Abstract: A personal ornament having an ornament base article made of a metal or the like; an underlayer, preferably nickel-free, formed on the base article; and a coloring layer constituted of an abrasion-resistant layer of 0.2-1.5 ?m thick formed by dry-plating on the surface of the underlayer and an outermost layer of 0.002-0.1 ?m thick formed by dry-plating on the surface of the abrasion-resistant layer. The coloring layer is a white hard coating film of a stainless-steel color which provides superior quality, high resistance to deterioration of appearance by scratching, and a high-quality image like a stainless steel film.

Abstract: Disclosed is a container having a novel structure for storing contact lenses by which biofilm formation can be prevented at a high cost efficiency and from which lenses can be easily taken out. A container for storing contact lenses wherein the inner face of a dish-shaped storage chamber in a case is entirely made of a radius of curvature which is a smooth face with no irregularity and shows a continuous change, the inner face entirely comprises a smooth face with a surface roughness of 60 nm or less, and the solution capacity of the dish-shaped storage chamber is set to 3.8 mL or more.

Abstract: The electronic component tester includes: a socket configured to supply power to connection terminals for operating an electronic component; an electronic component mount member on which the electronic component is to be mounted; and a temperature adjusting member which is configured to come into contact with the electronic component mount member to keep the electronic component at a predetermined temperature. The electronic component mount member includes a heat transfer plate on which the electronic component is to be mounted and which is configured to come into contact with the temperature adjusting member, and an electronic component cover for covering the electronic component. The heat transfer plate includes through holes.

Abstract: Disclosed is a producing method or a semiconductor device including: loading at least one substrate into a processing chamber; forming a metal oxide film or a silicon oxide film on a surface of the substrate by repeatedly supplying a metal compound or a silicon compound, each of which is a first material, an oxide material which is a second material including an oxygen atom, and a hydride material which is a third material, into the processing chamber predetermined times; and unloading the substrate from the processing chamber.

Abstract: An apparatus and method generating a road image including no features such as trees and tunnels hiding or covering a road surface. A mobile measuring apparatus installed in a vehicle may acquire a distance and orientation point cloud, a camera image, GPS observation information, a gyro measurement value, and an odometer measurement value, while moving in a target area. The position and attitude localizing apparatus may localize the position and attitude of the vehicle based on the GPS observation information, the gyro measurement value and the odometer measurement value. The point cloud generating apparatus may generate a point cloud based on the camera image, the distance and orientation point cloud, and a position and attitude localized value.

Abstract: A solenoid actuator (1) attached to a hydraulic equipment comprises a shaft (5) connected to the hydraulic equipment, a plunger (4) fixed to the shaft (5), a coil (12) which magnetically drives the plunger (4), and a first bearing (7) and a second bearing (8) supporting the shaft (5) on both sides of the plunger (4). A plunger front chamber (74) is formed between the first bearing (7) and the plunger (4), a plunger rear chamber (75) is formed between the plunger (4) and the second bearing (8), and a second bearing rear chamber (76) is formed on the opposite side of the second bearing (8) to the plunger rear chamber (75). To secure an oil flow between these chambers, a plunger exterior oil passage (63), a second bearing oil passage (64), and a shaft-penetrating oil passage (65) are provided, thereby realizing a preferable balance between oil pressures acting on the second bearing (8).

Abstract: After the rinsing processing is completed, the rotation speed of the substrate is reduced from 600 rpm to 10 rpm to form a puddle-like DIW liquid film. After the supply of DIW is stopped, the control unit waits for a predetermined time (0.5 seconds) so that the film thickness t1 of the puddle-like liquid film becomes approximately uniform. Then, IPA is discharged to a central part of the surface of the substrate at a flow rate of 100 (mL/min) for instance. By the supply of IPA, DIW is replaced with IPA at the central part of the surface of the substrate to form a replaced region. Further, after three seconds of IPA supply, the rotation speed of the substrate is accelerated from 10 rpm to 300 rpm. This causes the replaced region to expand in a radial direction of the substrate so that the entire surface of the substrate is replaced with the low surface-tension solvent.

Abstract: The invention provides a plasma processing apparatus for processing a wafer mounted on a sample stage placed in a vacuum processing chamber using a plasma generated in the vacuum chamber. The plasma processing apparatus comprises a plate placed in the vacuum processing vessel above and opposed to the wafer, the plate having a through hole through which a first processing gas is introduced; a first and second cylindrical member arranged vertically and adjacently; and means communicating with the gap between the first and second cylindrical member for supplying a second processing gas. The wafer is processed while the first processing gas and the second processing gas having different compositions are supplied.

Abstract: A rinsing liquid supplier includes a temperature adjuster. The temperature adjuster cools DIW to a temperature lower than room temperature. This temperature adjuster cools down DIW to a temperature not more than 10 degrees centigrade for instance, and cooling down to an even lower temperature of 5 degrees centigrade or below is more preferable. Meanwhile, the temperature adjuster maintains DIW at not less than 0 degrees centigrade, which prevents freezing of the DIW. The cooled DIW supplied to a rinsing liquid pipe is discharged from the rinsing liquid discharge nozzle toward the top surface of the substrate, to thereby form a liquid film. Further, the cooled DIW is discharged toward the rear surface of the substrate from the liquid discharge nozzle via the liquid supply pipe, to thereby form the liquid film on the rear surface. Since the liquid films are already cooled, they are frozen in a short time when the cooling gas is discharged toward the top surface and the rear surface of the substrate.

