Abstract: Embodiments of the present disclosure provide an electronic package assembly comprising a solder mask layer, the solder mask layer having at least one opening, and a plurality of pads coupled to the solder mask layer, wherein at least one pad of the plurality of pads includes (i) a first side, (ii) a second side, the first side being disposed opposite to the second side, (iii) a terminal portion and (iv) an extended portion, wherein the first side at the terminal portion is configured to receive a package interconnect structure through the at least one opening in the solder mask layer, the package interconnect structure to route electrical signals between a die and another electronic device that is external to the electronic package assembly, and wherein the second side at the extended portion is configured to receive one or more electrical connections from the die.

Abstract: A data access system including a storage device and a processor, which includes one or more levels of cache (LOC). In response to data required by the processor not being within the LOC, the processor generates a physical address to be accessed within the storage device in order to retrieve the data. The storage device includes a main memory and a cache module, which is configured as a final level of cache (FLOC) to be accessed by the processor prior to accessing the main memory. The cache module includes a controller that, in response to the data not being cached within the LOC, converts the physical address into a virtual address within the FLOC. The FLOC uses the virtual address to determine whether the data is within the FLOC. If the data is not within the FLOC, the cache module or the processor retrieves the data from the main memory.

Abstract: Embodiments of the present disclosure provide a method of making a metal-oxide semiconductor (MOS) device. The method comprises providing an apparatus that comprises a common source and drain well disposed within a substrate, and a gate disposed on the substrate, wherein the gate is substantially encapsulated within layers of the apparatus. The method further comprises removing a portion of the substrate and creating a shallow trench isolation (STI) structure through the substrate such that the STI structure engages the common source and drain well.

Abstract: Apparatuses having, and methods for forming, conductive features are described. A hole is formed in a substrate and a conductive material is deposited in the hole. A part of the conductive material that occupies a first lengthwise portion of the hole is removed, and a conductive feature that occupies a second lengthwise portion of the hole remains in the substrate.

Abstract: Aspects of the disclosure provide a circuit that includes a driver circuit and a current limiter circuit. The driver circuit is configured to drive a load with an output current when the load is coupled with the driver circuit. The current limiter circuit is configured to turn on a path to deplete a portion of the output current from the driver circuit in order to prevent a load current flowing through the load from exceeding a current limit.

Abstract: A data access system including a storage device and a processor, which includes one or more levels of cache (LOC). In response to data required by the processor not being within the LOC, the processor generates a physical address to be accessed within the storage device in order to retrieve the data. The storage device includes a main memory and a cache module, which is configured as a final level of cache (FLOC) to be accessed by the processor prior to accessing the main memory. The cache module includes a controller that, in response to the data not being cached within the LOC, converts the physical address into a virtual address within the FLOC. The FLOC uses the virtual address to determine whether the data is within the FLOC. If the data is not within the FLOC, the cache module or the processor retrieves the data from the main memory.

Abstract: Embodiments of the present disclosure provide a method that includes providing a semiconductor substrate comprising a semiconductor material, forming a dielectric layer on the semiconductor substrate, forming an interconnect layer on the dielectric layer, attaching a semiconductor die to the semiconductor substrate, and electrically coupling an active side of the semiconductor die to the interconnect layer, the interconnect layer to route electrical signals of the semiconductor die. Other embodiments may be described and/or claimed.

Abstract: A system including a first core to execute instructions associated with an application at a first speed based on a first instruction set and a second core to execute the instructions associated with the application at a second speed based on a second instruction set. The first speed is greater than the first speed. The second instruction set is a subset of the first instruction set. A first memory stores an operating system. The operating system includes a kernel that provides services to the application. A core switching module loads into a second memory after the operating system is booted, where the second memory is separate from the first memory, switches execution of the instructions associated with the application between the first core and the second core, and switches the execution of the instructions associated with the application between the first core and the second core transparently to the operating system.

Abstract: A differential power amplifier including a push-pull pair of transistors, a capacitance, a first inductance, and a second inductance. The push-pull pair of transistors includes first and second transistors. The first transistor includes control and output terminals. The second transistor includes input and control terminals. The control terminals of the first and second transistors collectively receive a differential input signal. The output and input terminals collectively provide a differential output signal. The capacitance is connected to the output and input terminals. The first capacitance cancels first harmonics at the output terminal of the first transistor with second harmonics at the input terminal of the second transistor. The first transistor and the first inductance are connected in series between a voltage source and a reference terminal. The second transistor and the second inductance are connected in series between the voltage source and the reference terminal.

Abstract: A system including a plurality of switches and a comparator. The plurality of switches is configured to respectively supply a plurality of currents via respective terminals to a plurality of sets of light emitting diodes. The sets of light emitting diodes are configured to respectively output light having wavelengths in a plurality of wavelength ranges in a spectrum of blue light. The comparator is configured to compare a reference voltage to a voltage at one of the terminals of one of the plurality of switches connected to one of the sets of light emitting diodes, and to adjust, based on the comparison, biasing of the plurality of switches to maintain a predetermined ratio of the plurality of currents.

