Abstract: A semiconductor package structure includes a conductive trace layer, a semiconductor die over the conductive trace layer, a structure enhancement layer surrounding the semiconductor die, and an encapsulant covering the semiconductor die and the structure enhancement layer. The structure enhancement layer coincides with a mass center plane of the semiconductor package structure. The mass center plane is parallel to a top surface of the semiconductor die. A method for manufacturing the semiconductor package structure is also provided.

Abstract: A semiconductor package device includes a circuit layer, a first set of stacked components, a first conductive wire, a space and an electronic component. The first set of stacked components is disposed on the circuit layer. The first conductive wire electrically connects the first set of stacked components. The space is defined between the first set of stacked components and the circuit layer. The space accommodates the first conductive wire. The electronic component is disposed in the space.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor package device includes a substrate, an electronic component, a ring frame, an encapsulant, a thermal conducting material and a lid. The electronic component is disposed on the substrate. The ring frame is disposed on the substrate and surrounds the electronic component. The encapsulant encapsulates the electronic component and a first portion of the ring frame. The encapsulant exposes a second portion of the ring frame. The encapsulant and the second portion of the ring frame define a space. The thermal conducting material is disposed in the space. The lid is disposed on the thermal conducting material and connects with the second portion of the ring frame.

Abstract: The present invention is directed to novel methods and kits to be employed for preparing adapter-ligated amplicons or a sequencing library of a target DNA, respectively.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: An electronic device includes an insulating layer, a metal layer and at least one electrical connecting element. The insulating layer has a top surface and a bottom surface opposite to the top surface, and defines an opening extending between the top surface and the bottom surface. The metal layer is disposed in the opening of the insulating layer and has a top surface and a bottom surface opposite to the top surface. The bottom surface of the metal layer is substantially coplanar with the bottom surface of the insulating layer. The electrical connecting element is attached to the bottom surface of the metal layer through a seed layer.

Abstract: Disclosed are a method and a device for acquiring the fetal fraction of cfDNA, a storage medium and an electronic device. The method comprises: acquiring sequencing data of a sample taken from a mother pregnant with a fetus; establishing a joint probability distribution model of the maternal and fetal genotypes, the joint probability distribution model containing one or more factors affecting the read heterozygosity, the percentage of the read heterozygosity being the ratio of the number of SNPs covered by different bases to the total number of SNPs covered by more than one reads in the sequencing data; substituting the values of the one or more factors and of the acquired read heterozygosity into the established joint probability distribution model; and obtaining the fetal fraction of cfDNA by maximum likelihood estimation of the joint probability distribution model.

Abstract: An electronic device includes an insulating layer, a metal layer and at least one electrical connecting element. The insulating layer has a top surface and a bottom surface opposite to the top surface, and defines an opening extending between the top surface and the bottom surface. The metal layer is disposed in the opening of the insulating layer and has a top surface and a bottom surface opposite to the top surface. The bottom surface of the metal layer is substantially coplanar with the bottom surface of the insulating layer. The electrical connecting element is attached to the bottom surface of the metal layer through a seed layer.

Abstract: The present invention relates to methods and uses for the detection or quantification of newly-synthesized double-stranded target nucleic acid molecules in a sample during quantitative real-time polymerase chain reaction (qPCR) amplification. According to the invention, an intercalating dye recognizing double-stranded DNA molecules with higher affinity than single-stranded DNA molecules and a fluorophore-labeled oligonucleotide-probe being sequence specific for a target nucleic acid molecule are simultaneously employed, thus enabling quantification a specific target and total amount of a mixed nucleic acid population, and enabling assessing the cause of suboptimal PCR performance.

Abstract: An electrical connector is provided for a mating connector to be inserted thereto. The electrical connector includes an insulating body having a tongue, and multiple terminals. A middle grounding sheet is located between the terminals in upper and lower rows, and has at least one first through hole. Each of left and right sides of the middle grounding sheet has a latch slot and a notch. The insulating body has a first insulating post entering the first through hole and a second insulating post entering the notch. A dimension of the second insulating post is larger than a dimension of the first insulating post. A metal shell frames outside the insulating body to form an insertion space. A first clearance between a first protruding portion and a shielding casing of the mating connector is more than or equal to 0.001 mm and less than or equal to 0.0449 mm.

