Abstract: An item picking and replenishment method is provided. According to the item picking and replenishment method, an item position corresponding to at least one item is output according to an order by a host, and the item position is received by a processing unit of a picking vehicle. A moving signal is generated by the processing unit according to a current position of the picking vehicle and the item position. A rotary encoder of the picking vehicle is used to move the picking vehicle to the item position according to the moving signal. The item is obtained from a shelf by an insertion fork of the picking vehicle. The insertion fork is disposed on a placement layer of a placement shelf, and the placement layer is a tilted layer.

Abstract: A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.

Abstract: A picking rack is provided, including a frame having at least one inclined pallet. The inclined pallet includes a pair of fork plates for picking up goods and a blocking mechanism for fixing loaded goods to the inclined pallet. Therefore, the labor cost of picking up goods is reduced, and the goods picking up efficiency is increased.

Abstract: A USV comprises a buoyant hull structure; an MCU coupled to the buoyant hull structure; a VHF radio coupled to the buoyant hull structure; a satellite radio coupled to the buoyant hull structure; a GPS coupled to the buoyant hull structure; a plurality of weather sensors coupled to the buoyant hull structure; a navigation and propulsion controller coupled to the buoyant hull structure; at least one thruster coupled to the buoyant hull structure and configured to provide propulsion; a battery coupled to the buoyant hull structure; a charge controller coupled to the buoyant hull structure; and a solar panel coupled to the buoyant hull structure and configured to charge the battery.

Abstract: A display panel and a pixel circuit thereof are provided. The display panel includes a plurality of gate lines, a plurality of data lines, and a plurality of pixel circuits. Each of the pixel circuits is coupled to corresponding gate line and data line. Each of the pixel circuits includes a first gate line and a pull-low switch. The first gate line is coupled to a control terminal of a driving transistor, and provides a first gate signal to drive the driving transistor during a driving time period. The pull-low switch pulls low the first gate signal to a reference low voltage according to a second gate signal on a second gate line when the driving time period finishes.

Abstract: A method for forming a 3D memory device is disclosed. The method includes: forming an alternating dielectric stack on a substrate; forming a plurality of channel holes penetrating the alternating dielectric stack; forming a channel structure in each channel hole; forming a channel column structure on the channel structure in each channel hole; trimming an upper portion of each channel column structure to form a channel plug; and forming a top selective gate cut between neighboring channel plugs.

Abstract: A conductive structure includes a first wire, a second wire, and a conductive pillar. The second wire is disposed over the first wire and intersected with the first wire. The conductive pillar is disposed between the first wire and the second wire. A bottom surface area of the conductive pillar is greater than an area at which the first wire overlaps the conductive pillar.

Abstract: A pixel structure includes a first, second and third electrode layers and a switch element. The second electrode layer is disposed above the first electrode layer and includes a first and second main body portions and a first and second branch portions. The first main body portion and the first branch portion extend in a first direction. The first branch portion protrudes from the first to second main body portion. The second branch portion protrudes from the second to first main body portion. The third electrode layer is disposed above the second electrode layer and includes a third and fourth main body portion and a third branch portion. The third and fourth main body portions extend in the first direction. The third branch portion connects the third to fourth main body portion. The switch element is electrically connected to the first or third electrode layer.

Abstract: A red light emitting diode including an epitaxial stacked layer, a first and a second electrodes and a first and a second electrode pads is provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and a light emitting layer. A main light emitting wavelength of the light emitting layer falls in a red light range. The epitaxial stacked layer has a first side adjacent to the first semiconductor layer and a second side adjacent to the second semiconductor layer. The first and the second electrodes are respectively electrically connected to the first-type and the second-type semiconductor layers, and respectively located to the first and the second sides. The first and a second electrode pads are respectively disposed on the first and the second electrodes and respectively electrically connected to the first and the second electrodes. The first and the second electrode pads are located at the first side of the epitaxial stacked layer.

Abstract: A picking rack is provided, including a frame having at least one inclined pallet. The inclined pallet includes a pair of fork plates for picking up goods and a blocking mechanism for fixing loaded goods to the inclined pallet. Therefore, the labor cost of picking up goods is reduced, and the goods picking up efficiency is increased.

Abstract: A system for detecting electronic components includes a light-source device, a photography device, an adjustment device, and an image-processing device. The light-source device generates a light to illuminate at least one pin of a first electronic component at different rotation angles. The photography device senses the light and generates first and second images corresponding to the pin of the first electronic component at different rotation angles. The adjustment device adjusts the photography device and the light-source device to a first height and a second height, wherein the first images correspond to the first height and the second images correspond to the second height. The image-processing device calculates first feature information of the pin of the first electronic component according the first and second images, and analyzes the state of the pin of the first electronic component according to the first feature information.