Abstract: In the case of inspecting samples having different sizes by means of a semiconductor inspecting apparatus, a primary electron beam bends since distribution is disturbed on an equipotential surface at the vicinity of the sample at the time of inspecting vicinities of the sample, and what is called a positional shift is generated. A potential correcting electrode is arranged outside the sample and at a position lower than the sample lower surface, and a potential lower than that of the sample is applied. Furthermore, a voltage to be applied to the potential correcting electrode is controlled corresponding to a distance between the inspecting position and a sample outer end, sample thickness and irradiation conditions of the primary electron beam.

Abstract: A microfluidic cell culture apparatus includes a cell retention chamber and a perfusion channel. The cell retention chamber has a structured surface. The structured surface includes a major surface from which a plurality of projections extends into the chamber. The plurality of projections are arranged to suspend cells cultured in the chamber above the major surface. The first perfusion channel is configured to provide laminar flow of a fluid through the channel and forms a plurality of openings in communication with the cell retention chamber. The openings are configured to prevent cells from the retention chamber from entering the perfusion channel.

Abstract: Provided are means for locking a fastening screw of a connector, such as a locking cap for a connector-fastening screw that comprises a main body having a receiving hole, a contact part of the main body for control of rotation of the main body, and an indicator part of the main body for making possible visual recognition of rotation of the main body.

Abstract: Disclosed is a substrate processing apparatus, comprising a processing chamber, a holder to hold at least a plurality of product substrates, a heating member, a supplying member to alternately supply at least a first reactant and a second reactant, and a control unit, wherein the control unit executes forming thin films on the substrates by supplying the first reactant, removing a surplus of the first reactant after the first reactant has been adsorbed on the product substrates, subsequently supplying the second reactant, to cause the second reactant to react with the first reactant adsorbed on the substrates, and executes the forming the thin films in a state where a number of the product substrates is insufficient when a number of the product substrates is less than a maximum number of the product substrates which can be held by the holder.

Abstract: Disclosed is a substrate processing apparatus, comprising a processing chamber, a holder to hold at least a plurality of product substrates, a heating member, a supplying member to alternately supply at least a first reactant and a second reactant, and a control unit, wherein the control unit executes forming thin films on the substrates by supplying the first reactant, removing a surplus of the first reactant after the first reactant has been adsorbed on the product substrates, subsequently supplying the second reactant, to cause the second reactant to react with the first reactant adsorbed on the substrates, and executes the forming the thin films in a state where a number of the product substrates is insufficient when a number of the product substrates is less than a maximum number of the product substrates which can be held by the holder.

Abstract: The invention provides a plasma processing apparatus for processing a wafer mounted on a sample stage placed in a vacuum processing chamber using a plasma generated in the vacuum chamber. The plasma processing apparatus comprises a plate placed in the vacuum processing vessel above and opposed to the wafer, the plate having a through hole through which a first processing gas is introduced; a first and second cylindrical member arranged vertically and adjacently; and means communicating with the gap between the first and second cylindrical member for supplying a second processing gas. The wafer is processed while the first processing gas and the second processing gas having different compositions are supplied.

Abstract: Human adult hepatocytes are transplanted into an immunodeficient hepatopathy mouse and then human growth hormone is administered to the mouse to thereby elevate twice or more the replacement ratio by the human adult hepatocytes having been transplanted. Further, human growth hormone is administered to an immunodeficient hepatopathy mouse carrying human young hepatocytes transplanted thereinto so as to improve fatty liver of the mouse in which about 70% or more of the hepatocytes have been replaced by the human hepatocytes.

Abstract: The substrate cleaning method of and the substrate cleaning apparatus for removing contaminants such as particles adhering to a surface of a substrate attain a high throughput and effectively remove the particles and the like. To clean the back surface Wb of the substrate W, DIW cooled down to a temperature near its freezing point and cooling gas which is at a lower temperature than the freezing point of the DIW are discharged toward the center of the lower surface of the substrate which rotates. When thus cooled DIW flows along the back surface Wb of the substrate W, the particles and the like adhering to the substrate are removed.

Abstract: An imaging apparatus includes an electron emission array having electron sources arranged in matrix form and having a plurality of horizontal scan lines, a photoelectric conversion film opposed to the electron emission array, and a control and drive circuit configured to select one or more of the horizontal scan lines in a given video signal output period and to cause the electron sources included in the selected one or more horizontal scan lines to emit electrons toward the photoelectric conversion film to produce a video signal, wherein the control and drive circuit is configured to cause the electron sources included in unselected one or more horizontal scan lines not selected in the given video signal output period to emit electrons toward the photoelectric conversion film in a blanking period immediately preceding the given video signal output period.

Abstract: DIW is supplied toward a surface of a substrate to form a lower layer liquid film, which is then frozen to form a lower layer frozen film. Further, DIW cooled down to a temperature at which the lower layer frozen film will not melt is supplied toward a surface of the lower layer frozen film to form an upper layer liquid film, which is then frozen to form an upper layer frozen film in a layered structure. DIW which is at room temperature is thereafter supplied, thereby melting the entirety of the lower layer frozen film and the upper layer frozen film to remove these films together with particles off from the surface of the substrate.

Abstract: A plasma processing apparatus includes a processing chamber, a sample stage for mounting an object to be processed, a power supply, and at least one induction coil connected to the power supply. The induction coil is formed by connecting at least two identical coil elements in a parallel circuit-like arrangement so that current flows in each of the plurality of identical coil elements in a same direction when viewed from the sample stage. The induction coil is positioned so that a center thereof corresponds to a center of the object, and input ends of the coil elements are displaced circumferentially at equal angular intervals calculated by dividing 360° by the number of identical coil elements.