Abstract: A semiconductor package includes a semiconductor die, a plurality of conductive bumps, a shielding layer, an encapsulant and a redistribution layer. The semiconductor die has an active surface, a backside surface and a lateral surface. The conductive bumps are disposed on the active surface of the semiconductor die. The shielding layer is disposed on the lateral surface of the semiconductor die. The encapsulant covers the shielding layer, and has a first surface and a second surface opposite to the first surface. The redistribution layer is disposed on the first surface of the encapsulant and electrically connected to the semiconductor die through the conductive bumps. The shielding layer is electrically connected to the redistribution layer.

Abstract: A semiconductor package device comprises a circuit layer, an electronic component disposed on the circuit layer, a package element and a first encapsulant. The package element is disposed on the circuit layer. The package element includes at least two electrical contacts electrically connected to the circuit layer. The first encapsulant is disposed on the circuit layer. The first encapsulant encapsulates the electronic component and the package element and exposes the electrical contacts of the package element.

Abstract: An electrical connector includes an insulation body, at least one first terminal and at least one second terminal, and a middle grounding plate. The insulation body has a base and a tongue located in a front end of the base. The first terminal and the second terminal are arranged in the base in an upper row and a lower row, and exposed to an upper surface and a lower surface of the tongue. The middle grounding plate has a body portion fixed to the tongue, and located between the first terminal and the second terminal, the first terminal has a first front edge, the second terminal has a second front edge, and the first front edge, the second front edge and an edge in a front end of the body portion are located in a same vertical plane.

Abstract: A mating connector includes a plastic body, which has a main body and an insertion portion formed by extending forward from the main body. A mating space is concavely formed backward from a front end surface of the insertion portion. The insertion portion has a side wall located at a periphery of the mating space and running through the mating space to form at least two through-holes, and the two through-holes do not communicate with each other. A metal cover surrounds the plastic body and is fastened to the main body. A grounding sheet is located between the metal cover and the side wall. The grounding sheet has a body and at least two elastic portions formed by bending forward from the body. The body covers the side wall, and each of the elastic portions is accommodated in a corresponding through-hole and enters the mating space.

Abstract: The present invention is directed to novel methods, kits and uses to be employed for the generation of tagged DNA fragments of a target DNA and nucleic acid molecules associated therewith

Abstract: The present invention relates to methods and uses where a combination of (i) an enzyme exhibiting 5??3? exonuclease activity and specifically degrading 5?-phosphorylated strands of double-stranded nucleic acids is used, and (ii) one or more primer pair(s), each primer being 5? phosphorylated, in a method comprising at least a first and a second amplification reaction of a first and a second template, respectively, for preventing contamination of the second amplification reaction with amplification products of the first amplification reaction, as well as novel methods and kits using the combination. Also, the present invention relates to kits comprising the enzyme and either 5?-phosphorylated primers or a polynucleotide kinase.

Abstract: The objective of the present invention is to provide a negative electrode for a nonaqueous-electrolyte secondary cell, the negative electrode being predoped by immersion in a solution containing ions of an alkali metal and a catalyst, wherein the weight and volume of the negative electrode tend not to increase due to the predoping, and it is possible to further increase initial charge/discharge efficiency.

Abstract: An electrical connector used for mating a mating connector includes an insulation body having a base portion and a tongue extending from the base portion, terminals fixedly disposed in the base portion and grouped into an upper row and a lower row, and a middle shielding sheet embedded in the tongue and located between the upper and lower rows. The tongue has upper and lower surfaces arranged opposite to each other, and a front surface connected to the upper and lower surfaces. The upper and lower rows of terminals are exposed on the upper and lower, respectively. The middle shielding sheet has a front end surface extending out of the front surface, a slot formed on the front end surface, and a first projection portion extending into the slot, overlapping a central line of the middle shielding sheet along a longitudinal direction, and located behind the front surface.

Abstract: An electrical connector includes an insulation body. Multiple terminals are fixed on the insulation body in an upper row and a lower row. Each terminal has a soldering portion. The soldering portions are arranged in two rows in a front-rear direction. A middle shielding sheet is fixed on the insulation body, and has a planar plate portion. A baffle extends downward from a rear end of the plate portion and is located between the soldering portions in the two rows. The plate portion extends horizontally in a lateral direction to form a connecting portion, which is in front of the rear end of the plate portion. A rear edge of the connecting portion bends downward to form a leg. In the front-rear direction, a distance between the rear end of the plate portion and the rear edge of the connecting portion is greater than a width of the connecting portion.