Abstract: A method for forming a 3D memory device is disclosed. The method includes: forming an alternating dielectric stack on a substrate; forming a plurality of channel holes penetrating the alternating dielectric stack; forming a channel structure in each channel hole; forming a channel column structure on the channel structure in each channel hole; trimming an upper portion of each channel column structure to form a channel plug; and forming a top selective gate cut between neighboring channel plugs.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes a staircase structure disposed over a substrate. The staircase structure includes a plurality of layer stacks, where each layer stack is made of a first material layer over a portion of a second material layer. The staircase structure further includes a plurality of landing pads. where each landing pad is disposed over another portion of the second material layer of a respective layer stack.

Abstract: A pixel structure including a substrate, a signal line, a plurality of pixel units and a light blocking pattern layer is provided. The signal line is disposed on the substrate and has opposing first and second sides. Two adjacent pixel units are disposed respectively on the first side and the second side of the signal line. Each pixel units includes an active device, a common electrode, an insulating layer, and a pixel electrode. The insulating layer is located on the common electrode. The pixel electrode is located on the insulating layer and is electrically connected to the active device. The pixel electrode includes an edge strip electrode and a plurality of extension electrodes. The extension electrodes respectively extend from the edge strip electrode toward the signal line. The light blocking pattern layer is located between two adjacent pixel units, and the light blocking pattern layer and the signal line overlap with each other.

Abstract: A light emitting diode and manufacturing method thereof are provided. The light emitting diode includes a first-type semiconductor layer, a light emitting layer, a second-type semiconductor layer, a first metal layer, a first current conducting layer, a first bonding layer and a second current conducting layer. The light emitting layer is located between the first-type semiconductor layer and the second-type semiconductor layer. The first metal layer is located on and electrically connected to the first-type semiconductor layer. The first metal layer is located between the first current conducting layer and the first-type semiconductor layer. The first current conducting layer is located between the first bonding layer and the first metal layer. The first current conducting layer is connected to the first-type semiconductor layer by the first current conducting layer and the first metal layer. The first bonding layer has through holes overlapped with the first metal layer.

Abstract: The invention provides an LED including a first-type semiconductor layer, an emitting layer, a second-type semiconductor layer, a first electrode, a second electrode, a Bragg reflector structure, a conductive layer and insulation patterns. The first electrode and the second electrode are located on the same side of the Bragg reflector structure. The conductive layer is disposed between the Bragg reflector structure and the second-type semiconductor layer. The insulation patterns are disposed between the conductive layer and the second-type semiconductor layer. Each insulating layer has a first surface facing toward the second-type semiconductor layer, a second surface facing away from the second-type semiconductor layer, and an inclined surface. The inclined surface connects the first surface and the second surface and is inclined with respect to the first surface and the second surface.

Abstract: A light emitting diode (LED) including an epitaxial stacked layer, first and second reflective layers which are disposed at two sides of the epitaxial stacked layer, a current conducting layer and first and second electrodes and a manufacturing thereof are provided. The epitaxial stacked layer includes a first-type and a second-type semiconductor layers and an active layer. A main light emitting surface with a light transmittance >0% and ?10% is formed on one of the two reflective layers. The current conducting layer contacts the second-type semiconductor layer. The first electrode is electrically connected to the first-type semiconductor layer. The second electrode is electrically connected to the second-type semiconductor layer via the current conducting layer. A contact scope of the current conducting layer and the second-type semiconductor layer is served as a light-emitting scope overlapping the two layers, but not overlapping the two electrodes.

Abstract: A pixel structure includes a first, second and third electrode layers and a switch element. The second electrode layer is disposed above the first electrode layer and includes a first and second main body portions and a first and second branch portions. The first main body portion and the first branch portion extend in a first direction. The first branch portion protrudes from the first to second main body portion. The second branch portion protrudes from the second to first main body portion. The third electrode layer is disposed above the second electrode layer and includes a third and fourth main body portion and a third branch portion. The third and fourth main body portions extend in the first direction. The third branch portion connects the third to fourth main body portion. The switch element is electrically connected to the first or third electrode layer.

Abstract: An electronic-component assembly system is provided in the invention. The electronic-component assembly system includes a gripping device, a light-source device, a photographing device, and an image-processing device. The gripping device grips an electronic component, wherein the electronic component includes at least one pin. The light-source device includes a light source and emits light of the light source. The photographing device senses the light and generates a plurality of first one-dimensional images corresponding to the pins at different rotation angles. The image-processing device is coupled to the photographing device to receive the plurality of first one-dimensional images.

Abstract: A calibration system for robot tool including a robot arm adopting a first coordinate system, a tool arranged on a flange of the robot arm, and an imaging device adopting a second coordinate system is disclosed, wherein an image sensing area is established by the image device. A calibration method is also disclosed and includes steps of: controlling the robot arm to move for leading a tool working point (TWP) of the tool enters the image sensing area; recording a current gesture of the robot arm as well as a specific coordinate of the TWP currently in the second coordinate system; obtaining a transformation matrix previously established for describing a relationship between the first and the second coordinate systems; and importing the specific coordinate and the current gesture to the transformation matrix for calculating an absolute position of the TWP in the first coordinate system.