomic concentration is within a range from 43% to 54%, a Sb atomic concentration is within a range from 6% to 13%, a Te atomic concentration is within a range from 14% to 23%, and a N atomic concentration is within a range of 15% to 27%, is described. A method for programming a memory device including such phase change materials is also described.

Abstract: A photodiode structure includes a photodiode and a concave reflector disposed below the photodiode. The concave reflector is arranged to reflect incident light from above back toward the photodiode.

Abstract: A transformer primary side of a transformer starts storing energy when a first switch unit is turned on. A transformer secondary side auxiliary winding of the transformer generates a secondary side voltage. A voltage of a second input side of a comparison unit is higher than a voltage of a first input side of the comparison unit. The comparison unit is configured to turn off a second switch unit. The voltage of the second input side is lower than the voltage of the first input side when the first switch unit is turned off. The comparison unit is configured to turn on the second switch unit. A transformer secondary side of the transformer sends a secondary side current to a load apparatus through the second switch unit.

Abstract: An light apparatus used in forming a solar cell includes a housing separate from other processing in a deposition processing system, a transport mechanism for carrying a solar cell into the housing after deposition of a front contact layer in the deposition processing system, and one or more light source elements arranged to apply light on the solar cell after deposition of the front contact layer. A method of making a solar cell includes forming a back contact layer on a glass substrate, forming an absorber layer on the back contact layer, forming a buffer layer on the absorber layer, and forming a front contact layer above the buffer layer, the glass substrate, back contact layer, absorber layer, buffer layer, and front contact layer forming a first module. The method includes applying a light source to the first module after forming the front contact layer separate from other processing.

Abstract: A high-definition multimedia interface (HDMI) data transceiving apparatus is disclosed. The HDMI data transceiving apparatus includes a data receiver and a data transmitter. The data transmitter includes a first impedance-providing device and a second impedance-providing device. The data transmitter has a first data transmission terminal and a second data transmission terminal. The first data transmission terminal and the second data transmission terminal are coupled to the data receiver through a first transmission line and a second transmission line, respectively. The data transmitter respectively transmits first data and second data to the data receiver. The first impedance-providing device and the second impedance-providing device absorb a reflected wave generated by the HDMI data transceiving apparatus when the first data and the second data are transmitted.

Abstract: A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.

Abstract: The present disclosure involves a method of packaging light-emitting diodes (LEDs). According to the method, a plurality of LEDs is provided over an adhesive tape. The adhesive tape is disposed on a substrate. In some embodiments, the substrate may be a glass substrate, a silicon substrate, a ceramic substrate, and a gallium nitride substrate. A phosphor layer is coated over the plurality of LEDs. The phosphor layer is then cured. The tape and the substrate are removed after the curing of the phosphor layer. A replacement tape is then attached to the plurality of LEDs. A dicing process is then performed to the plurality of LEDs after the substrate has been removed. The removed substrate may then be reused for a future LED packaging process.

Abstract: An energy-saving power converter includes a first switch unit, a transformer primary side, a transformer secondary side, a diode subunit, a switch subunit, a comparison unit, a current sensor, and a resistor. The transformer primary side starts storing energy when the first switch unit is turned on. The transformer secondary side sends a secondary side current to the current sensor through the diode subunit when the first switch unit is turned off. The current sensor informs the comparison unit and the resistor when the current sensor senses the secondary side current. The resistor is used to transform the secondary side current into voltage form for entering the comparison unit. The comparison unit is configured to turn on the switch subunit, so that the secondary side current is passing through the switch subunit.

Abstract: A nerve repair conduit configured to be secured on first and second portions of a selected nerve. The nerve repair conduit includes a polymeric body having a proximal end, a distal end, an exterior surface and an interior surface defining an interior lumen. In addition, the nerve conduit includes at least one drug reservoir to hold agent(s) that may, for example, facilitate nerve regeneration. The drugs diffuse from the drug reservoir(s) into the nerve repair conduit through an outlet (e.g., a semipermeable membrane) in proximity to the first and second portions of a selected nerve. The nerve repair conduit may be configured to deliver the agent(s) at a rate having substantially zero-order kinetics and/or at a constant rate over a selected period of time (e.g., at least 1 week).

