Abstract: A three-wheeled golf pushcart that combines the usage and benefits of a conventional pushcart and golf bag into a single piece of equipment. The cart comprises a collapsible three wheeled configuration and push bar. These collapsible mechanisms enable the cart to be transformed into two positions: folded or extended. The cart is also equipped with a plurality of golf club slots strategically formed into a V-shaped. In addition to the caddy console and accessories tray, removable storage compartments are also added to the perimeter of the cart's body for additional storage room. In an extended position, the cart is designed to be used for walking similar to using a “pushcart and bag combination”. In a folded position, the cart is compact and designed to fit securely onto the back of a motorized cart for riding, similar to a conventional golf bag. This compact folded position also makes it ideal for handling and stowing.

Abstract: An intraluminal apparatus including a catheter and device is positionable at a junction of afferent and efferent vessels of a bifurcation having an aneurysm. After positioning the device to substantially conform the device to the shape of the junction, the device acts as a scaffolding to inhibit herniation of objects out of the aneurysm and the device permits perfusion to the efferent vessels. Positioning the device may include deployment and optional release from a catheter. Embolic material may be inserted in the aneurysm before or after positioning the device. The device may have a proximal end, a distal end, and a plurality of filaments extending between and coupled at the proximal end and the distal end. The device may include a central filament configured to reshape the device. The distal end of the device may include a covering. The device may be football shaped, pumpkin shaped, or acorn shaped.

Abstract: An IC assembly including an exposed pad integrated circuit (“IC”) package having a thermal pad with a top surface and a bottom surface and with at least one peripheral surface portion extending transversely of and continuous with the bottom surface. The bottom surface and the at least one peripheral surface are exposed through a layer of mold compound. Also, methods of making an exposed pad integrated circuit (“IC”) package assembly. One method includes optically inspecting a solder bond bonding a thermal pad of an exposed pad IC package to a printed circuit board. Another method includes wave soldering an exposed pad of an IC package to a printed circuit board.

Abstract: A semiconductor device comprising a stack of semiconductor chips. The semiconductor chips have an electrically active side and an opposite electrically inactive side. The active sides bordered by an edge having first lengths and the inactive sides bordered by a parallel edge having a second lengths smaller than the first lengths. A substrate has an assembly pad bordered by a linear edge having a third length equal to or smaller than the first lengths. The inactive chip side attached to the pad so that the edge of the first lengths are parallel to the edge of the third length. The active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first lengths.

Abstract: A method of reducing blood flow within an aneurysm includes: injecting a contrast agent into a blood vessel including an aneurysm; deploying an occlusion device across the aneurysm; producing an image of the aneurysm including the contrast agent; and withdrawing the delivery device from the vessel after observing that the aneurysm has been obstructed by a desired amount. The image may be two-dimensional or three-dimensional. Observing that the aneurysm has been obstructed may include determining a degree of obstruction, for example by comparing an area or volume of the contrast agent in a first image and a second image. The desired amount may be a certain degree of obstruction, identification of a shape indicative of stasis such as a flat surface, an approximate hemisphere, a mushroom, or a crescent. If the occlusion device does not achieve the desired amount, a second occluding device may be deployed.

Abstract: Devices, such as medical devices for inhibiting conception, and methods of using and/or making these devices. In one aspect of the disclosure, a medical device has a delivery system and a first insert, which is removably coupled to the delivery system and which is designed to be deployed within a portion of a first fallopian tube, and a second insert, which is removably coupled to the delivery system and which is designed to be deployed within a portion of a second fallopian tube. Other aspects of the disclosure include, among other things, inserts made from one or more polymers; inserts which are designed to pierce and remain in place; and inserts which are implanted through a fluid delivery system.

Abstract: A semiconductor device (200) comprising a semiconductor chip (201) has an electrically active side (201a) and an opposite electrically inactive side (201b); the active side bordered by an edge having a first length (202a), and the inactive side bordered by a parallel edge having a second length (202b) smaller than the first length; a substrate has an assembly pad (210) bordered by a linear edge having a third length (210a) equal to or smaller than the first length; the inactive chip side attached to the pad so that the edge of the first length is parallel to the edge of the third length; the active side of the attached chip forms an overhang over the pad, when the third length is smaller than the first length.

Abstract: A method of forming packaged semiconductor devices includes providing a lead frame sheet of flat no-lead lead frames having a semiconductor die on a die pad, terminals, and plastic encapsulation except on a back side of the sheet to provide an exposed thermal die pad and exposed back sides of the terminals. Partial sawing in saw lanes begins from the back side through the terminals terminating within the plastic encapsulation to provide exposed side walls of the terminals and of the plastic encapsulation. The exposed thermal pad and exposed back side of the terminals are all shorted together to form exposed electrically interconnected metal surfaces (interconnected surfaces). The interconnected surfaces are electroplated with a solder wetable metal or metal alloy plating layer. The interconnected surfaces are decoupled. A second sawing in the saw lanes finishes sawing through the plastic encapsulation to provide singulation, forming a plurality of packaged semiconductor devices.

Abstract: A system and method for deploying an occluding device that can be used to remodel an aneurysm within the vessel by, for example, neck reconstruction or balloon remodeling. The system comprises an introducer sheath and an assembly for carrying the occluding device. The assembly includes an elongated flexible member having an occluding device retaining member for receiving a first end of the occluding device, a proximally positioned retaining member for engaging a second end of the occluding device and a support surrounding a portion of the elongated flexible member over which the occluding device can be positioned.

Abstract: A semiconductor device has a leadframe with a pad and a row of elongated leads with a solderable surfaces in a common plane; a package encapsulating the leadframe with an assembled semiconductor device, leaving the common-plane lead surfaces un-encapsulated and coplanar with the package material between adjacent leads, the row of aligned leads positioned along a package edge; and grooves in the package material cut in the common-plane surface, the grooves extend along a portion of each lead length, have a width and a depth about twice the width, and expose solderable lead surfaces.

