Abstract: A nonvolatile memory device including a mold structure including a plurality of gate electrodes on a substrate, the plurality of gate electrodes including first, second, and third string selection lines sequentially stacked on the substrate; a channel structure that penetrates the mold structure and intersects each of the gate electrodes; a first cutting region that cuts each of the gate electrodes; a second cutting region that is spaced apart from the first cutting region in a first direction and cuts each of the gate electrodes; a first cutting line that cuts the first string selection line between the first cutting region and the second cutting region; a second cutting line that cuts the second string selection line between the first cutting region and the second cutting region; and a third cutting line that cuts the third string selection line between the first cutting region and the second cutting region.

Abstract: A pouch forming device is provided. The pouch forming device comprises a die member including a die on which a pouch film is disposed on a top surface thereof, in which a forming part is formed, and a die holder to which the die is fixed, a stripper member that presses and fixes the pouch film disposed on the die when descending and a first driving piece to move the stripper vertically, a punch member including a punch plate comprising a punch configured to be inserted into the forming part to form an electrode assembly accommodation part in the pouch film and a second driving piece to move the punch plate vertically, and a control member that controls the first driving piece to allow the stripper to ascend when the punch is inserted into the forming part to decrease a pressing force applied to the pouch film.

Abstract: A semiconductor package including: a chip having a first surface and a second surface; a mold configured to encapsulate the chip; a vertical conductive channel electrically connected to a pad formed on the second surface of the chip while passing through the mold; a wiring pattern electrically connected to a pad formed on the first surface of the chip and configured to perform electrical connection in the package; an optical device arranged on a surface of the semiconductor package to be electrically connected to the vertical conductive channel; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.

Abstract: A pouch forming device is provided. The pouch forming device comprises a die member including a die on which a pouch film is disposed on a top surface thereof, in which a forming part is formed, and a die holder to which the die is fixed, a stripper member that presses and fixes the pouch film disposed on the die when descending and a first driving piece to move the stripper vertically, a punch member including a punch plate comprising a punch configured to be inserted into the forming part to form an electrode assembly accommodation part in the pouch film and a second driving piece to move the punch plate vertically, and a control member that controls the first driving piece to allow the stripper to ascend when the punch is inserted into the forming part to decrease a pressing force applied to the pouch film.

Abstract: A pouch forming method and a pouch forming device are provided. In particular, the pouch forming method for forming an accommodation part that accommodates an electrode assembly in a pouch sheet includes a seating process of seating the pouch sheet on a top surface of a lower die in which a forming groove is formed in an upper portion thereof. In a vacuum elongation process, a lower portion of the pouch sheet, in which the accommodation part is formed, is elongated by vacuum, and in an accommodation part formation process, the portion of the pouch sheet, which is elongated by the vacuum, is pressed by a punch disposed above the pouch sheet in a direction in which the forming groove is formed to form the accommodation part.

Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: In an information processing method performed in a first gateway device among a plurality of gateway devices for managing a plurality of nodes, a current characteristic value recorded in a first node of the plurality of nodes is replaced with a new characteristic value. Then, a database is updated so that the database stores new information on the first node to which the new characteristic value is reflected. The new information on the first node is transmitted to another gateway device of the plurality of gateway devices.

Abstract: A method for controlling a vehicle installed with an automatic transmission, includes: a sudden stop determination step in which a controller determines whether the vehicle has stopped at a speed greater than or equal to a reference deceleration speed and whether a post-stop elapsed time is within a first reference time; a takeoff determination step in which the controller determines whether an input torque of the transmission exceeds zero within the first reference time when a shift range is in a driving range; a pressure control step in which, when the vehicle takes off, the controller elevates a line pressure of the transmission; a limitation determination step in which if a slippage extent of a turbine exceeds a reference slippage value for a second reference time, the controller limits the takeoff; and a torque reduction step in which the controller reduces a takeoff torque input of the transmission.

Abstract: Disclosed is an apparatus and method of processing substrate, wherein the apparatus comprises a process chamber; a substrate supporter for supporting at least one of substrates, wherein the substrate supporter is provided in the process chamber, and is rotated at a predetermined direction; a chamber lid confronting with the substrate supporter, the chamber lid for covering the process chamber; and a gas distributor having a plurality of gas distribution modules for distributing gas to the substrate, wherein the plurality of gas distribution modules are connected to the chamber lid, wherein each of the gas distribution modules includes a power source electrode and a ground electrode confronting each other, a plasma discharge space is formed between the power source electrode and the ground electrode, and the plasma discharge space is not overlapped with a thin film formation region of the substrate supported by the substrate supporter.

Abstract: A semiconductor package including: a chip having a first surface; a mold having a first surface and a second surface configured to encapsulate the chip; a conduction structure electrically connecting the first surface and the second surface of the mold; an optical device arranged on the first surface of the mold to be electrically connected to the conduction structure; a wiring pattern configured to electrically connect the conduction structure and a pad formed on the first surface of the chip, and perform electrical connection in the semiconductor package; and an external connection terminal configured to electrically connect the semiconductor package to the outside.