Abstract: A near field communication module applied to an electronic device is provided. The near field communication module includes a flexible circuit board, a first sensing antenna and a second sensing antenna. The flexible circuit board includes a first part and a second part connected with each other. The first sensing antenna is disposed at the first part. The second sensing antenna is disposed at the second part. The first sensing antenna is connected to the second sensing antenna. After the flexible circuit board is bended, it is disposed at a side of the electronic device.

Abstract: A first back surface of a first chip faces toward a carrier. A first active surface of the first chip has first pads and a first insulting layer thereon. A second chip is disposed on the first chip and electrically connected to the carrier. A second active surface of the second chip faces toward the first active surface. The second active surface has second pads and a second insulting layer thereon. Bumps connect the first and second pads. First and second daisy chain circuits are respectively disposed on the first and second insulting layers. Hetero thermoelectric device pairs are disposed between the first and second chips and connected in series by the first and second daisy chain circuits, and constitute a circuit with an external device. First and second heat sinks are respectively disposed on a second surface of the carrier and a second back surface of the second chip.

Abstract: A window blind assembly includes a securing seat, a blind unit, a blind control device and two cord guiding devices interposing the blind control device. Each of the cord guiding devices includes a wheel holder and a guiding wheel. The wheel holder includes a resilient arm unit and two holder walls. Each of the holder walls is formed with an engaging groove having a receiving portion and a constricted portion. The guiding wheel includes two axle portions rotatably and respectively received in the receiving portions of the engaging grooves in the holder walls, and a cord winding portion interconnecting the axle portions and permitting winding of a corresponding cord thereon.

Abstract: A process for producing an alkylene oxide by olefin epoxidation, wherein said process comprises the steps of: (1) in a first olefin epoxidation condition, in the presence of a first solid catalyst, a first mixed stream containing a solvent, an olefin and H2O2 is subjected to an epoxidation in one or more fixed bed reactors and/or one or more moving bed reactors until the conversion of H2O2 reaches 50%-95%, then, optionally, the resulting reaction mixture obtained in the step (1) is subjected to a separation to obtain a first stream free of H2O2 and a second stream containing the unreacted H2O2, and the olefin is introduced to the second stream to produce a second mixed stream, or optionally, the olefin is introduced to the reaction mixture obtained in the step (1) to produce a second mixed stream; (2) in a second olefin epoxidation condition, the reaction mixture obtained in the step (1) or the second mixed stream obtained in the step (1) and a second solid catalyst are introduced to one or more slurry bed re

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A first conductive terminal and a second conductive terminal are each disposed below the first doped semiconductor layer. A photo-conversion layer is disposed over the second doped semiconductor layer and on side surfaces of the first and second doped semiconductor layers and the light-emitting layer. A bottommost surface of the photo-conversion layer is located closer to the second doped semiconductor layer than bottom surfaces of the first and second conductive terminals.

Abstract: The present disclosure involves lighting apparatus. The lighting apparatus includes a light-emitting device. The light-emitting device includes a first doped semiconductor layer. A light-emitting layer is disposed over the first doped semiconductor layer. A second doped semiconductor layer is disposed over the light-emitting layer. The second doped semiconductor layer has a different type of conductivity than the first doped semiconductor layer. A photo-conversion layer is coated around the light-emitting device. A lens houses the light-emitting device and the photo-conversion layer within. The lens includes a first sub-layer and a second sub-layer. The first and second sub-layers have different characteristics.

Abstract: The present disclosure involves a method. The method includes providing a substrate having a layer disposed thereon. A plurality of light-emitting devices is attached to the layer. A gel is applied over the substrate. The gel covers the plurality of light-emitting devices. The gel is shaped into a plurality of lenses. The lenses each cover a respective one of the light-emitting devices. The light-emitting devices are separated from one another. The substrate and the layer are removed.