Abstract: Devices, such as medical devices for inhibiting conception, and methods of using and/or making these devices. In one aspect of the disclosure, a medical device has a delivery system and a first insert, which is removably coupled to the delivery system and which is designed to be deployed within a portion of a first fallopian tube, and a second insert, which is removably coupled to the delivery system and which is designed to be deployed within a portion of a second fallopian tube. Other aspects of the disclosure include, among other things, inserts made from one or more polymers; inserts which are designed to pierce and remain in place; and inserts which are implanted through a fluid delivery system.

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. The pads, leads, and fingers connected to a board using a layer of solder for attaching the proximity sensor.

Abstract: A vascular remodeling device is provided. The device has an anchor portion, sized for deployment in a blood vessel, that is radially expandable from a collapsed state to an expanded state. The device also includes a distal portion sized for deployment in a blood vessel. The distal portion is radially expandable from a collapsed state to an expanded state and has a distal face that is sufficiently occlusive in the distal-to-proximal direction to perform a therapeutic blocking function in an aneurysm neck. The device also has an intermediate portion that interconnects a distal end of the anchor portion and a proximal end of the distal portion. In some embodiments, the anchor portion and/or distal portion has a plurality of interconnected struts.

Abstract: A method for fabricating a semiconductor device package provides a metallic leadframes with a plurality of device sites. Each site including a pad and a plurality of leads with solderable surfaces. At least one set of leads are aligned in a row and are connected by rails to respective leads of an adjacent site. The leads and rails of the row having a surface in a common plane. The strip with the assembled sites and connecting rails are encapsulated in a packaging material, leaving the common-plane lead and rail surfaces un-encapsulated. Trenches are cut between adjacent sites by removing packaging material until reaching the rails. Thus, creating sidewalls of device packages connected by rails. Device packages are singulated from the strip by severing the connecting rails between adjacent sites in approximate halves, leaving a respective rail half as a straight protrusion attached to each lead. The protrusions are bent at an angle away from the common plane towards the package sidewall.

Abstract: A semiconductor device has a leadframe with a pad and a row of elongated leads with a solderable surfaces in a common plane; a package encapsulating the leadframe with an assembled semiconductor device, leaving the common-plane lead surfaces un-encapsulated and coplanar with the package material between adjacent leads, the row of aligned leads positioned along a package edge; and grooves in the package material cut in the common-plane surface, the grooves extend along a portion of each lead length, have a width and a depth about twice the width, and expose solderable lead surfaces.

Abstract: Described herein are flexible implantable occluding devices that can, for example, navigate the tortuous vessels of the neurovasculature. The occluding devices can also conform to the shape of the tortuous vessels of the vasculature. In some embodiments, the occluding devices can direct blood flow within a vessel away from an aneurysm or limit blood flow to the aneurysm. Some embodiments describe methods and apparatus for adjusting, along a length of the device, the porosity of the occluding device. In some embodiments, the occluding devices allows adequate blood flow to be provided to adjacent structures such that those structures, whether they are branch vessels or oxygen-demanding tissues, are not deprived of the necessary blood flow.

Abstract: A vascular occluding device for modifying blood flow in a vessel, while maintaining blood flow to the surrounding tissue. The occluding device includes a flexible, easily compressible and bendable occluding device that is particularly suited for treating aneurysms in the brain. The neurovascular occluding device can be deployed using a micro-catheter. The occluding device can be formed by braiding wires in a helical fashion and can have varying lattice densities along the length of the occluding device. The occluding device could also have different lattice densities for surfaces on the same radial plane.

Abstract: A method of reducing blood flow within an aneurysm includes: injecting a contrast agent into a blood vessel including an aneurysm; deploying an occlusion device across the aneurysm; producing an image of the aneurysm including the contrast agent; and withdrawing the delivery device from the vessel after observing that the aneurysm has been obstructed by a desired amount. The image may be two-dimensional or three-dimensional. Observing that the aneurysm has been obstructed may include determining a degree of obstruction, for example by comparing an area or volume of the contrast agent in a first image and a second image. The desired amount may be a certain degree of obstruction, identification of a shape indicative of stasis such as a flat surface, an approximate hemisphere, a mushroom, or a crescent. If the occlusion device does not achieve the desired amount, a second occluding device may be deployed.

Abstract: A method for fabricating a semiconductor proximity sensor includes providing a flat leadframe with a first and a second surface. The second surface is solderable. The leadframe includes a first and a second pad, a plurality of leads, and fingers framing the first pad. The fingers are spaced from the first pad by a gap which is filled with a clear molding compound. A light-emitting diode (LED) chip is assembled on the first pad and encapsulated by a first volume of the clear compound. The first volume outlined as a first lens. A sensor chip is assembled on the second pad and encapsulated by a second volume of the clear compound. The second volume outlined as a second lens. Opaque molding compound fills the space between the first and second volumes of clear compound, forms shutters for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED.

Abstract: A cart that combines the utilities of a conventional three-wheeled pushcart and golf bag into a single piece of equipment. The cart comprises a collapsible three wheeled configuration and push bar. These collapsible mechanisms enable the cart to be transformed into two positions: folded or extended. The cart is also equipped with 14 individual slots (pipes) for holding a standard set of golf clubs. Two tool belts are also attached to each side of the cart for personal storage. In an extended position, the cart is designed to be used for walking as one would when using a “pushcart and bag combination”. In a folded position, the cart can be mounted securely onto the back of a motorized cart for riding, similar to a conventional golf bag. This compact folded position is also intended for the purpose and convenience of storage.