Abstract: An apparatus and a method for controlling a driving mode of a vehicle are provided. The apparatus includes a mode converter that converts the driving mode of the vehicle based on an operation of a mode conversion input. When the driving mode is converted into a custom mode, a mode setting screen for adjusting a setting value of a driving characteristic preset is configured and the configured mode setting screen is displayed on a display of the vehicle. A tuning device then tunes a driving characteristic of the custom mode based on a setting value adjusted on the mode setting screen.

Abstract: A system and a method of controlling a hybrid electric vehicle shift are disclosed. The system includes an engine and a drive motor operating as power sources and a transmission receiving driving torque from one of the engine and the drive motor. A data detector detects a state data for operating the transmission. A vehicle controller calculates a creep torque and an engine setting torque using the state data, determines whether a shift control condition is satisfied based on a position value of an accelerator pedal, calculates an available motor torque using a motor speed at an actual shift start point and a target motor speed when the shift control condition is satisfied, and calculates a first shift input torque using the creep torque, the engine setting torque, the available motor torque, and a first torque apply ratio. The transmission is operated based on the first shift input torque.

Abstract: A semiconductor package including: a chip including a pad; an optical device including a pad; a mold configured to encapsulate the optical device and the chip; a wiring pattern configured to electrically connect the optical device and the chip; and an external connection terminal configured to electrically connect the semiconductor package to the outside. The chip includes at least one of: an amplifier circuit configured to process an electrical signal supplied from the optical device; and a driver circuit configured to supply the electrical signal to the optical device.

Abstract: A deposition apparatus includes: a substrate support having a main surface on which a substrate is placed; a body disposed on the main surface and including a hollow portion having an exposed upper portion; a plasma electrode unit provided at a inner circumferential surface of the body to separate the hollow portion into an upper space and a lower space; and a gas supply unit supplying process gas to the plasma electrode unit, wherein a gas exhaust channel extending from the lower space to an exhaust outlet provided at a top of the body is formed in the body.

Abstract: The present disclosure relates to an apparatus for processing a substrate, and more particularly, to an apparatus for processing a substrate, which is capable of allowing a substrate processing gas to smoothly flow on the substrate. The apparatus for processing the substrate in accordance an exemplary embodiment may form a laminar flow through a gas supply unit disposed on one side of an inner reaction tube and an exhaust duct disposed on the other side of the inner reaction tube, which faces the gas supply unit, to extend up to the outside of an accommodation region of a pedestal in an accommodation space of the inner reaction tube and control a flow of a substrate processing gas supplied onto the substrate.

Abstract: Provided is a method of controlling a hybrid electric vehicle capable of improving acceleration response upon kick-down. The method includes calculating a rising gradient of a motor speed increasing during kick-down shift based on a present speed of a motor for driving the vehicle which is detected at a control unit in real time, upon detection of demand of kick-down shift due to acceleration operation of a driver, calculating a falling gradient of intervention torque based on the rising gradient of the motor speed at the control unit, determining an entry point of intervention control based on the present speed of the motor detected at the control unit in real time, and performing torque intervention control for controlling driving of the motor in order to output intervention torque, namely, motor torque decreased based on the falling gradient of intervention torque calculated from the determined entry point at the control unit.

Abstract: A system and a method of controlling a hybrid electric vehicle shift are disclosed. The system includes an engine and a drive motor operating as power sources and a transmission receiving driving torque from one of the engine and the drive motor. A data detector detects a state data for operating the transmission. A vehicle controller calculates a creep torque and an engine setting torque using the state data, determines whether a shift control condition is satisfied based on a position value of an accelerator pedal, calculates an available motor torque using a motor speed at an actual shift start point and a target motor speed when the shift control condition is satisfied, and calculates a first shift input torque using the creep torque, the engine setting torque, the available motor torque, and a first torque apply ratio. The transmission is operated based on the first shift input torque.

Abstract: Provided is a method of controlling a hybrid electric vehicle capable of improving acceleration response upon kick-down. The method includes calculating a rising gradient of a motor speed increasing during kick-down shift based on a present speed of a motor for driving the vehicle which is detected at a control unit in real time, upon detection of demand of kick-down shift due to acceleration operation of a driver, calculating a falling gradient of intervention torque based on the rising gradient of the motor speed at the control unit, determining an entry point of intervention control based on the present speed of the motor detected at the control unit in real time, and performing torque intervention control for controlling driving of the motor in order to output intervention torque, namely, motor torque decreased based on the falling gradient of intervention torque calculated from the determined entry point at the control unit.

Abstract: A semiconductor package including: a chip including a pad; an optical device including a pad; a mold configured to encapsulate the optical device and the chip; a wiring pattern configured to electrically connect the optical device and the chip; and an external connection terminal configured to electrically connect the semiconductor package to the outside. The chip includes at least one of: an amplifier circuit configured to process an electrical signal supplied from the optical device; and a driver circuit configured to supply the electrical signal to the optical device.