Abstract: An integrated circuit package including a first substrate, a first die, a second die, a second substrate, and a system on chip. The first substrate includes a first portion including first connections, a second portion including no connections, a third portion including second connections, a first opening between the first portion and the second portion, and a second opening between the second portion and the third portion. The first die is arranged on the first substrate. The first die includes third connections to connect to the first connections via the first opening. The second die is arranged adjacent to the first die on the first substrate. The second die includes fourth connections to connect to the second connections via the second opening. The second substrate is connected to the first substrate. The system on chip is arranged on the second substrate between the first substrate and the second substrate.

Abstract: A system for configuring a semiconductor device to generate an output signal. The system includes a temperature sensor configured to sense a plurality of operating temperatures of the semiconductor device, the plurality of operating temperatures including at least a first operating temperature and a second operating temperature. A controller is configured to determine a plurality of operating frequencies of the output signal at respective operating temperatures of the plurality of operating temperatures. The plurality of operating frequencies include a first operating frequency of the output signal when the semiconductor device is at the first operating temperature and a second operating frequency of the output signal when the semiconductor device is at the second operating temperature. Memory is configured to store calibration information that associates each of the plurality of operating temperatures of the semiconductor device with respective operating frequencies of the plurality of operating frequencies.

Abstract: A circuit including: a die a first substrate and at least one active device; an integrated passive device including a first layer, a second substrate, a second layer and an inductance; and a third layer. The inductance includes vias and is an electrostatic discharge inductance. The vias are implemented in the second substrate. The inductance is implemented on the first layer, the second substrate, and the second layer. A resistivity per unit area of the second substrate is greater than a resistivity per unit area of the first substrate. The third layer is disposed between the die and the integrated passive device. The third layer includes pillars. The pillars respectively connect ends of the inductance to the at least one active device. The die, the integrated passive device and the third layer are disposed relative to each other to form a stack.

Abstract: A system includes a first amplifier stage and a second amplifier stage. The first amplifier stage is configured to amplify an input signal and generate first output signals. The first amplifier stage includes a common-source differential amplifier. The common-source differential amplifier includes a plurality of metal-oxide semiconductor field-effect transistors (MOSFETs) having source terminals connected to a common potential. The second amplifier stage includes a first differential amplifier and a second differential amplifier configured to respectively generate first and second differential outputs based on the first output signals. Each of the first and second differential amplifiers includes a plurality of MOSFETs having source terminals connected to the common potential via a respective balun.

Abstract: A system for delivering content to a network device comprises a content requesting interface that allows a user to select desired content from available content. A queue stores identifiers of the desired selected content. A remote content provider is located remote from the network device, communicates with the queue and transmits the desired selected content to the network device based on a sequence of the identifiers of the desired selected content stored in the queue and on at least one of usage and storage status data associated with received selected content stored on the network device. The storage status data includes at least one of a hidden status, an erased status, and an amount of the received selected content stored in the memory.

Abstract: A monitoring module monitors a charge level of a battery in a vehicle. A network interface module transmits a first set of charging parameters for charging the battery to a utility company and receives a reply and a charge return request from the utility company for returning charge from the battery to the utility company. The first set of charging parameters includes the charge level of the battery and a first time of the day for charging the battery. The reply includes a second time of the day for charging the battery. A control module generates a first signal based on the reply and the first set of charging parameters, and a second signal based on the charge return request and charge return parameters. A charging module charges the battery based on the first signal. A charge retrieval module returns the charge based on the second signal.

Abstract: A circuit including a tank circuit, a pair of transistors, a bias circuit, and a capacitor. The transistors include (i) drain terminals coupled to the tank circuit, (ii) source terminals coupled to each other, and (iii) gate terminals cross-coupled to the drain terminals via a pair of capacitors. The bias circuit is coupled to the gates of the pair of transistors to i) alternatingly turn on the pair of transistors during a plurality of peaks of an oscillating signal of the tank circuit, and ii) turn off the pair of transistors during a plurality of crossing points of the oscillating signal. The capacitor is coupled to (i) the tank circuit and (ii) the pair of transistors.

Abstract: A data access system including a processor having (i) one or more levels of cache, and (ii) a storage system that includes a main memory and a cache module. The cache module includes a controller and a final level of cache to be accessed by the controller prior to accessing the main memory. In response to data required by the processor not being cached within the one or more levels of cache of the processor, the processor generates an address of a physical location within the storage system. The controller converts the address of the physical location within the storage system into an address of a virtual location within the final level of cache. The address of the virtual location is useable by the cache module to determine whether the data required by the processor is cached within the final level of cache.

Abstract: A system includes a first light emitting diode configured to produce light of a first color and a second light emitting diode configured to produce light of a second color. A constant current circuit is configured to provide a first current, wherein (i) the first current is approximately constant, (ii) a first portion of the first current flows through the second light emitting diode, and (iii) a remaining portion of the first current flows through the first light emitting diode. A current regulating circuit is configured to control the first portion of the first current flowing through the second light emitting diode. The current regulating circuit is connected in series with the second light emitting diode, the constant current circuit, and a reference potential. The first light emitting diode is connected in series directly between the constant current circuit and the reference potential.

Abstract: A system includes a read/write module and a caching module. The read/write module is configured to access a first portion of a recording surface of a rotating storage device. Data is stored on the first portion of the recording surface of the rotating storage device at a first density. The caching module is configured to cache data on a second portion of the recording surface of the rotating storage device at a second density. The second portion of the recording surface of the rotating storage device is separate from the first portion of the recording surface of the rotating storage device. The second density is less than the first density.